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SNXH100M65L3Q2F2PG

Onsemi

SNXH100M65L3Q2F2PG by Onsemi

SNXH100M65L3Q2F2PG by Onsemi is an N-CHANNEL IGBT for power control applications. It features a max VCEsat of 2.2V, 650V max collector-emitter voltage, and 263A max collector current. With a built-in diode and thermistor, it offers efficient series connected configuration in a rectangular package style for high-power dissipation up to 339W at temperatures ranging from -40 °C to 150°C.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

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Digiode

USA . 1,083 parts In-Stock

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Kulean Microsystems

USA . 3,676 parts In-Stock

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Problanco Electronics

Mexico . 3,403 parts In-Stock

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TANS Electronics

Latvia . 1,899 parts In-Stock

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Corphita

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SupplyDigital Components

Austria . 419 parts In-Stock

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Corohmni

South Africa . 326 parts In-Stock

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UHIMA Technologies

Türkiye . 119 parts In-Stock

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Overview

Unleash the power of innovation with the SNXH100M65L3Q2F2PG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Insulated Gate Bipolar Transistors (IGBT) that are designed for optimal performance and reliability. From power control to industrial applications, this N-CHANNEL transistor offers customers unmatched value and benefits. With built-in diode and thermistor, this series connected transistor provides maximum efficiency, making it the perfect choice for your next project. Elevate your designs with the SNXH100M65L3Q2F2PG and experience the difference quality makes.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high efficiency and fast switching speeds, making them suitable for power control applications.

Configuration: SERIES CONNECTED, CENTER TAPPED WITH BUILT-IN DIODE AND THERMISTOR

This configuration allows for better control of power flow and enhances the overall performance and reliability of the IGBT.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimal performance and efficiency in controlling power flow.

Maximum VCEsat: 2.2 V

Low VCEsat helps in reducing power losses and improving overall efficiency of the IGBT.

Package Shape: RECTANGULAR

Rectangular packages are more compact and easy to mount, providing space-saving benefits.

Nominal Turn Off Time (toff): 3780 ns

The relatively fast turn-off time ensures quick switching, which is crucial in power control applications.

Maximum Power Dissipation (Abs): 339 W

High power dissipation capability allows the IGBT to handle large amounts of power without overheating.

Maximum Operating Temperature: 150 °C

Can operate efficiently at high temperatures, ensuring stability and reliability in harsh environments.

Maximum Collector-Emitter Voltage: 650 V

Ability to withstand high voltages, making it suitable for power control applications that require high voltage handling.

Transistor Element Material: SILICON

Silicon is a widely used material in semiconductor devices and offers good performance characteristics for IGBTs.

Maximum Gate-Emitter Voltage: 20 V

Safe operating range for gate-emitter voltage, ensuring proper control and protection of the IGBT.

Minimum Operating Temperature: -40 °C

Can operate in cold temperatures, providing versatility for use in various environments.

Maximum Collector Current (IC): 263 A

High collector current rating allows the IGBT to handle large current loads, making it suitable for high-power applications.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

Threshold voltage ensures proper turn-on of the IGBT, enabling efficient and controlled power switching.

Terminal Finish: MATTE TIN

Matte tin finish provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: UPPER

Upper terminal position facilitates easy installation and connection in various circuit setups.

Case Connection: ISOLATED

Isolated case connection enhances safety and prevents electrical interference in the circuit.

Nominal Turn On Time (ton): 357 ns

Fast turn-on time ensures quick response and efficient power control capabilities of the IGBT.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) SNXH100M65L3Q2F2PG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X40

JESD-609 Code:

e3

No. of Elements:

8

No. of Terminals:

40

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

3780 ns

Nominal Turn On Time (ton):

357 ns

Maximum VCEsat:

2.2 V

Trade Compliance

SNXH100M65L3Q2F2PG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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