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SN74LVC1G175DBVR

Texas Instruments

SN74LVC1G175DBVR by Texas Instruments

SN74LVC1G175DBVR by Texas Instruments is a latches & flip-flops IC with 5.7ns propagation delay, 3.3V power supply, and 150MHz max frequency. Ideal for automotive applications due to its small outline package and low profile design.

Median Price

$0.100

Lifecycle Status

Suppliers In-Stock

35

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 6 parts In-Stock

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$0.045

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Texas Instruments

USA . 1,166,619 parts In-Stock

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DigiKey

USA . 8,482 parts In-Stock

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$0.083

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Farnell

UK . 6,646 parts In-Stock

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Avnet

USA . 6,000 parts In-Stock

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Element14

Singapore . 5,050 parts In-Stock

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Verical

USA . 3,000 parts In-Stock

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RS (Exports)

UK . 1,950 parts In-Stock

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$0.227

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$0.091

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Chip1Stop

Japan . 1,831 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Digiode

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TME

Poland . 120 parts In-Stock

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Component Electronics Inc.

Canada . 2,600 parts In-Stock

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Vyrian

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Chip Stock

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Bristol Electronics

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Inventory MP

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Semi Source

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HZD GmbH

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PC Components Company LLC

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Ashlea Components Ltd

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Sensible Micro Corp

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Cyclops Electronics Ltd

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SPM Sales

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Elcom Components

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Lakeland Logistics Inc

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Prism Electronics

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Classic Components Corporation

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Sogenti Electronics

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Ampacity Inc.

Singapore . 132,776 parts In-Stock

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$0.038

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Semicontronic

India . 132,727 parts In-Stock

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Continental Prestige Electronics

USA . 6,503 parts In-Stock

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$0.086

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$0.084

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Argo Parts USA

USA . 4,451 parts In-Stock

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$0.086

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Corphita

USA . 3,761 parts In-Stock

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$0.090

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Aranea Global

USA . 50 parts In-Stock

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$0.092

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$0.089

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Modulus Dynamics

Lithuania . 1,000 parts In-Stock

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$0.095

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$0.092

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Microchip USA

USA . 2,288 parts In-Stock

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$0.469

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Corohmni

South Africa . 152 parts In-Stock

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$11.298

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Parana Technologies

USA . 1,727 parts In-Stock

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$20.234

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$20.217

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DigiPath Technology Company

USA . 2,160 parts In-Stock

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$22.280

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$20.498

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IDEA Electronic Components Group

UK . 1,568 parts In-Stock

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$22.735

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$21.598

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$20.462

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ChromeModa Solutions

Germany . 474 parts In-Stock

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$22.735

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$18.643

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$24.742

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$23.505

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Kepictronics

USA . 19,991 parts In-Stock

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Lixinc

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GreenTree Electronics

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Infinite Electronics LLP (Excess)

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Robosynatics

Brazil . 5,000 parts In-Stock

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Authorized Procurement Solutions

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Lucentia Tech

USA . 5,000 parts In-Stock

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$1.010

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$1.010

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iodParts Technologies Inc.

India . 3,590 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 2,757 parts In-Stock

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Technoshack Inc. (Excess)

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Overview

Elevate your projects with the SN74LVC1G175DBVR by Texas Instruments, a top-tier manufacturer known for delivering high-quality components. As part of the Latches & Flip-Flops category, this product offers unrivaled performance and reliability. With a low propagation delay and true output polarity, this small outline package is perfect for applications requiring precision and speed. Trust in Texas Instruments to provide cutting-edge technology that meets the demands of today's fast-paced world. Experience the value and benefits of the SN74LVC1G175DBVR and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the internal components of the latch or flip-flop, increasing its longevity and reliability.

Propagation Delay At Nominal Supply: 5.7 ns

The low propagation delay ensures quick response times for the latch or flip-flop, making it suitable for high-speed applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation onto circuit boards, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup (V): 1.8

The low nominal supply voltage of 1.8V makes this latch or flip-flop energy-efficient and suitable for low-power applications.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow for the latch or flip-flop to be in three different states - high, low, and high impedance, providing flexibility in circuit design.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and high noise immunity, making it suitable for a wide range of applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C makes this latch or flip-flop suitable for use in automotive and industrial environments where temperature may vary.

Technical Specifications

Latches & Flip-Flops SN74LVC1G175DBVR attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5.7 ns

Propagation Delay (tpd):

13.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

1.6 mm

Minimum fmax:

175 MHz

Trade Compliance

SN74LVC1G175DBVR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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