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MC74HC174ANG

Onsemi

MC74HC174ANG by Onsemi

MC74HC174ANG by Onsemi is a 6-bit latch with Vsup of 5V, tpd of 165ns, and fmax of 24MHz. Ideal for military applications due to its MILITARY grade, it operates at temperatures ranging from -55 to 125 °C. With a package style of IN-LINE and through-hole terminal form, it is suitable for high-speed digital systems.

Median Price

$0.302

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 46,442 parts In-Stock

1+ parts

-

100+ parts

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$0.301

46,442

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$0.301

Rochester

USA . 46,442 parts In-Stock

1+ parts

-

100+ parts

$0.304

1k+ parts

$0.252

10k+ parts

$0.225

46,442

-

$0.304

$0.252

$0.225

DigiKey

USA . 46,442 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.380

10k+ parts

-

46,442

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$0.380

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Verical

USA . 41,663 parts In-Stock

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$0.281

41,663

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$0.281

Distributors (In-Stock)

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Digiode

USA . 1,235 parts In-Stock

1+ parts

$0.237

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-

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1,235

$0.237

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Nova Conductors

Japan . 23 parts In-Stock

1+ parts

$0.315

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23

$0.315

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DigiKey Marketplace

USA . 47,942 parts In-Stock

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47,942

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Vyrian

USA . 45,002 parts In-Stock

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45,002

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Distributors (Availability)

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Ampacity Inc.

Singapore . 44,901 parts In-Stock

1+ parts

$0.212

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-

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44,901

$0.212

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Semicontronic

India . 44,752 parts In-Stock

1+ parts

$0.212

100+ parts

$0.207

1k+ parts

$0.206

10k+ parts

-

44,752

$0.212

$0.207

$0.206

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Corphita

USA . 1,949 parts In-Stock

1+ parts

$0.224

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1,949

$0.224

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Corohmni

South Africa . 471 parts In-Stock

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$0.249

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471

$0.249

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Continental Prestige Electronics

USA . 3,299 parts In-Stock

1+ parts

$0.315

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$0.309

3,299

$0.315

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$0.309

Argo Parts USA

USA . 1,844 parts In-Stock

1+ parts

$0.315

100+ parts

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$0.306

1,844

$0.315

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$0.306

Netroflash

USA . 500 parts In-Stock

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$0.315

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500

$0.315

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Kulean Microsystems

USA . 6,932 parts In-Stock

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Problanco Electronics

Mexico . 6,640 parts In-Stock

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TANS Electronics

Latvia . 5,697 parts In-Stock

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SupplyDigital Components

Austria . 3,986 parts In-Stock

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3,986

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Microchip USA

USA . 435 parts In-Stock

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435

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UHIMA Technologies

Türkiye . 18 parts In-Stock

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Overview

Enhance your electronic projects with the MC74HC174ANG by Onsemi. This high-quality latch and flip-flop component offers reliable performance and versatility for a wide range of applications. With a durable plastic/epoxy package body and a nominal supply voltage of 5V, this product ensures optimal functionality. Experience the benefits of fast propagation delay, low power consumption, and a wide temperature range, making it an ideal choice for military-grade projects. Trust Onsemi's expertise and innovation to bring value and efficiency to your designs with the MC74HC174ANG. Elevate your creations today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes this latch durable and lightweight.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into various systems and designs.

No. of Bits: 6

With 6 bits, this latch is capable of handling a variety of data inputs and outputs.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage ensures compatibility with most standard electronic systems.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF helps in efficient data transfer and processing.

Power Supplies (V): 2/6

The dual power supplies of 2/6V offer flexibility in voltage requirements for different applications.

No. of Terminals: 16

With 16 terminals, this latch can easily connect to multiple components in a circuit.

Package Style (Meter): IN-LINE

The in-line package style makes installation and maintenance convenient.

Maximum I (ol): 4 Amp

The high maximum output current of 4A enables the latch to drive power-hungry components.

Propagation Delay (tpd): 165 ns

The low propagation delay of 165 ns ensures fast data processing and response time.

Technical Specifications

Latches & Flip-Flops MC74HC174ANG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.175 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

4 Amp

No. of Bits:

6

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

165 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

24 MHz

Trade Compliance

MC74HC174ANG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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