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74LVC1G175GV,125

NXP Semiconductors

74LVC1G175GV,125 by NXP Semiconductors

NXP Semiconductors' 74LVC1G175GV,125 is a CMOS latch with 7.5ns propagation delay and 175MHz max frequency. Operating at -40 to 125°C, it's ideal for automotive applications requiring positive edge triggering in a compact SOT package.

Median Price

$0.160

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

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Chip1Stop

Japan . 2,980 parts In-Stock

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Mouser Electronics

USA . 6,866 parts In-Stock

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$0.160

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$0.074

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$0.066

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$0.053

6,866

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$0.074

$0.066

$0.053

DigiKey

USA . 2,572 parts In-Stock

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$0.160

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$0.080

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$0.066

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$0.055

2,572

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$0.080

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Newark

USA . 2,242 parts In-Stock

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Future Electronics

Canada . 15,000 parts In-Stock

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Element14

Singapore . 1,592 parts In-Stock

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Arrow

USA . 437 parts In-Stock

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Verical

USA . 437 parts In-Stock

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Digiode

USA . 51 parts In-Stock

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TME

Poland . 8,830 parts In-Stock

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$0.110

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$0.082

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$0.066

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$0.063

8,830

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$0.082

$0.066

$0.063

Nova Conductors

Japan . 100 parts In-Stock

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Chip Stock

USA . 184,000 parts In-Stock

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IBS Electronics

USA . 15,000 parts In-Stock

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$0.285

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NAC Semi

USA . 12,000 parts In-Stock

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Vyrian

USA . 2,449 parts In-Stock

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VNN

France . 1,043 parts In-Stock

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Anansix

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J2 Sourcing AB

Sweden . 505 parts In-Stock

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Semicontronic

India . 15,224 parts In-Stock

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$0.045

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$0.044

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$0.044

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Ampacity Inc.

Singapore . 8,218 parts In-Stock

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Corphita

USA . 2,058 parts In-Stock

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Argo Parts USA

USA . 164 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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AZTECH Wire

Italy . 3,300 parts In-Stock

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Continental Prestige Electronics

USA . 3,819 parts In-Stock

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$0.457

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3,819

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Aztec Data Supply Inc.

USA . 4,831 parts In-Stock

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$11.770

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Modulus Dynamics

Lithuania . 3,324 parts In-Stock

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Corohmni

South Africa . 1,305 parts In-Stock

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$24.158

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$22.950

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GreenTree Electronics

Israel . 21,000 parts In-Stock

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Perfect Parts

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Kepictronics

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Glotronic Ltd.

UK . 7,200 parts In-Stock

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UNI Independent Distributors

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Robosynatics

Brazil . 3,657 parts In-Stock

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Lucentia Tech

USA . 3,657 parts In-Stock

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$13.530

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Supply Digital

USA . 706 parts In-Stock

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Overview

Elevate your electronics with the 74LVC1G175GV,125 from NXP Semiconductors. As a leader in the industry, NXP guarantees top-notch quality and reliability in their products. This versatile latch & flip-flop component is perfect for a range of applications, offering lightning-fast propagation delay and a compact design that saves space. With a wide supply voltage range and impressive frequency capabilities, this product delivers exceptional performance while ensuring seamless integration into any project. Upgrade your devices with NXP's cutting-edge technology and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the latch or flip-flop.

Propagation Delay At Nominal Supply: 7.5 ns

Low propagation delay ensures fast operation and response times, making this product suitable for high-speed applications.

Surface Mount: YES

Allows for easy and secure mounting on PCBs, saving space and simplifying the assembly process.

Trigger Type: POSITIVE EDGE

Positive edge triggering ensures stable and reliable operation in digital systems, reducing the risk of timing issues.

Maximum Frequency At Nominal Supply: 175000000 Hz

High maximum frequency allows for efficient operation in high-speed applications such as data processing or communication systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Technical Specifications

Latches & Flip-Flops 74LVC1G175GV,125 attributes and parameters. Explore more Latches & Flip-Flops devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

175000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

7.5 ns

Propagation Delay (tpd):

17 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

1.5 mm

Minimum fmax:

200 MHz

Trade Compliance

74LVC1G175GV,125 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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