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CD4013BPWRE4

Texas Instruments

CD4013BPWRE4 by Texas Instruments

CD4013BPWRE4 by Texas Instruments is a CMOS latches & flip-flops IC with 2 functions, 300 ns propagation delay at 5V. It operates b/w -55 to 125°C, suitable for military applications. With a small outline package and surface mount capability, it offers high-speed performance up to 3.5 MHz.

Median Price

$1.310

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,808 parts In-Stock

1+ parts

$1.310

100+ parts

$0.510

1k+ parts

$0.441

10k+ parts

-

3,808

$1.310

$0.510

$0.441

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$0.228

100+ parts

-

1k+ parts

-

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15

$0.228

-

-

-

Digiode

USA . 189 parts In-Stock

1+ parts

$0.484

100+ parts

-

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-

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189

$0.484

-

-

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Vyrian

USA . 4,411 parts In-Stock

1+ parts

-

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-

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4,411

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 4,201 parts In-Stock

1+ parts

$0.228

100+ parts

-

1k+ parts

-

10k+ parts

$0.221

4,201

$0.228

-

-

$0.221

Continental Prestige Electronics

USA . 2,632 parts In-Stock

1+ parts

$0.228

100+ parts

-

1k+ parts

-

10k+ parts

$0.223

2,632

$0.228

-

-

$0.223

Netroflash

USA . 50 parts In-Stock

1+ parts

$0.228

100+ parts

-

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-

50

$0.228

-

-

-

Corphita

USA . 4,190 parts In-Stock

1+ parts

$0.459

100+ parts

-

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-

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4,190

$0.459

-

-

-

Semicontronic

India . 4,630 parts In-Stock

1+ parts

$0.590

100+ parts

$0.575

1k+ parts

$0.572

10k+ parts

-

4,630

$0.590

$0.575

$0.572

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Ampacity Inc.

Singapore . 4,277 parts In-Stock

1+ parts

$0.590

100+ parts

-

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-

10k+ parts

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4,277

$0.590

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-

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Parana Technologies

USA . 442 parts In-Stock

1+ parts

$17.490

100+ parts

$1,624.238

1k+ parts

$15.741

10k+ parts

-

442

$17.490

$1,624.238

$15.741

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Corohmni

South Africa . 162 parts In-Stock

1+ parts

$19.182

100+ parts

-

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162

$19.182

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DigiPath Technology Company

USA . 2,081 parts In-Stock

1+ parts

$19.259

100+ parts

-

1k+ parts

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10k+ parts

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2,081

$19.259

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-

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ChromeModa Solutions

Germany . 4,687 parts In-Stock

1+ parts

$19.652

100+ parts

$16.115

1k+ parts

-

10k+ parts

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4,687

$19.652

$16.115

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IDEA Electronic Components Group

UK . 2,035 parts In-Stock

1+ parts

$19.652

100+ parts

$18.669

1k+ parts

$17.687

10k+ parts

-

2,035

$19.652

$18.669

$17.687

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Microchip USA

USA . 1,018 parts In-Stock

1+ parts

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1,018

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Perfect Parts

USA . 6 parts In-Stock

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6

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Overview

Enhance your electronic projects with the CD4013BPWRE4 by Texas Instruments, a reliable manufacturer known for delivering high-quality components. This versatile latch and flip-flop device offers customers the advantage of quick propagation delay, making it ideal for applications requiring fast response times. With a compact package design and dual functionality, this product is perfect for a wide range of projects. Trust in Texas Instruments for top-notch performance and innovation in every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and can withstand various environmental conditions, making the product long-lasting.

Propagation Delay At Nominal Supply: 300 ns

Low propagation delay ensures fast response times.

Surface Mount: YES

Allows for easy and secure installation on circuit boards.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage, making it compatible with most electronic systems.

Maximum Operating Temperature: 125 °C

Can function in high-temperature environments without malfunctioning.

Trigger Type: POSITIVE EDGE

Provides precise timing for triggering operations.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Maximum Frequency At Nominal Supply: 3500000 Hz

Can handle high-frequency operations efficiently.

Technical Specifications

Latches & Flip-Flops CD4013BPWRE4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

3500000 Hz

Maximum I (ol):

6.8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Maximum Power Supply Current (ICC):

.6 mA

Propagation Delay At Nominal Supply:

300 ns

Propagation Delay (tpd):

300 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latch

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

12 MHz

Trade Compliance

CD4013BPWRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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