Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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NXP Semiconductors' 74LVC1G74GT,115 is a CMOS latch with 5.9 ns propagation delay at 1.8V, suitable for automotive applications. It has a max frequency of 175 MHz and operates b/w -40 to 125°C, making it ideal for high-speed and temperature-sensitive circuits in compact designs.
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This material provides durability and protection for the latch, making it suitable for various industrial applications.
This low propagation delay ensures fast and efficient operation of the latch, ideal for applications requiring quick response times.
This feature allows for easy integration onto circuit boards, saving space and simplifying installation processes.
The rectangular shape of the package provides a compact design, making it suitable for applications with limited space constraints.
The low supply voltage requirement makes this latch energy-efficient and compatible with a wide range of power sources.
This voltage range allows for compatibility with common power supplies, ensuring ease of integration into existing systems.
The ample number of terminals enables the latch to connect to multiple components, enhancing its versatility and functionality.
This compact package style is suitable for applications where space is limited, making it a convenient choice for compact designs.
The high maximum output current capability of the latch makes it suitable for applications requiring the control of high-power loads.
This low propagation delay ensures rapid signal processing, making the latch ideal for high-speed applications.
Latches & Flip-Flops 74LVC1G74GT,115 attributes and parameters. Explore more Latches & Flip-Flops devices from NXP Semiconductors
Family:
JESD-30 Code:
JESD-609 Code:
Length:
Logic IC Type:
Maximum Frequency At Nominal Supply:
Maximum I (ol):
Moisture Sensitivity Level (MSL):
No. of Bits:
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Output Polarity:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Packing Method:
Peak Reflow Temperature (C):
Power Supplies (V):
Propagation Delay At Nominal Supply:
Propagation Delay (tpd):
Qualification:
Maximum Seated Height:
Sub-Category:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
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Maximum Time At Peak Reflow Temperature (s):
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Width:
Minimum fmax:
74LVC1G74GT,115 Logic ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - 74LVCYYY 15/Jan/2017
PCN Assembly/Origin - MulT Dev A/T Mat Chg 7/Jul/2021
PCN Packaging - Pack/Label Update 30/Nov/2016 All Dev Label Chgs 2/Aug/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
1N4148
Continental Device India
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Good-ark Electronics
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V; No. of Phases: 1;
SMBJ18CA
World Products
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M24308/2-1F
Esterline Technologies
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mounting Option-1: HOLE .115-.125; Mounting Type: CABLE AND PANEL; Mating Contact Finish: NOT SPECIFIED;
BAV99
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Vishay Semiconductors
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
Linear Technology
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Operating Temperature (TJ-Min): 0 Cel; No. of Functions: 1; JESD-609 Code: e0;
Souriau-sunbank Connection Technologies
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Body Length: 1.228 inch; Mounting Type: CABLE AND PANEL; Termination Type: CRIMP;
LM358DT
STMicroelectronics
LM358DT by STMicroelectronics is a dual operational amplifier with a max input offset voltage of 9000 uV. It operates at a nominal voltage of 5V and has a min voltage gain of 25000. This amplifier is commonly used in applications requiring high precision and low power consumption.
MBRS1100T3G
Onsemi
MBRS1100T3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.75V. It operates in temperatures ranging from -65 to 175°C, making it suitable for power applications. With a reverse test voltage of 100V, this diode is ideal for high-power circuits requiring efficient rectification.
2N7002
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Operating Mode: ENHANCEMENT MODE; Maximum Drain Current (ID): .115 A;
BAV99-7-F
Multicomp Pro
2N2222A
Secos
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .6 A; JEDEC-95 Code: TO-92;
SS14
Vishay Intertechnology
Vishay Intertechnology's SS14 is a Schottky rectifier diode with a max forward voltage of 0.5V and output current of 1A. Operating at up to 125°C, it has a repetitive peak reverse voltage of 40V. Ideal for surface mount applications, it suits various electronic circuits requiring efficient rectification and low forward voltage drop.
1N4148WS-7-F
Diodes Incorporated
1N4148WS-7-F by Diodes Inc. is a single rectifier diode with max reverse recovery time of 0.004 us and max reverse current of 1 uA. It operates b/w -65 to 150 °C, ideal for applications requiring small outline surface mount diodes with a max output current of 0.15 A.
NDT2955
National Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; JESD-609 Code: e0; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
MBRA340T3G
MBRA340T3G by Onsemi is a Schottky rectifier diode with 40V reverse test voltage and 3A max output current. Ideal for power applications, it operates b/w -55 to 150°C, features matte tin terminal finish, and comes in a small outline package.
Littelfuse
Eic Semiconductor
Allegro MicroSystems
RECTIFIER DIODE; Terminal Position: END; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SN74AC74D
Texas Instruments
SN74AC74D by Texas Instruments is a dual-function latches & flip-flops IC with 14.5ns propagation delay, suitable for industrial applications. Operating at 3V, it has a max frequency of 95MHz and low power consumption of 0.02mA ICC. This CMOS technology chip offers positive edge triggering and compl output polarity in a small outline package.
74LVC2G74GN
NXP Semiconductors
NXP Semiconductors' 74LVC2G74GN is a CMOS latch with positive edge trigger. It operates b/w -40 to 125 °C, with Vsup ranging from 1.65V to 5.5V. With a propagation delay of 13.4ns and max fmax of 200MHz, it's ideal for automotive applications requiring fast signal processing in compact designs.
74HC74D-Q100,653
NXP Semiconductors' 74HC74D-Q100,653 is a CMOS latch with 2 functions, operating at 5V. It has a propagation delay of 265ns and can handle temperatures from -40 to 125°C. Ideal for automotive applications due to AEC-Q100 screening level.
