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CD74HC74E

Texas Instruments

CD74HC74E by Texas Instruments

CD74HC74E by Texas Instruments is a D flip-flop logic IC with 2 functions. It has a propagation delay of 53 ns and operates at a nominal voltage of 4.5V. This component is commonly used in military-grade applications requiring high-frequency operation up to 20 MHz.

Median Price

$0.800

Lifecycle Status

Suppliers In-Stock

60

In-Stock Inventory

1k+

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Texas Instruments

USA . 264,175 parts In-Stock

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DigiKey

USA . 1,143 parts In-Stock

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$0.800

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$0.451

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$0.388

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$0.363

1,143

$0.800

$0.451

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$0.363

Newark

USA . 121 parts In-Stock

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$0.800

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$0.451

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$0.387

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$0.362

121

$0.800

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Farnell

UK . 1,024 parts In-Stock

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$0.823

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$0.466

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$0.403

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$0.387

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Element14

Singapore . 989 parts In-Stock

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Chip1Stop

Japan . 1,125 parts In-Stock

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Mouser Electronics

USA . 2,721 parts In-Stock

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2,721

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Adafruit Industries

USA . 19 parts In-Stock

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Rochester

USA . 7,941 parts In-Stock

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Verical

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Arrow

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Freelance Electronics

USA . 117 parts In-Stock

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TEDSS.com

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Nova Conductors

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Component Electronics Inc.

Canada . 886 parts In-Stock

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American Microsemiconductor Inc.

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Inventory MP

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Legend Electronics Inc.

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Electronics Depot

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Argo Parts USA

USA . 2,382 parts In-Stock

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$0.216

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$0.209

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$0.216

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Corohmni

South Africa . 590 parts In-Stock

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$0.228

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$0.228

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Semicontronic

India . 25,523 parts In-Stock

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$0.308

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$0.300

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$0.299

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Corphita

USA . 2,466 parts In-Stock

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$0.326

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Continental Prestige Electronics

USA . 369 parts In-Stock

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$0.726

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$0.525

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$0.435

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369

$0.726

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Component Stockers USA

USA . 3,046 parts In-Stock

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$0.860

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$0.600

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$0.390

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3,046

$0.860

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Microchip USA

USA . 3,954 parts In-Stock

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$6.435

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Parana Technologies

USA . 814 parts In-Stock

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$15.668

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$16.038

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DigiPath Technology Company

USA . 216 parts In-Stock

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$17.253

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ChromeModa Solutions

Germany . 4,422 parts In-Stock

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$17.605

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$14.436

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IDEA Electronic Components Group

UK . 1,920 parts In-Stock

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$17.605

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$16.725

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$15.844

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Advanced Electronics

New Zealand . 19 parts In-Stock

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$27.280

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Perfect Parts

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Overview

Experience the superior quality and reliability of Texas Instruments with the CD74HC74E, a leading latches and flip-flops component. Ideal for a wide range of applications, this high-performance D flip-flop offers exceptional value, benefits, and advantages to customers. With its precise trigger type and complementary output polarity, you can trust that your circuits will operate flawlessly. Whether you're designing military-grade systems or high-frequency devices, the CD74HC74E delivers unrivaled performance and is backed by Texas Instruments' renowned reputation. Upgrade your projects today and unlock endless possibilities with this cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the latch or flip-flop, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 53 ns

Low propagation delay ensures fast response time, making this latch or flip-flop suitable for high-speed applications.

No. of Functions: 2

Having 2 functions allows for more versatile and complex operations to be performed by the latch or flip-flop, making it suitable for various applications.

Nominal Supply Voltage / Vsup (V): 4.5

Operating at 4.5V makes this latch or flip-flop compatible with a wide range of standard supply voltages, increasing its flexibility in different systems.

Maximum Operating Temperature: 125 °C

Being able to operate at up to 125 °C ensures the latch or flip-flop can withstand high temperature environments, increasing its durability and reliability.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this latch or flip-flop energy-efficient and reliable in noisy environments.

Maximum Frequency At Nominal Supply: 20000000 Hz

With a maximum frequency of 20 MHz, this latch or flip-flop is suitable for high-speed applications that require quick switching capabilities.

Technical Specifications

Latches & Flip-Flops CD74HC74E attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Length:

19.305 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

5.2 Amp

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

53 ns

Propagation Delay (tpd):

265 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

23 MHz

Trade Compliance

CD74HC74E Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-228-8376, 5962012288376, 5962-01-313-1527, 5962013131527

NIIN

012288376, 013131527

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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