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SNXH100M65L4Q2F2P2G

Onsemi

SNXH100M65L4Q2F2P2G by Onsemi

SNXH100M65L4Q2F2P2G by Onsemi is an N-CHANNEL IGBT for POWER CONTROL applications. It features a Max VCEsat of 2.2V, Max Collector-Emitter Voltage of 650V, and Max Power Dissipation of 339W. With a Nominal Turn Off Time of 3780ns, this device is suitable for high-power industrial systems requiring efficient power switching.

Median Price

$119.570

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 32 parts In-Stock

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$119.570

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$100.440

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Vyrian

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Digiode

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Kulean Microsystems

USA . 5,987 parts In-Stock

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TANS Electronics

Latvia . 3,702 parts In-Stock

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SupplyDigital Components

Austria . 3,145 parts In-Stock

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Problanco Electronics

Mexico . 2,898 parts In-Stock

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Corphita

USA . 2,187 parts In-Stock

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UHIMA Technologies

Türkiye . 636 parts In-Stock

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Corohmni

South Africa . 197 parts In-Stock

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Overview

Unleash the power of your projects with the SNXH100M65L4Q2F2P2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Insulated Gate Bipolar Transistors (IGBT) like never before. Perfect for power control applications, this N-CHANNEL transistor offers a complex configuration that ensures maximum performance and efficiency. With a maximum VCEsat of 2.2V and a maximum collector-emitter voltage of 650V, this IGBT is designed to handle high-power tasks with ease. Trust Onsemi to provide reliable and durable components that will take your projects to the next level.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower conduction losses and faster switching speeds compared to P-channel IGBTs, making them a good choice for high-performance power control applications.

Maximum VCEsat: 2.2 V

Low VCEsat value indicates minimal voltage drop across the collector-emitter junction, leading to higher efficiency and reduced power loss in the device.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows for reliable performance in a wide range of environments and applications without the risk of thermal damage.

Maximum Collector-Emitter Voltage: 650 V

The high maximum collector-emitter voltage rating makes this IGBT suitable for applications that require high voltage handling capabilities.

Maximum Power Dissipation (Abs): 339 W

The high power dissipation capability of the IGBT ensures that it can handle high power levels without overheating or compromising performance.

Nominal Turn Off Time (toff): 3780 ns

The relatively fast turn-off time enables efficient switching of the IGBT, reducing switching losses and improving overall system efficiency.

Maximum Collector Current (IC): 263 A

High collector current rating allows the IGBT to handle large current levels, making it suitable for high-power applications such as motor control and power inverters.

Nominal Turn On Time (ton): 357 ns

The fast turn-on time helps in achieving quick response times and precise control in power switching applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) SNXH100M65L4Q2F2P2G attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X40

JESD-609 Code:

e3

No. of Elements:

8

No. of Terminals:

40

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

3780 ns

Nominal Turn On Time (ton):

357 ns

Maximum VCEsat:

2.2 V

Trade Compliance

SNXH100M65L4Q2F2P2G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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