CD74HC173E
Rochester Electronics
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Shape: RECTANGULAR; Propagation Delay (tpd): 300 ns;
74VHC175MTCX
Fairchild Semiconductor
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
74LCX112MTCX
J-K FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
CD4027BE
Harris Semiconductor
J-K FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
MC74HC73ADR2G
MC74HC73ADR2G by Onsemi is a dual-function latch with 2 bits, operating at 5V. It has a propagation delay of 190ns and can handle load capacitance of 50pF. Ideal for applications requiring negative edge triggering in military-grade environments.
CD40174BEE4
CD40174BEE4 by Texas Instruments is a 6-bit latches & flip-flops IC with 300 ns propagation delay at 5V. It operates b/w -55 to 125 °C and supports a max frequency of 3.5 MHz. Ideal for military-grade applications requiring positive edge triggering in a compact IN-LINE package.
SN74LS76AN3
SN74LS76AN3 by Texas Instruments is a TTL technology latch with 2 functions, 2 bits, and 20 ns propagation delay. It operates at a supply voltage of 5V and has a trigger type of negative edge for commercial applications requiring fast data storage and retrieval.
Thomson Consumer Electronics
J-K FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
SN54LS374JB
Monolithic Memories
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
SN74LVC2G74DCTRG4
SN74LVC2G74DCTRG4 by Texas Instruments is a latches & flip-flops IC with 5.9 ns propagation delay, operating at 1.8V nominal voltage and 3.3V power supplies. It features a small outline package suitable for automotive applications due to its wide temperature range and low profile design.
SN74LS273N
D FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
CD74ACT175M
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
74HC74D
Toshiba
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
SN74LVC74APWT
SN74LVC74APWT by Texas Instruments is a dual-function latch with 5.2ns propagation delay, ideal for automotive applications. Operating at 1.8V to 3.6V, it features complementary output polarity and a max frequency of 150MHz. With a small outline package style and thin profile, this CMOS technology flip-flop is suitable for surface mount designs in various electronic systems.
74HCT373N
Philips Semiconductors
D LATCH; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
74VHC273MTCX
74VHC273MTCX by Onsemi is an 8-bit latch with a propagation delay of 12.5 ns at 3.3 V, suitable for industrial applications. It operates on a supply voltage range of 2-5.5 V, has a max frequency of 75 MHz, and features positive edge triggering. This surface-mount device comes in a small outline package with dual terminals and Gull Wing form.
HEF4013BTD
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
74LVC1G74DC,125
Nexperia
D FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: VSSOP; Package Shape: RECTANGULAR;
NXP Semiconductors' 74LVC1G74DC,125 is a latch with 5.9ns propagation delay at 1.8V, suitable for automotive applications. It operates b/w -40 to 125°C, has a max frequency of 175MHz, and supports surface mount with a small outline package style.
74LVC1G74DP,125
NXP Semiconductors' 74LVC1G74DP,125 is a latch with 5.9ns propagation delay and 1.8V nominal voltage. It features positive edge trigger, -40 to 125°C operating temperature range, and is suitable for automotive applications due to its small outline package design.
D FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;
74LVC1G74DC-Q100,125
NXP Semiconductors' 74LVC1G74DC-Q100,125 is a CMOS latch with 13.4 ns propagation delay and operates b/w -40 to 125 °C. It features positive edge trigger, complementary output polarity, and AEC-Q100 screening level for automotive applications.
74LVC1G175GW,125
D FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
NXP Semiconductors' 74LVC1G175GW,125 is a CMOS latch with 7.5ns propagation delay and 175MHz max frequency. Ideal for automotive applications, it operates at -40 to 125°C with a supply voltage range of 1.65-5.5V, featuring a small outline package and dual terminals for compact designs.
74LVC1G175GV,125
NXP Semiconductors' 74LVC1G175GV,125 is a CMOS latch with 7.5ns propagation delay and 175MHz max frequency. Operating at -40 to 125°C, it's ideal for automotive applications requiring positive edge triggering in a compact SOT package.
74LVC1G74GT,115
D FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR;
74LVC1G74DP-Q100,125
NXP Semiconductors' 74LVC1G74DP-Q100,125 is a CMOS latch with 13.4 ns propagation delay and operates b/w -40 to 125 °C. Ideal for automotive applications, it features a positive edge trigger, dual terminal position, and compl output polarity.
74LVC1G175GW-Q100,125
NXP Semiconductors' 74LVC1G175GW-Q100,125 is a CMOS latch with positive edge trigger. It operates at temperatures from -40 to 125°C and has a propagation delay of 17ns. This small outline flip-flop is ideal for automotive applications due to its AEC-Q100 screening level.
74LVC1G175GW-Q100H
74LVC1G175GW-Q100H by NXP Semiconductors is a D flip-flop logic IC with a propagation delay of 17 ns. It operates at a nominal voltage of 3.3V and has a temperature grade suitable for automotive applications. This small outline, thin profile package with gull wing terminals is ideal for space-constrained designs requiring high-speed operation.
74LVC1G74DP-Q100H
NXP Semiconductors' 74LVC1G74DP-Q100H is a CMOS latch with 5.9 ns propagation delay, suitable for automotive applications. It operates at 1.8V nominal voltage and has a max frequency of 175MHz, making it ideal for high-speed triggering in automotive electronics. The small outline package with thin profile and shrink pitch design offers space-saving benefits for compact circuit layouts.
74LVC1G74DC-Q100H
74LVC1G79GW,125
D FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 5; Package Code: TSSOP; Package Shape: RECTANGULAR;
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