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SNXH160B120L2Q0PG

Onsemi

SNXH160B120L2Q0PG by Onsemi

Onsemi SNXH160B120L2Q0PG is a N-CHANNEL IGBT with 2 SERIES CONNECTED elements. It has VCEsat of 2.7V, IC of 75A, and Pmax of 167W. Ideal for POWER CONTROL applications due to its fast turn-off time (toff) of 359ns and high collector-emitter voltage (VCE) rating of 1200V.

Median Price

$22.540

Lifecycle Status

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1k+

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Rochester

USA . 103 parts In-Stock

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$19.460

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$17.410

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$16.380

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$19.460

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DigiKey

USA . 103 parts In-Stock

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$22.540

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$22.540

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Verical

USA . 103 parts In-Stock

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$24.325

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$21.762

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$20.475

103

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$24.325

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$20.475

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Digiode

USA . 122 parts In-Stock

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Vyrian

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Corphita

USA . 2,062 parts In-Stock

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$19.503

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$19.503

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Corohmni

South Africa . 157 parts In-Stock

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$21.670

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Microchip USA

USA . 4,245 parts In-Stock

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$47.840

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Kulean Microsystems

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SupplyDigital Components

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TANS Electronics

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Overview

Discover the power of the SNXH160B120L2Q0PG from Onsemi, a top-tier manufacturer known for engineering excellence. This Insulated Gate Bipolar Transistor (IGBT) offers unparalleled quality and performance in power control applications. With a maximum VCEsat of 2.7V and a maximum Collector-Emitter Voltage of 1200V, this N-CHANNEL transistor is a game-changer. Its series connected, center tap configuration with built-in diode and thermistor ensures reliability and efficiency. Experience the benefits of fast turn-on and turn-off times, high power dissipation, and a wide operating temperature range (-40 °C to 150°C). Trust Onsemi to deliver superior products that exceed your expectations.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their superior performance and efficiency in power control applications.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

This configuration allows for more precise power control and protection features, enhancing the reliability of the product.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance in controlling high power loads.

Maximum VCEsat: 2.7 V

Low VCEsat ensures minimal power loss and high efficiency in power switching applications.

Package Shape: RECTANGULAR

Rectangular package shape provides easy mounting and handling of the IGBT.

No. of Elements: 2

Having 2 elements allows for more flexibility and control in power applications.

Nominal Turn Off Time (toff): 359 ns

Fast turn off time ensures quick response and switching in power control operations.

No. of Terminals: 20

More terminals allow for better connectivity and control options.

Maximum Power Dissipation (Abs): 167 W

High power dissipation capability makes it suitable for handling heavy loads.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides secure and stable mounting for the IGBT.

Maximum Operating Temperature: 150 °C

High maximum operating temperature range ensures reliability in diverse environmental conditions.

Maximum Collector-Emitter Voltage: 1200 V

High collector-emitter voltage rating allows for the handling of high voltage applications.

Transistor Element Material: SILICON

Silicon material ensures high performance and reliability in power control applications.

Maximum Gate-Emitter Voltage: 20 V

High gate-emitter voltage rating provides robust protection against voltage spikes.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme conditions.

Maximum Collector Current (IC): 75 A

High collector current rating enables the IGBT to handle heavy current loads.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

Gate-emitter threshold voltage ensures proper gating and control of the IGBT.

Terminal Position: UPPER

Upper terminal position facilitates easy and convenient connection in circuits.

Case Connection: ISOLATED

Isolated case connection provides enhanced safety and protection in power control applications.

Nominal Turn On Time (ton): 80 ns

Fast turn on time ensures quick response and activation in power switching operations.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) SNXH160B120L2Q0PG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X20

No. of Elements:

2

No. of Terminals:

20

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

359 ns

Nominal Turn On Time (ton):

80 ns

Maximum VCEsat:

2.7 V

Trade Compliance

SNXH160B120L2Q0PG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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