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SNXH75M65L3F2STG

Onsemi

SNXH75M65L3F2STG by Onsemi

SNXH75M65L3F2STG by Onsemi is an N-CHANNEL IGBT with 650V VCEsat, 75A IC, and 236W power dissipation. Ideal for general purpose switching applications due to its built-in diode and thermistor. Features include a fast turn-off time of 432ns and a max operating temperature of 150 °C.

Median Price

$66.680

Lifecycle Status

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4

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1k+

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DigiKey

USA . 19 parts In-Stock

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$66.680

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$50.714

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Vyrian

USA . 2,716 parts In-Stock

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Digiode

USA . 1,132 parts In-Stock

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Flip Electronics

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AZTECH Wire

Italy . 161 parts In-Stock

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$10.480

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Microchip USA

USA . 3,123 parts In-Stock

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Problanco Electronics

Mexico . 8,344 parts In-Stock

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Kulean Microsystems

USA . 8,335 parts In-Stock

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TANS Electronics

Latvia . 8,319 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 884 parts In-Stock

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Corohmni

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SupplyDigital Components

Austria . 189 parts In-Stock

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Overview

Elevate your electronics with the SNXH75M65L3F2STG by Onsemi. Crafted with precision and expertise, this Insulated Gate Bipolar Transistor is a game-changer in the industry. Perfect for general purpose switching applications, this N-Channel transistor offers reliable performance and efficiency. With a maximum VCEsat of 2.2V and maximum collector current of 75A, you can trust this transistor to deliver outstanding results. Say goodbye to overheating worries, as it has a maximum power dissipation of 236W and can operate in temperatures up to 150 °C. Upgrade your devices with the best - choose the SNXH75M65L3F2STG for superior quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components, ensuring reliable performance and durability.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs generally have lower conduction losses and higher efficiency, making them suitable for high power applications.

Configuration: SERIES CONNECTED, CENTER TAPPED WITH BUILT-IN DIODE AND THERMISTOR

This complex configuration offers additional functionalities and protection features, making the IGBT versatile and safe to use in various applications.

Transistor Application: GENERAL PURPOSE SWITCHING

This IGBT is suitable for a wide range of switching applications, ensuring flexibility and compatibility with different systems.

Maximum VCEsat: 2.2 V

The low VCEsat value indicates minimal voltage drop across the collector-emitter junction, resulting in efficient and low power loss operation.

Package Shape: RECTANGULAR

Rectangular shape provides efficient space utilization and easy mounting, making it suitable for compact designs and installations.

Terminal Form: PIN/PEG

The pin/peg terminal form simplifies connection and installation, ensuring easy integration into circuits and systems.

Nominal Turn Off Time (toff): 432 ns

This fast turn-off time enhances the switching speed of the IGBT, reducing switching losses and improving overall efficiency.

Maximum Power Dissipation (Abs): 236 W

High power dissipation capability allows the IGBT to handle large power loads without overheating, ensuring reliable operation in demanding conditions.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides secure and stable mounting, reducing the risk of mechanical failure and improving overall reliability.

Maximum Operating Temperature: 150 °C

High maximum operating temperature tolerance allows the IGBT to withstand elevated temperatures, making it suitable for demanding industrial environments.

Maximum Collector-Emitter Voltage: 650 V

High maximum collector-emitter voltage rating allows the IGBT to handle high voltage applications, ensuring reliable and safe operation even in high voltage environments.

Transistor Element Material: SILICON

Silicon is a commonly used material for IGBTs due to its high electrical conductivity and temperature stability, ensuring reliable performance over a wide range of operating conditions.

Maximum Gate-Emitter Voltage: 25 V

High gate-emitter voltage rating provides robust protection against voltage spikes and overvoltage situations, ensuring the longevity and reliability of the IGBT.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature tolerance allows the IGBT to function reliably in cold environments, making it suitable for a wide range of operating conditions.

Maximum Collector Current (IC): 75 A

High maximum collector current rating enables the IGBT to handle large current loads, making it suitable for high power applications where high current capabilities are required.

Maximum Gate-Emitter Threshold Voltage: 6.8 V

The low gate-emitter threshold voltage ensures efficient and accurate control of the IGBT, enabling precise switching and reducing power losses during operation.

Terminal Position: UPPER

The upper terminal position simplifies connection and routing of the IGBT, ensuring easy integration into circuits and systems.

Case Connection: ISOLATED

Isolated case connection enhances safety and protection, reducing the risk of electrical shorts and improving overall reliability of the IGBT.

Nominal Turn On Time (ton): 129 ns

Fast turn-on time enhances the switching speed and efficiency of the IGBT, allowing for quick response and precise control in high-speed switching applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) SNXH75M65L3F2STG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

LOW SWITCHING LOSSES

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

6.8 V

Maximum Gate-Emitter Voltage:

25 V

JESD-30 Code:

R-PUFM-P32

No. of Elements:

1

No. of Terminals:

32

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

PIN/PEG

Terminal Position:

UPPER

Transistor Application:

GENERAL PURPOSE SWITCHING

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

432 ns

Nominal Turn On Time (ton):

129 ns

Maximum VCEsat:

2.2 V

Trade Compliance

SNXH75M65L3F2STG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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