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54F109FM

Texas Instruments

54F109FM by Texas Instruments

The Texas Instruments 54F109FM is a TTL technology latches & flip-flops with 2 functions, 2 bits, and 10.5 ns propagation delay. It operates b/w -55 to 125 °C and has a max supply voltage of 5.5 V. Ideal for military-grade applications requiring positive edge trigger and complementary output polarity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,615 parts In-Stock

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5,615

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Digiode

USA . 2,965 parts In-Stock

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2,965

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Anansix

USA . 2,272 parts In-Stock

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2,272

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Electronic Expediters

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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Native Components

USA . 48 parts In-Stock

1+ parts

$0.635

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48

$0.635

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Northwest PG Solutions

USA . 958 parts In-Stock

1+ parts

$0.698

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958

$0.698

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AZTECH Wire

Italy . 838 parts In-Stock

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$13.637

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838

$13.637

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Parana Technologies

USA . 1,524 parts In-Stock

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$23.702

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$24.327

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1,524

$23.702

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$24.327

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DigiPath Technology Company

USA . 545 parts In-Stock

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$26.099

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545

$26.099

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IDEA Electronic Components Group

UK . 1,474 parts In-Stock

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$26.632

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$25.300

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$23.969

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1,474

$26.632

$25.300

$23.969

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ChromeModa Solutions

Germany . 70 parts In-Stock

1+ parts

$26.632

100+ parts

$21.838

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70

$26.632

$21.838

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One Stop Electronics

USA . 977 parts In-Stock

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$29.000

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977

$29.000

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Corphita

USA . 2,632 parts In-Stock

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2,632

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Supply Digital

USA . 1,679 parts In-Stock

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1,679

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Overview

Experience the precision and reliability of Texas Instruments with the 54F109FM Latches & Flip-Flops. This top-quality product offers exceptional performance and versatility, making it ideal for a wide range of applications. With a durable ceramic, glass-sealed body and advanced technology, this component ensures seamless operation and maximum efficiency. Trust Texas Instruments to deliver superior products that meet your needs and exceed your expectations. Choose the 54F109FM for unmatched quality and value in the world of electronics.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material ensures durability and protection for the internal components, making the product suitable for rugged environments.

Surface Mount: YES

Allows for easy and efficient installation on a circuit board, saving time and effort during assembly.

No. of Functions: 2

Having multiple functions in one component adds versatility to the product, allowing for more complex circuit designs.

Propagation Delay (tpd): 10.5 ns

The low propagation delay ensures quick response times, making this latch & flip-flop ideal for high-speed applications.

Temperature Grade: MILITARY

Designed to operate reliably in extreme temperature conditions, making it suitable for military or aerospace applications.

Technology: TTL

TTL technology offers reliable and consistent performance, ensuring stable operation in various electronic systems.

Technical Specifications

Latches & Flip-Flops 54F109FM attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

F/FAST

JESD-30 Code:

R-GDFP-F16

Length:

9.6645 mm

Logic IC Type:

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Propagation Delay (tpd):

10.5 ns

Maximum Seated Height:

2.032 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

6.604 mm

Minimum fmax:

70 MHz

Trade Compliance

54F109FM Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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