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SNXH150B120H3Q2F2PG-N

Onsemi

SNXH150B120H3Q2F2PG-N by Onsemi

Onsemi's SNXH150B120H3Q2F2PG-N is an N-CHANNEL IGBT with 3 elements, built-in diode, and thermistor. It has a VCEsat of 2.5V, max power dissipation of 279W, and can handle up to 80A collector current. Ideal for power control applications due to its high voltage rating of 1200V and fast turn-off time of 410ns.

Median Price

$75.285

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 18,429 parts In-Stock

1+ parts

-

100+ parts

$66.920

1k+ parts

$59.870

10k+ parts

$56.350

18,429

-

$66.920

$59.870

$56.350

Verical

USA . 11,371 parts In-Stock

1+ parts

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$83.650

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$74.838

10k+ parts

$70.438

11,371

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$83.650

$74.838

$70.438

Distributors (In-Stock)

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Digiode

USA . 840 parts In-Stock

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$20.586

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840

$20.586

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Vyrian

USA . 1,724 parts In-Stock

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$21.670

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1,724

$21.670

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,114 parts In-Stock

1+ parts

$19.503

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2,114

$19.503

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Corohmni

South Africa . 85 parts In-Stock

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$21.670

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85

$21.670

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Problanco Electronics

Mexico . 6,655 parts In-Stock

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6,655

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SupplyDigital Components

Austria . 5,104 parts In-Stock

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TANS Electronics

Latvia . 3,544 parts In-Stock

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3,544

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Kulean Microsystems

USA . 1,441 parts In-Stock

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1,441

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UHIMA Technologies

Türkiye . 449 parts In-Stock

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449

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Overview

Experience the power of innovation with the SNXH150B120H3Q2F2PG-N by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Insulated Gate Bipolar Transistors that are perfect for power control applications. With a maximum collector-emitter voltage of 1200V and a maximum collector current of 80A, this N-Channel IGBT offers unmatched performance and reliability. Say goodbye to overheating and hello to efficient power management with the SNXH150B120H3Q2F2PG-N, where cutting-edge technology meets exceptional value. Elevate your projects today with Onsemi's superior products.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state voltage drop and higher efficiency compared to P-channel IGBTs, making them a good choice for power control applications.

Configuration: SEPARATE, 3 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

Having separate elements with built-in diode and thermistor allows for better control and protection of the device, making it more reliable in power control applications.

Maximum VCEsat: 2.5 V

A lower VCEsat value indicates lower voltage drop across the collector-emitter junction, leading to higher efficiency in power control applications.

Package Shape: RECTANGULAR

Rectangular packages are often easier to mount and handle, making the IGBT easier to integrate into power control systems.

Nominal Turn Off Time (toff): 410 ns

A fast turn-off time allows for better control of the power switching process, reducing switching losses and improving efficiency in power control applications.

Maximum Power Dissipation (Abs): 279 W

A higher power dissipation rating indicates the device can handle higher power levels without overheating, making it suitable for high-power applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows the IGBT to operate in harsh environments without performance degradation, increasing its reliability.

Maximum Collector-Emitter Voltage: 1200 V

The high maximum voltage rating allows the IGBT to handle high voltage levels, making it suitable for high-power applications.

Transistor Element Material: SILICON

Silicon is a common and reliable material for power transistors, ensuring the IGBT's long-term performance and stability in power control applications.

Maximum Gate-Emitter Voltage: 20 V

The high maximum gate-emitter voltage rating allows for better gate control and protection, enhancing the IGBT's reliability in power control applications.

Maximum Collector Current (IC): 80 A

The high maximum collector current rating indicates the IGBT can handle high current levels, making it suitable for high-power applications.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

The gate-emitter threshold voltage specifies the minimum voltage required to turn on the IGBT, ensuring reliable and precise control in power switching applications.

Nominal Turn On Time (ton): 68 ns

A fast turn-on time allows for quick response in power switching applications, reducing the transition time and improving efficiency.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) SNXH150B120H3Q2F2PG-N attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X35

No. of Elements:

3

No. of Terminals:

35

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

410 ns

Nominal Turn On Time (ton):

68 ns

Maximum VCEsat:

2.5 V

Trade Compliance

SNXH150B120H3Q2F2PG-N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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