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SNXH100M65L4Q2F2P2G-N1

Onsemi

SNXH100M65L4Q2F2P2G-N1 by Onsemi

SNXH100M65L4Q2F2P2G-N1 by Onsemi is an N-CHANNEL IGBT for power control applications. It features a max VCEsat of 2.2V, 650V max collector-emitter voltage, and 263A max collector current. With a package style of FLANGE MOUNT, it operates b/w -40 to 150 °C and has a turn off time of 3780ns.

Median Price

$101.870

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 324 parts In-Stock

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$23.100

100+ parts

$21.710

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$19.640

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324

$23.100

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Mouser Electronics

USA . 33 parts In-Stock

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$101.870

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$96.600

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DigiKey

USA . 31 parts In-Stock

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$101.870

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$84.524

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31

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$84.524

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Flip Electronics

USA . 684 parts In-Stock

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$13.748

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684

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Digiode

USA . 1,876 parts In-Stock

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$21.945

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Vyrian

USA . 6,510 parts In-Stock

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Corphita

USA . 1,312 parts In-Stock

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$20.790

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Corohmni

South Africa . 227 parts In-Stock

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$23.100

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227

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Kulean Microsystems

USA . 7,086 parts In-Stock

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TANS Electronics

Latvia . 2,500 parts In-Stock

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2,500

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SupplyDigital Components

Austria . 2,178 parts In-Stock

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UHIMA Technologies

Türkiye . 362 parts In-Stock

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Problanco Electronics

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Overview

Experience the unparalleled performance of the SNXH100M65L4Q2F2P2G-N1 by Onsemi, a top-quality Insulated Gate Bipolar Transistor designed for power control applications. With its N-CHANNEL polarity and innovative design featuring a series connected configuration with built-in diode and thermistor, this transistor offers exceptional reliability and efficiency. Ideal for demanding environments, this product boasts a maximum VCEsat of 2.2V and a maximum operating temperature of 150 °C, ensuring optimal performance under various conditions. Trust Onsemi's reputation for delivering cutting-edge semiconductor solutions and elevate your power control systems with the SNXH100M65L4Q2F2P2G-N1.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high efficiency and fast switching characteristics, making them suitable for power control applications.

Configuration: SERIES CONNECTED, CENTER TAPPED WITH BUILT-IN DIODE AND THERMISTOR

This configuration provides additional protection and thermal management, enhancing the reliability and performance of the IGBT.

Maximum VCEsat: 2.2 V

The low VCEsat value indicates minimal voltage drop when the IGBT is conducting, leading to improved power efficiency.

Nominal Turn Off Time (toff): 3780 ns

The relatively fast turn-off time allows for precise power control and can help prevent damage to sensitive components in the circuit.

Maximum Power Dissipation (Abs): 339 W

With a high power dissipation capability, this IGBT can handle significant amounts of power without overheating or failing.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature ensures that the IGBT can withstand harsh environments and operate reliably under varying conditions.

Maximum Collector-Emitter Voltage: 650 V

The high maximum voltage rating makes this IGBT suitable for high voltage applications, providing ample headroom for voltage spikes.

Maximum Collector Current (IC): 263 A

With a high collector current rating, this IGBT can handle large amounts of current without overheating or failing prematurely.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) SNXH100M65L4Q2F2P2G-N1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X40

No. of Elements:

8

No. of Terminals:

40

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

3780 ns

Nominal Turn On Time (ton):

357 ns

Maximum VCEsat:

2.2 V

Trade Compliance

SNXH100M65L4Q2F2P2G-N1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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