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74LVC1G74DP-Q100,125

NXP Semiconductors

74LVC1G74DP-Q100,125 by NXP Semiconductors

NXP Semiconductors' 74LVC1G74DP-Q100,125 is a CMOS latch with 13.4 ns propagation delay and operates b/w -40 to 125 °C. Ideal for automotive applications, it features a positive edge trigger, dual terminal position, and compl output polarity.

Median Price

$12.184

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 25,722 parts In-Stock

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$0.170

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Adafruit Industries

USA . 5,000 parts In-Stock

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$24.197

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$22.987

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$22.987

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5,000

$24.197

$22.987

$22.987

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Distributors (In-Stock)

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Digiode

USA . 1,617 parts In-Stock

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$0.162

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Vyrian

USA . 15,138 parts In-Stock

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VNN

France . 5,267 parts In-Stock

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Anansix

USA . 2,734 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 15,293 parts In-Stock

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$0.145

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$0.141

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$0.141

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Ampacity Inc.

Singapore . 15,289 parts In-Stock

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$0.145

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Corphita

USA . 2,858 parts In-Stock

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$0.153

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Corohmni

South Africa . 189 parts In-Stock

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$28.189

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QUARKTWIN TECHNOLOGY LTD

USA . 11,554 parts In-Stock

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UNI Independent Distributors

Spain . 5,653 parts In-Stock

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Microchip USA

USA . 4,019 parts In-Stock

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Continental Prestige Electronics

USA . 2,783 parts In-Stock

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Argo Parts USA

USA . 1,312 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the 74LVC1G74DP-Q100,125 by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors delivers cutting-edge latches & flip-flops like no other. This versatile component is perfect for automotive applications, offering a wide range of benefits such as high performance, low power consumption, and exceptional durability. Trust NXP Semiconductors to provide you with top-of-the-line products that exceed your expectations every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures long-lasting performance and reliability.

Surface Mount: YES

Easy to install and saves space on the PCB.

Screening Level: AEC-Q100

Suitable for automotive applications, ensuring high quality and reliability.

Nominal Supply Voltage / Vsup (V): 1.8

Operates efficiently at a low voltage, saving power.

Propagation Delay (tpd): 13.4 ns

Fast response time for quick signal processing.

Trigger Type: POSITIVE EDGE

Precise triggering mechanism for accurate operation.

Output Polarity: COMPLEMENTARY

Provides complementary outputs for versatile circuit design.

Technology: CMOS

Low power consumption and high noise immunity.

Technical Specifications

Latches & Flip-Flops 74LVC1G74DP-Q100,125 attributes and parameters. Explore more Latches & Flip-Flops devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

Logic IC Type:

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Propagation Delay (tpd):

13.4 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

3 mm

Minimum fmax:

200 MHz

Trade Compliance

74LVC1G74DP-Q100,125 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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