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54F174FMQB

Texas Instruments

54F174FMQB by Texas Instruments

The Texas Instruments 54F174FMQB is a 6-bit TTL latch with a propagation delay of 12 ns and operates b/w -55 to 125 °C. It features a TRUE output polarity, POSITIVE EDGE trigger type, and MIL-STD-883 screening level. Ideal for military applications requiring fast data storage and retrieval in harsh environments.

Median Price

$6.534

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 107 parts In-Stock

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$6.534

100+ parts

$6.861

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$6.469

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Vyrian

USA . 5,544 parts In-Stock

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Anansix

USA . 2,720 parts In-Stock

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Digiode

USA . 2,335 parts In-Stock

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Resion

USA . 83 parts In-Stock

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Electronic Expediters

USA . 26 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 12 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 196 parts In-Stock

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$0.700

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Northwest PG Solutions

USA . 1,555 parts In-Stock

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$0.770

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$0.770

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Parana Technologies

USA . 1,713 parts In-Stock

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$15.697

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$16.065

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DigiPath Technology Company

USA . 52 parts In-Stock

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$17.284

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$15.902

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ChromeModa Solutions

Germany . 6,759 parts In-Stock

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$17.637

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$14.462

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IDEA Electronic Components Group

UK . 522 parts In-Stock

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$17.637

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$16.755

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$15.873

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AZTECH Wire

Italy . 766 parts In-Stock

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$18.602

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One Stop Electronics

USA . 504 parts In-Stock

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$59.000

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Corphita

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Supply Digital

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Overview

Unlock the potential of your electronic projects with the 54F174FMQB by Texas Instruments, a top-tier manufacturer known for its excellence in producing high-quality latches & flip-flops. This versatile component offers reliable performance and precision in a MIL-STD-883 screened package, making it ideal for military-grade applications. With its 3-STATE output characteristics and fast 12 ns propagation delay, this component ensures smooth operation and seamless integration into your designs. Trust Texas Instruments to deliver cutting-edge technology that exceeds your expectations and propels your projects to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This package material offers durability and protection, making the latch or flip-flop reliable for long-term use in various environments.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying the manufacturing process.

Screening Level: MIL-STD-883

Compliance with MIL-STD-883 ensures high reliability and quality standards, making this product suitable for military and aerospace applications.

Nominal Supply Voltage / Vsup (V): 5

Stable supply voltage of 5V ensures consistent performance and compatibility with standard electronics.

Propagation Delay (tpd): 12 ns

Fast propagation delay of 12 ns allows for quick signal processing, enhancing the overall speed and efficiency of the circuit.

Temperature Grade: MILITARY

Designed to withstand extreme temperatures, this latch or flip-flop is suitable for rugged military applications where reliability under harsh conditions is essential.

Technology: TTL

Using TTL technology ensures compatibility with a wide range of systems and devices, making this latch or flip-flop versatile and easy to integrate.

Technical Specifications

Latches & Flip-Flops 54F174FMQB attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

F/FAST

JESD-30 Code:

R-GDFP-F16

Length:

9.6645 mm

Logic IC Type:

No. of Bits:

6

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Propagation Delay (tpd):

12 ns

Screening Level:

MIL-STD-883

Maximum Seated Height:

2.032 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

6.604 mm

Minimum fmax:

70 MHz

Trade Compliance

54F174FMQB Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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