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SNXH80T120L2Q0P2G

Onsemi

SNXH80T120L2Q0P2G by Onsemi

SNXH80T120L2Q0P2G by Onsemi is an N-CHANNEL IGBT with 4 elements in a bridge configuration. It has a max VCEsat of 2.85V, IC of 67A, and Pmax of 158W. Ideal for power control applications due to its fast turn-off time (toff) of 293ns and turn-on time (ton) of 88ns.

Median Price

$56.350

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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DigiKey

USA . 2,616 parts In-Stock

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Vyrian

USA . 318 parts In-Stock

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USA . 2,616 parts In-Stock

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Digiode

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Corohmni

South Africa . 272 parts In-Stock

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Microchip USA

USA . 431 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 22,346 parts In-Stock

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Problanco Electronics

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Kulean Microsystems

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TANS Electronics

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Corphita

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SupplyDigital Components

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UHIMA Technologies

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Overview

Elevate your power control capabilities with the SNXH80T120L2Q0P2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers quality and reliability with their insulated gate bipolar transistors. This N-CHANNEL IGBT configuration offers a versatile solution for various applications, providing customers with exceptional performance and efficiency. With a maximum VCEsat of 2.85V and a maximum Collector-Emitter Voltage of 1200V, this transistor ensures optimal power dissipation and temperature management. Trust Onsemi to elevate your power control needs with the SNXH80T120L2Q0P2G.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high efficiency and fast switching speeds, making them ideal for power control applications.

Configuration: BRIDGE, 4 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

This configuration allows for easy setup in bridge circuits and includes built-in diodes and thermistors for added functionality and protection.

Maximum VCEsat: 2.85 V

The low VCEsat value indicates minimal voltage drop when the transistor is conducting, leading to higher efficiency and reduced power losses.

Maximum Power Dissipation (Abs): 158 W

With a high maximum power dissipation, this IGBT can handle large power loads without overheating or failing.

Maximum Collector-Emitter Voltage: 1200 V

The high maximum collector-emitter voltage allows this IGBT to be used in high voltage applications with a good margin of safety.

Maximum Collector Current (IC): 67 A

The high maximum collector current rating enables this IGBT to handle large current loads without being damaged.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows this IGBT to be used in a variety of environments and applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) SNXH80T120L2Q0P2G attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.4 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X20

No. of Elements:

4

No. of Terminals:

20

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

293 ns

Nominal Turn On Time (ton):

88 ns

Maximum VCEsat:

2.85 V

Trade Compliance

SNXH80T120L2Q0P2G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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