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SNXH100M95H3Q2F2PG

Onsemi

SNXH100M95H3Q2F2PG by Onsemi

SNXH100M95H3Q2F2PG by Onsemi is an N-CHANNEL IGBT with 950V VCEsat, 263A IC, and 457W power dissipation. Ideal for power control applications due to its series connected configuration with built-in diode and thermistor. Offers fast switching with rise time of 77ns and fall time of 264ns.

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Kulean Microsystems

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TANS Electronics

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SupplyDigital Components

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Overview

Discover the power and efficiency of the SNXH100M95H3Q2F2PG by Onsemi, a top-quality Insulated Gate Bipolar Transistor designed for high-performance power control applications. With its N-CHANNEL configuration, built-in diode, and thermistor, this transistor offers unparalleled reliability and versatility. Experience smooth operation and seamless integration with this series-connected device, featuring a maximum collector-emitter voltage of 950V and a maximum collector current of 263A. Elevate your projects to new heights with the SNXH100M95H3Q2F2PG – where quality meets innovation.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL polarity provides efficient power control and high performance.

Configuration: SERIES CONNECTED, CENTER TAPPED WITH BUILT-IN DIODE AND THERMISTOR

This configuration offers enhanced functionality and protection features for power control applications.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring reliable operation.

Maximum Rise Time (tr): 77 ns

Fast rise time allows for quick switching and response times in power control scenarios.

Maximum VCEsat: 2.25 V

Low VCEsat rating indicates minimal power loss and high efficiency during operation.

Package Shape: RECTANGULAR

Rectangular package shape offers ease of mounting and installation in various systems.

No. of Elements: 6

Having 6 elements provides increased power handling capacity and redundancy.

Maximum Fall Time (tf): 264 ns

Fast fall time ensures quick turn-off of the transistor, crucial for power control applications.

Nominal Turn Off Time (toff): 1665 ns

Balanced turn-off time allows for controlled switching and operation.

No. of Terminals: 40

Having 40 terminals provides connectivity options and flexibility in system integration.

Maximum Power Dissipation (Abs): 457 W

High power dissipation rating indicates capability to handle heavy loads and sustained operation.

Package Style (Meter): FLANGE MOUNT

Flange mount package style offers secure and durable mounting options for industrial applications.

Maximum Operating Temperature: 150 °C

High temperature rating ensures reliable operation in harsh environments.

Maximum Collector-Emitter Voltage: 950 V

High VCE rating allows for handling of high voltage applications with ease.

Transistor Element Material: SILICON

Silicon material provides good switching performance and reliability for the transistor.

Maximum Gate-Emitter Voltage: 20 V

Adequate gate-emitter voltage rating ensures proper gate control for efficient switching.

Minimum Operating Temperature: -40 °C

Low temperature threshold allows for operation in cold environments without compromising performance.

Maximum Collector Current (IC): 263 A

High collector current rating enables handling of heavy current loads with ease.

Maximum Gate-Emitter Threshold Voltage: 5.7 V

Optimal gate-emitter threshold voltage allows for precise control and switching performance.

Terminal Position: UPPER

Upper terminal position simplifies connection and maintenance of the transistor in systems.

Case Connection: ISOLATED

Isolated case connection provides safety and prevents electrical interference in the system.

Nominal Turn On Time (ton): 306 ns

Fast turn-on time ensures quick activation of the transistor for power control operations.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) SNXH100M95H3Q2F2PG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

950 V

Maximum Fall Time (tf):

264 ns

Maximum Gate-Emitter Threshold Voltage:

5.7 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X40

No. of Elements:

6

No. of Terminals:

40

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Rise Time (tr):

77 ns

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

1665 ns

Nominal Turn On Time (ton):

306 ns

Maximum VCEsat:

2.25 V

Trade Compliance

SNXH100M95H3Q2F2PG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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