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74LX1G03STR

STMicroelectronics

74LX1G03STR by STMicroelectronics

74LX1G03STR by STMicroelectronics is a CMOS logic gate with a propagation delay of just 4.2 ns and operates at supply voltages from 1.65V to 5.5V. It features an open-drain output and is ideal for low-power applications in compact designs. Its military-grade specs ensure reliability in extreme temperatures, ranging from -55 °C to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,245 parts In-Stock

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Digiode

USA . 1,234 parts In-Stock

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1,234

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Vyrian

USA . 238 parts In-Stock

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238

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Distributors (Availability)

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Native Components

USA . 32 parts In-Stock

1+ parts

$0.139

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$0.134

32

$0.139

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$0.134

Northwest PG Solutions

USA . 1,176 parts In-Stock

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$0.153

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$0.135

1,176

$0.153

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$0.135

IDEA Electronic Components Group

UK . 1,375 parts In-Stock

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$10.207

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-

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$9.187

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1,375

$10.207

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$9.187

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MKK Technologies

India . 1,740 parts In-Stock

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$19.194

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1,740

$19.194

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DigiPath Technology Company

USA . 1,740 parts In-Stock

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$19.194

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$19.194

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Microchip USA

USA . 354 parts In-Stock

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$24.874

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354

$24.874

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Ampacity Inc.

Singapore . 295 parts In-Stock

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$47.000

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$47.000

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Component Stockers USA

USA . 433 parts In-Stock

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$99.990

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$99.990

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Corphita

USA . 4,500 parts In-Stock

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4,500

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Parana Technologies

USA . 2,107 parts In-Stock

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$12.204

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$12.204

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Overview

Unlock superior performance with the 74LX1G03STR from STMicroelectronics, a leading name in high-quality semiconductor solutions. This low-power logic gate excels in demanding applications, delivering rapid response times and exceptional reliability. Perfect for automotive and industrial uses, it ensures your designs meet stringent standards while optimizing energy efficiency. Choose the 74LX1G03STR for cutting-edge technology that empowers your innovations today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 4.2 ns

A low propagation delay at nominal supply enables faster signal processing, enhancing overall performance in high-speed applications.

Surface Mount: YES

Surface mount capability allows for compact design and easy integration into modern circuit boards, saving space and enhancing manufacturability.

No. of Inputs: 2

With two inputs, this logic gate allows for versatile logic operations in various digital circuits, making it a flexible choice.

Package Shape: RECTANGULAR

The rectangular package shape enables efficient use of board space and simplifies layout design in PCB applications.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low nominal supply voltage is energy-efficient, making this product suitable for battery-powered and low-power applications.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF ensures stable operation in various circuits, accommodating a wide range of loads connected to the gate.

Power Supplies (V): 3.3

Compatible with a common power supply voltage of 3.3 V, facilitating easy integration into many digital systems.

No. of Terminals: 5

Five terminals offer ample connection options for reliable integration in various applications.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The low-profile package style is ideal for space-constrained applications, allowing for high-density PCB designs.

Maximum I (ol): 24 Amp

With a maximum output current of 24 A, this product can effectively drive significant loads, making it suitable for demanding applications.

Propagation Delay (tpd): 8.3 ns

A propagation delay of 8.3 ns provides efficient switching speeds, ensuring high performance in digital circuits.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows for use in more extreme environments, broadening application potential.

Output Characteristics: OPEN-DRAIN

Open-drain output characteristic enables versatile application in wired logic configurations and interfacing with multiple devices.

Minimum Operating Temperature: -55 °C

A minimum operating temperature of -55 °C ensures reliability in harsh environments, making this component ideal for military and aerospace applications.

Terminal Finish: TIN

The tin terminal finish provides good solderability and oxidation resistance, ensuring reliable connections in circuit boards.

Terminal Position: DUAL

Dual terminal positioning offers flexibility in PCB layout and enhances the ease of integration into various designs.

Maximum Seated Height: 1.45 mm

A low seated height contributes to a slimmer profile, making it suitable for low-profile device designs.

Width: 1.625 mm

A narrow width aids in compact PCB layouts and helps designers meet space constraints more effectively.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage capability enhances power efficiency and allows compatibility with a variety of power supply systems.

Length: 2.9 mm

A compact length enhances board space savings, making it ideal for miniature devices and high-density arrangements.

Temperature Grade: MILITARY

Military-grade specifications ensure high reliability and performance in critical applications, ideal for military and aerospace use.

Technology: CMOS

CMOS technology enables low power consumption and high noise immunity, making it an excellent choice for modern digital circuits.

Terminal Form: GULL WING

Gull wing terminal form provides effective soldering properties and facilitates automated assembly processes.

Packing Method: TR

Tape and Reel (TR) packing method simplifies automated assembly and handling, optimizing manufacturing efficiency.

Terminal Pitch: 0.95 mm

A 0.95 mm terminal pitch is suitable for compact designs while maintaining ease of soldering and connection.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5 V, this product offers versatility for different applications while ensuring device protection.

Technical Specifications

Logic Gates 74LX1G03STR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

TTL/H/L

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.2 ns

Propagation Delay (tpd):

8.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.625 mm

Trade Compliance

74LX1G03STR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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