Loading...

SNXH150B120H3Q2F2PG-R

Onsemi

SNXH150B120H3Q2F2PG-R by Onsemi

SNXH150B120H3Q2F2PG-R by Onsemi is an N-CHANNEL IGBT with 3 elements, built-in diode, and thermistor. It has a max VCEsat of 2.5V, 239ns turn-off time, and 1200V max collector-emitter voltage. Ideal for power control applications due to its high power dissipation of 279W and operating temperature range from -40 °C to 150°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,688 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,688

-

-

-

-

Vyrian

USA . 638 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

638

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 4,406 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,406

-

-

-

-

TANS Electronics

Latvia . 2,891 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,891

-

-

-

-

SupplyDigital Components

Austria . 1,688 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,688

-

-

-

-

Problanco Electronics

Mexico . 1,239 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,239

-

-

-

-

Microchip USA

USA . 458 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

458

-

-

-

-

Corohmni

South Africa . 332 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

332

-

-

-

-

UHIMA Technologies

Türkiye . 155 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

155

-

-

-

-

Corphita

USA . 105 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

105

-

-

-

-

Overview

Unleash the power of innovation with the SNXH150B120H3Q2F2PG-R by Onsemi. As a leading manufacturer of Insulated Gate Bipolar Transistors (IGBT), Onsemi delivers top-notch quality and reliability in every product. Ideal for power control applications, this N-CHANNEL transistor boasts 3 separate elements with a built-in diode and thermistor, offering maximum efficiency and performance. With a maximum VCEsat of 2.5V and a maximum collector-emitter voltage of 1200V, this IGBT is designed to handle high-power tasks with ease. Trust Onsemi to provide cutting-edge technology that elevates your projects to new heights.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs generally have lower on-state voltage drop and higher efficiency compared to P-CHANNEL IGBTs, making them a good choice for power control applications.

Configuration: SEPARATE, 3 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

The built-in diode and thermistor help in protecting the IGBT and improve its reliability in power control applications.

Maximum VCEsat: 2.5 V

The low VCEsat value results in lower power losses and higher efficiency in power control operations.

Maximum Power Dissipation (Abs): 279 W

High power dissipation capability allows the IGBT to handle high power loads without overheating, ensuring reliable performance.

Maximum Collector-Emitter Voltage: 1200 V

The high maximum collector-emitter voltage rating enables the IGBT to be used in high voltage applications without risking damage.

Maximum Collector Current (IC): 80 A

The high maximum collector current rating indicates the IGBT's capability to handle high current loads, making it suitable for power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) SNXH150B120H3Q2F2PG-R attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

RC-IGBT

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X35

No. of Elements:

3

No. of Terminals:

35

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

239 ns

Nominal Turn On Time (ton):

64 ns

Maximum VCEsat:

2.5 V

Trade Compliance

SNXH150B120H3Q2F2PG-R Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 11