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SN74LVC1G06DBVR

Texas Instruments

SN74LVC1G06DBVR by Texas Instruments

SN74LVC1G06DBVR by Texas Instruments is a logic gate with 4.5 ns propagation delay, 3.3V nominal voltage, and 50 pF load capacitance. It is used in automotive applications for open-drain output characteristics, featuring a small outline package style and dual terminal position.

Median Price

$0.099

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1k+

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Newark

USA . 2 parts In-Stock

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Arrow

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DigiKey

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Mouser Electronics

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Chip1Stop

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Verical

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Element14

Singapore . 2,145 parts In-Stock

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Farnell

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Digiode

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Nova Conductors

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TME

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Component Electronics Inc.

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Atlantic Semiconductor

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Ampacity Inc.

Singapore . 7,992 parts In-Stock

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Semicontronic

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Corphita

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Advanced Electronics

New Zealand . 50 parts In-Stock

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Microchip USA

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Parana Technologies

USA . 1,460 parts In-Stock

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DigiPath Technology Company

USA . 1,651 parts In-Stock

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$20.598

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IDEA Electronic Components Group

UK . 2,314 parts In-Stock

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ChromeModa Solutions

Germany . 2,278 parts In-Stock

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Perfect Parts

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iodParts Technologies Inc.

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Overview

Upgrade your electronic projects with the SN74LVC1G06DBVR logic gate by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge solutions for a wide range of applications. This small outline, low profile package offers a fast propagation delay of 4.5 ns, making it ideal for high-speed designs. With a voltage supply of 3.3V and open-drain output characteristics, this logic gate provides exceptional performance while maintaining efficiency. Trust Texas Instruments to provide you with the tools you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability, making it a suitable choice for long-lasting applications.

Propagation Delay At Nominal Supply: 4.5 ns

Low propagation delay allows for fast signal processing, making this product ideal for high-speed applications.

Surface Mount: YES

The surface mount capability enables easy and efficient installation, making it convenient for PCB assembly.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on the PCB, making it ideal for compact designs.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a common supply voltage makes this product compatible with a wide range of applications.

Load Capacitance (CL): 50 pF

With a suitable load capacitance, this product ensures stable and reliable performance in various circuit configurations.

Power Supplies (V): 3.3

This product is designed to operate efficiently at a standard supply voltage, making it versatile for different applications.

No. of Terminals: 5

Having only 5 terminals simplifies connectivity and reduces complexity in circuit design, making it user-friendly.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The compact and low-profile package style offers space-saving benefits and ease of integration into tight spaces.

Maximum I (ol): 32 Amp

With a high maximum output current, this product can drive demanding loads effectively without risking damage.

Propagation Delay (tpd): 6.5 ns

Although slightly higher than the nominal delay, this figure still ensures fast signal processing for efficient performance.

Maximum Operating Temperature: 125 °C

The wide operating temperature range allows for reliable operation in harsh environments, enhancing the product's versatility.

Output Characteristics: OPEN-DRAIN

The open-drain output configuration offers flexibility in circuit design and integration with other components.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this product can withstand extreme cold conditions without sacrificing performance.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This finish provides excellent corrosion resistance and ensures a reliable electrical connection for long-term use.

Terminal Position: DUAL

Dual terminal positioning enhances the product's stability and reliability in various mounting configurations.

Maximum Seated Height: 1.45 mm

The low-profile design minimizes space requirements and allows for compact system designs.

Width: 1.6 mm

The slim width of the package enables efficient placement on the PCB, ideal for designs with limited space constraints.

Minimum Supply Voltage (Vsup): 1.65 V

Operating at a low minimum supply voltage allows for compatibility with power-sensitive applications.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this product can withstand the rigors of the soldering process without damage.

Length: 2.9 mm

The moderate length of the package offers a balance between compactness and ease of handling during assembly.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets industry standards for reliability and performance in vehicle environments.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and compatibility with a wide range of digital systems.

Terminal Form: GULL WING

The gull-wing terminal form provides robust mechanical support and ease of soldering for secure connections.

Packing Method: TR

This product is supplied in tape and reel packaging, enabling efficient handling and storage during manufacturing and assembly.

Terminal Pitch: 0.95 mm

The narrow terminal pitch allows for dense mounting configurations, suitable for high-density PCB layouts.

Maximum Supply Voltage (Vsup): 5.5 V

Operating within a wide supply voltage range offers flexibility in various power supply configurations for different applications.

Maximum Power Supply Current (ICC): 0.01 mA

With a low maximum power supply current, this product ensures efficient power consumption, ideal for energy-efficient designs.

Technical Specifications

Logic Gates SN74LVC1G06DBVR attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

6.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Trade Compliance

SN74LVC1G06DBVR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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