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54F109DMQB

Texas Instruments

54F109DMQB by Texas Instruments

The Texas Instruments 54F109DMQB is a TTL technology latches & flip-flops IC with 2 functions, 10.5 ns propagation delay, and 70 MHz min fmax. It operates in military-grade temperature range (-55 to 125 °C) and has a supply voltage of 4.5-5.5 V. Ideal for applications requiring positive edge triggering and complementary output polarity in harsh environments.

Median Price

$11.206

Lifecycle Status

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25

In-Stock Inventory

1k+

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Freelance Electronics

USA . 138 parts In-Stock

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$3.604

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American Microsemiconductor Inc.

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Beltway Electronics Company

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Manoshevitz Elec. Sales

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PC Components Company LLC

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Bristol Electronics

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ACDS - Activité Composants Distribution Service

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Holdelec - ElecDif-Pro

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Prism Electronics

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Nova Conductors

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Zilex Electronics Inc.

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Mil-Aero Solutions, Inc.

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LIBRA Elektronik GmbH

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Sogenti Electronics

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Parana Technologies

USA . 1,282 parts In-Stock

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$926.920

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DigiPath Technology Company

USA . 1,676 parts In-Stock

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ChromeModa Solutions

Germany . 4,389 parts In-Stock

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IDEA Electronic Components Group

UK . 80 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,290 parts In-Stock

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AZTECH Wire

Italy . 501 parts In-Stock

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One Stop Electronics

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Semicontronic

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Argo Parts USA

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Continental Prestige Electronics

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Bastille Electronics

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Supply Digital

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RTC Component Inc.

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Overview

Unlock a world of possibilities with the Texas Instruments 54F109DMQB latches & flip-flops. Manufactured with top-quality materials and adhering to MIL-STD-883 screening levels, this versatile component boasts a fast propagation delay of 10.5 ns and a high maximum operating temperature of 125°C. Ideal for military-grade applications, this dual-function device offers a reliable solution for your circuit design needs. Experience the value and benefits of Texas Instruments' renowned expertise in semiconductor technology with the 54F109DMQB.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring a longer lifespan for the latch or flip-flop.

No. of Functions: 2

Offers versatility and flexibility in terms of functionality, allowing for multiple operations to be controlled by the device.

Package Shape: RECTANGULAR

Facilitates easy integration and placement within electronic circuits and systems.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage requirement providing compatibility with most electronic systems and components.

Propagation Delay (tpd): 10.5 ns

Fast response time ensuring efficient and timely operation of the latch or flip-flop.

Output Characteristics: 3-STATE

Allows the output to be in one of three states (high, low, or high impedance), offering flexibility in signal transmission.

Trigger Type: POSITIVE EDGE

Provides precise control over when the latch or flip-flop changes state, enhancing its reliability and accuracy.

Temperature Grade: MILITARY

Built to withstand harsh environmental conditions, making it suitable for military or industrial applications.

Technology: TTL

Utilizes transistor-transistor logic for high-speed and reliable operation, suitable for various electronic applications.

Technical Specifications

Latches & Flip-Flops 54F109DMQB attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

F/FAST

JESD-30 Code:

R-GDIP-T16

Length:

19.94 mm

Logic IC Type:

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

10.5 ns

Screening Level:

MIL-STD-883

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

70 MHz

Trade Compliance

54F109DMQB Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-171-9708, 5962011719708, 5962-01-168-6554, 5962011686554, 5962-01-226-6256, 5962012266256

NIIN

011719708, 011686554, 012266256

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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