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NLV14042BDR2G

Onsemi

NLV14042BDR2G by Onsemi

NLV14042BDR2G by Onsemi is a 4-bit latch with 440ns propagation delay, suitable for AEC-Q100 applications. Operating at -55 to 125 °C, it has a supply voltage range of 3-18V and load capacitance of 50pF. This CMOS technology flip-flop comes in a small outline package ideal for military-grade designs.

Median Price

$0.394

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,389 parts In-Stock

1+ parts

$0.520

100+ parts

$0.282

1k+ parts

$0.242

10k+ parts

$0.220

2,389

$0.520

$0.282

$0.242

$0.220

Mouser Electronics

USA . 1,703 parts In-Stock

1+ parts

$0.520

100+ parts

$0.283

1k+ parts

$0.243

10k+ parts

$0.223

1,703

$0.520

$0.283

$0.243

$0.223

Rochester

USA . 10,263 parts In-Stock

1+ parts

-

100+ parts

$0.269

1k+ parts

$0.223

10k+ parts

$0.199

10,263

-

$0.269

$0.223

$0.199

Verical

USA . 4,661 parts In-Stock

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$0.249

4,661

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$0.249

Distributors (In-Stock)

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Digiode

USA . 927 parts In-Stock

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$0.209

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927

$0.209

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Vyrian

USA . 2,316 parts In-Stock

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$0.220

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2,316

$0.220

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 10,430 parts In-Stock

1+ parts

$0.180

100+ parts

$0.170

1k+ parts

$0.160

10k+ parts

-

10,430

$0.180

$0.170

$0.160

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Corphita

USA . 675 parts In-Stock

1+ parts

$0.198

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675

$0.198

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Corohmni

South Africa . 180 parts In-Stock

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$0.220

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180

$0.220

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Vigor

Singapore . 185 parts In-Stock

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$0.320

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185

$0.320

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Microchip USA

USA . 3,805 parts In-Stock

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$3.965

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3,805

$3.965

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$38.572

100+ parts

$35.101

1k+ parts

$31.629

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2,000

$38.572

$35.101

$31.629

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TANS Electronics

Latvia . 8,047 parts In-Stock

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Problanco Electronics

Mexico . 7,266 parts In-Stock

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SupplyDigital Components

Austria . 6,315 parts In-Stock

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Kulean Microsystems

USA . 1,622 parts In-Stock

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UHIMA Technologies

Türkiye . 591 parts In-Stock

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Overview

Unlock the power of efficient signal processing with the NLV14042BDR2G by Onsemi. This high-quality latch & flip-flop device offers unparalleled performance and reliability, thanks to Onsemi's reputation for cutting-edge technology and innovation. Ideal for a wide range of applications, this product provides customers with fast propagation delays, low power consumption, and easy surface mount installation. Experience the value and benefits of Onsemi's NLV14042BDR2G and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, suitable for various applications.

Propagation Delay At Nominal Supply: 440 ns

Fast propagation delay ensures quick response times in signal processing and data transfer.

Surface Mount: YES

Surface mount package allows for easy and efficient PCB assembly.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high quality and reliability, making this product suitable for automotive applications.

No. of Bits: 4

4 bits provide sufficient complexity for digital signal processing and control applications.

Nominal Supply Voltage / Vsup: 5V

Support for a standard 5V supply voltage makes integration with other components simple and straightforward.

Load Capacitance (CL): 50 pF

Low load capacitance ensures minimal distortion and interference in signal transmission.

Power Supplies (V): 5/15

Support for dual power supplies at 5V and 15V offers flexibility in different operating conditions.

No. of Terminals: 16

16 terminals provide ample connectivity options for interfacing with other components.

Package Style (Meter): SMALL OUTLINE

Small outline package design saves space on the PCB, ideal for compact electronic devices.

Trigger Type: LOW LEVEL

Low-level trigger type ensures compatibility with a wide range of input signals.

Minimum Operating Temperature: -55 °C

Wide operating temperature range allows for reliable performance in harsh environmental conditions.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures stable performance under extreme heat conditions.

Length: 9.9 mm

Compact length allows for easy integration in tight spaces or densely populated PCBs.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall efficiency.

Technical Specifications

Latches & Flip-Flops NLV14042BDR2G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

440 ns

Propagation Delay (tpd):

440 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

LOW LEVEL

Width:

3.9 mm

Trade Compliance

NLV14042BDR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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