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MC74HC273ADWR2G

Onsemi

MC74HC273ADWR2G by Onsemi

MC74HC273ADWR2G by Onsemi is an 8-bit latch with a supply voltage of 3V, operating b/w -55 to 125°C. It has a propagation delay of 220ns and can handle load capacitance up to 50pF. Ideal for military-grade applications due to its small outline package and positive edge trigger type.

Median Price

$0.348

Lifecycle Status

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1k+

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Mouser Electronics

USA . 574 parts In-Stock

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$0.650

100+ parts

$0.363

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$0.317

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$0.268

574

$0.650

$0.363

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$0.268

DigiKey

USA . 458 parts In-Stock

1+ parts

$0.650

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$0.363

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$0.310

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$0.300

458

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Avnet

USA . 13,000 parts In-Stock

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Future Electronics

Canada . 11,000 parts In-Stock

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Chip1Stop

Japan . 6,000 parts In-Stock

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Rochester

USA . 3,656 parts In-Stock

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$0.260

3,656

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Farnell

UK . 3,656 parts In-Stock

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$0.302

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Arrow

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$0.346

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$0.209

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Verical

USA . 1,743 parts In-Stock

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$0.395

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$0.365

1,743

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Digiode

USA . 2,124 parts In-Stock

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$0.273

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Nova Conductors

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Forefront Electronics and Design

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IBS Electronics

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$0.309

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NAC Semi

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Flip Electronics

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Chip Stock

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Vyrian

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Bristol Electronics

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North Shore Components

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ComSIT Distribution GmbH

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Contempo Components LLC

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Semicontronic

India . 2,721 parts In-Stock

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$0.211

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$0.206

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Ampacity Inc.

Singapore . 2,605 parts In-Stock

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$0.211

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Corohmni

South Africa . 474 parts In-Stock

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$0.248

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Corphita

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Component Stockers USA

USA . 64,579 parts In-Stock

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$0.290

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$0.280

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$0.240

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$0.210

64,579

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Bastille Electronics

Australia . 940 parts In-Stock

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$0.333

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$0.317

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$0.312

940

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Argo Parts USA

USA . 83 parts In-Stock

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$0.351

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$0.341

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Aztec Data Supply Inc.

USA . 995 parts In-Stock

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Perfect Parts

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QUARKTWIN TECHNOLOGY LTD

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Eastek

USA . 6,000 parts In-Stock

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Problanco Electronics

Mexico . 3,464 parts In-Stock

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Kulean Microsystems

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Continental Prestige Electronics

USA . 1,585 parts In-Stock

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Authorized Procurement Solutions

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GreenTree Electronics

Israel . 191 parts In-Stock

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SupplyDigital Components

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UHIMA Technologies

Türkiye . 75 parts In-Stock

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Overview

Upgrade your electronic projects with the MC74HC273ADWR2G by Onsemi. Crafted with precision and expertise, Onsemi's latches & flip-flops category delivers top-notch quality and reliability. This product offers customers unparalleled value with its versatile applications and seamless performance. Experience the benefits of this innovative technology and unlock endless possibilities for your designs. Trust Onsemi to provide you with exceptional products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability to the latch & flip-flop, ensuring a long lifespan.

Surface Mount: YES

Surface mount design makes installation easier and saves space, ideal for compact electronic applications.

No. of Bits: 8

With 8 bits, this latch & flip-flop can handle a larger amount of data, making it suitable for complex computing tasks.

Nominal Supply Voltage / Vsup (V): 3

Operates at a low nominal supply voltage of 3V, making it energy efficient and compatible with various circuits.

Maximum I (ol): 6 Amp

High output current of 6A allows the latch & flip-flop to drive power-hungry components effectively.

Propagation Delay (tpd): 220 ns

Low propagation delay ensures quick response time, crucial for efficient data processing in real-time applications.

Maximum Operating Temperature: 125 °C

Wide operating temperature range up to 125°C enables reliable performance in harsh environmental conditions.

Trigger Type: POSITIVE EDGE

Positive edge trigger type ensures precise timing and synchronization of data signals for accurate output.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making it an efficient choice for digital applications.

Technical Specifications

Latches & Flip-Flops MC74HC273ADWR2G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

220 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Minimum fmax:

24 MHz

Trade Compliance

MC74HC273ADWR2G Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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