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74LX1G03CTR

STMicroelectronics

74LX1G03CTR by STMicroelectronics

74LX1G03CTR by STMicroelectronics is a CMOS logic gate with a propagation delay of just 4.2 ns and operates at supply voltages from 1.65V to 5.5V. It features an open-drain output and is ideal for high-speed applications in compact designs. Its small outline package ensures efficient space utilization in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,319 parts In-Stock

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4,319

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Anansix

USA . 1,719 parts In-Stock

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Vyrian

USA . 68 parts In-Stock

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68

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IDEA Electronic Components Group

UK . 1,340 parts In-Stock

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$23.438

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$21.094

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$21.094

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MKK Technologies

India . 101 parts In-Stock

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$44.073

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DigiPath Technology Company

USA . 101 parts In-Stock

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$44.073

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Corphita

USA . 3,184 parts In-Stock

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Parana Technologies

USA . 1,763 parts In-Stock

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$28.024

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Northwest PG Solutions

USA . 1,345 parts In-Stock

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Native Components

USA . 795 parts In-Stock

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Overview

Unlock cutting-edge performance with the 74LX1G03CTR from STMicroelectronics, engineered for precision and reliability. This advanced logic gate operates seamlessly in diverse applications, from consumer electronics to industrial automation, all while boasting exceptional power efficiency and a compact design. Trust STMicroelectronics, a leader in innovation, to provide you with a product that enhances your projects with speed, robustness, and unmatched quality. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material, ensuring reliable performance in various environments.

Propagation Delay At Nominal Supply: 4.2 ns

Fast propagation delay, making it suitable for high-speed applications.

Surface Mount: YES

Allows for efficient and compact circuit designs, optimizing space on the PCB.

No. of Inputs: 2

Versatile input configuration for various logic functions, enhancing flexibility in circuit design.

Package Shape: RECTANGULAR

Standard shape facilitating easy integration into existing designs and layouts.

Nominal Supply Voltage / Vsup (V): 1.8

Low supply voltage, leading to reduced power consumption and improved battery life.

Load Capacitance (CL): 50 pF

Compatible with a variety of load conditions, enhancing circuit adaptability.

Power Supplies (V): 3.3

Standard voltage supply, enabling compatibility with a wide range of systems.

No. of Terminals: 5

Sufficient terminal count for necessary connections, ensuring easy integration.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style ideal for space-constrained applications.

Maximum I (ol): 24 Amp

High output current capability, suitable for driving heavy loads without performance issues.

Propagation Delay (tpd): 8.3 ns

Stable propagation timing, ensuring reliable signal integrity in fast switching applications.

Maximum Operating Temperature: 125 °C

High temperature tolerance, making it suitable for industrial and harsh environments.

Output Characteristics: OPEN-DRAIN

Flexible output configuration, allowing for wired-AND logic and easy interfacing with other devices.

Minimum Operating Temperature: -55 °C

Extreme low temperature operation, ideal for applications in cold environments.

Terminal Finish: MATTE TIN

Provides good solderability and resistance to oxidation, enhancing reliability.

Terminal Position: DUAL

Facilitates efficient mounting and connection on printed circuit boards.

Maximum Seated Height: 1.1 mm

Low profile design supports slim device profiles, tackling size constraints.

Width: 1.25 mm

Compact width allows for dense PCB layouts, increasing design options.

Minimum Supply Voltage (Vsup): 1.65 V

Supports versatile voltage range for various applications, improving design flexibility.

Length: 2 mm

Compact length ensures suitability for high-density circuit designs.

Temperature Grade: MILITARY

Certified for military applications, ensuring high reliability and performance standards.

Technology: CMOS

Low power technology that provides high noise immunity and high-speed operation.

Terminal Form: GULL WING

Standard terminal form that improves the ease of soldering and enhances mechanical stability.

Packing Method: TR

Tape and reel packaging enhances handling efficiency during assembly processes.

Terminal Pitch: 0.65 mm

Standard pitch enables compatibility with various PCB layouts and design tools.

Maximum Supply Voltage (Vsup): 5.5 V

Flexible maximum voltage, accommodating a wide range of applications and devices.

Technical Specifications

Logic Gates 74LX1G03CTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

TTL/H/L

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.2 ns

Propagation Delay (tpd):

8.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74LX1G03CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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