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CD74ACT175M

Texas Instruments

CD74ACT175M by Texas Instruments

CD74ACT175M by Texas Instruments is a 4-bit latch with 11.5 ns propagation delay, suitable for military-grade applications. It operates at a nominal voltage of 5V and has a max frequency of 100MHz. This surface-mount device features complementary output polarity and Gull Wing terminal form, making it ideal for high-speed digital circuits in harsh environments.

Median Price

$0.930

Lifecycle Status

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17

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Rochester

USA . 4,735 parts In-Stock

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$0.913

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$0.758

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$0.676

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Verical

USA . 3,535 parts In-Stock

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Freelance Electronics

USA . 74 parts In-Stock

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Digiode

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Nova Conductors

Japan . 50 parts In-Stock

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DigiKey Marketplace

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Vyrian

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Atlantic Semiconductor

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Bristol Electronics

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ComSIT Distribution GmbH

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EMSNET

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Elcom Components

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Electronic Expediters

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Sunrise Surplus Inc.

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Prism Electronics

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Semicontronic

India . 3,717 parts In-Stock

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$0.550

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$0.536

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$0.534

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Corphita

USA . 1,605 parts In-Stock

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$0.585

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Aranea Global

USA . 500 parts In-Stock

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$0.639

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$0.613

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Continental Prestige Electronics

USA . 2,754 parts In-Stock

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Argo Parts USA

USA . 1,251 parts In-Stock

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Parana Technologies

USA . 473 parts In-Stock

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DigiPath Technology Company

USA . 1,789 parts In-Stock

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ChromeModa Solutions

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IDEA Electronic Components Group

UK . 15 parts In-Stock

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Corohmni

South Africa . 240 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Supply Digital

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GreenTree Electronics

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Microchip USA

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Metaverse IC Inc.

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Overview

Elevate your electronic designs with the CD74ACT175M by Texas Instruments, a top-of-the-line latches & flip-flops component that guarantees quality and reliability. Crafted by a trusted manufacturer, this product offers unmatched performance and longevity. Perfect for a wide range of applications, this versatile component ensures seamless operation and precision. Experience the value and benefits of Texas Instruments' cutting-edge technology with the CD74ACT175M, providing customers with superior results and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the latch or flip-flop, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 11.5 ns

Fast propagation delay ensures quick response time, making this latch or flip-flop suitable for applications requiring rapid data processing.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on printed circuit boards, saving time and effort during assembly.

Trigger Type: POSITIVE EDGE

Positive edge trigger type ensures reliable and precise triggering of the latch or flip-flop, enhancing overall performance and data integrity.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this latch or flip-flop energy-efficient and reliable in noisy environments.

Technical Specifications

Latches & Flip-Flops CD74ACT175M attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

ACT

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

100000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

11.5 ns

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

114 MHz

Trade Compliance

CD74ACT175M Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-422-3117, 5962014223117

NIIN

014223117

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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