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CD74AC175M96E4

Texas Instruments

CD74AC175M96E4 by Texas Instruments

CD74AC175M96E4 by Texas Instruments is a 4-bit latch with a propagation delay of 17.1 ns, suitable for military-grade applications. It operates at a nominal voltage of 3.3V/5V and has a max frequency of 71MHz, making it ideal for high-speed digital circuits in harsh environments. This surface-mount device features complementary output polarity and Gull Wing terminal form for efficient PCB integration.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Avnet

USA . 2,500 parts In-Stock

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Vyrian

USA . 3,203 parts In-Stock

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Digiode

USA . 1,533 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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One Stop Electronics

USA . 803 parts In-Stock

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$7.000

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Ampacity Inc.

Singapore . 512 parts In-Stock

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$8.000

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Parana Technologies

USA . 2,270 parts In-Stock

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$11.514

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$11.925

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DigiPath Technology Company

USA . 975 parts In-Stock

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$12.678

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$11.664

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ChromeModa Solutions

Germany . 6,588 parts In-Stock

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$12.937

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$10.608

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IDEA Electronic Components Group

UK . 662 parts In-Stock

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$12.937

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$12.290

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$11.643

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AZTECH Wire

Italy . 346 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Continental Prestige Electronics

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Microchip USA

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Argo Parts USA

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Corphita

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Overview

Experience unparalleled performance and reliability with the CD74AC175M96E4 by Texas Instruments. As a leader in the industry, Texas Instruments guarantees top-notch quality and cutting-edge technology in every product. The CD74AC175M96E4 belongs to the Latches & Flip-Flops category, offering seamless operation and versatility for a wide range of applications. From rapid propagation delays to a compact package style, this component delivers exceptional value and benefits to customers looking for superior functionality and efficiency. Trust Texas Instruments to provide you with state-of-the-art solutions that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and provides good protection for the internal components of the latch, ensuring longevity and reliability.

Propagation Delay At Nominal Supply: 17.1 ns

Low propagation delay ensures quick response times, making this latch suitable for high-speed applications.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

No. of Bits: 4

Four bits allow for a range of different input/output options, increasing the versatility of this latch.

Nominal Supply Voltage / Vsup (V): 3.3

Operates on a commonly used voltage level of 3.3V, making it compatible with a wide range of systems and components.

Load Capacitance (CL): 50 pF

Low load capacitance helps in reducing power consumption and improving overall efficiency.

Power Supplies (V): 3.3/5

Supports both 3.3V and 5V power supplies, providing flexibility in different operating environments.

Maximum I (ol): 24 Amp

High output current capability allows this latch to drive larger loads without external amplification.

Trigger Type: POSITIVE EDGE

Positive edge trigger ensures accurate and synchronized data capture, enhancing the reliability of the latch.

Maximum Operating Temperature: 125 °C

Wide operating temperature range makes this latch suitable for use in harsh environments or industrial applications.

Minimum Operating Temperature: -55 °C

Wide temperature range ensures reliable operation even in extreme cold conditions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making this latch efficient and reliable.

Technical Specifications

Latches & Flip-Flops CD74AC175M96E4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AC

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

71000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

17.1 ns

Propagation Delay (tpd):

153 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

100 MHz

Trade Compliance

CD74AC175M96E4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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