Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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NXP Semiconductors' 74LVC1G74DP,125 is a latch with 5.9ns propagation delay and 1.8V nominal voltage. It features positive edge trigger, -40 to 125°C operating temperature range, and is suitable for automotive applications due to its small outline package design.
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The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it a reliable choice.
With a low propagation delay, this product offers fast and efficient operation in various applications.
Being surface mountable allows for easy and convenient installation, saving time and effort during assembly.
The square package shape provides a compact design, suitable for space-constrained applications.
Operating at a low nominal supply voltage of 1.8V results in energy efficiency and reduced power consumption.
With multiple power supply options at 3.3V, this product offers versatility and compatibility with various systems.
The ample number of terminals allows for versatile connectivity options, increasing flexibility in circuit design.
The compact and slim package style provides a space-saving solution for tight layouts.
The high maximum output current of 24A ensures robust performance and the capability to drive demanding loads.
The low propagation delay of 13.4ns contributes to high-speed operation and improved system response time.
With a high maximum operating temperature of 125°C, this product can withstand elevated temperatures, making it suitable for harsh environments.
The positive edge trigger type ensures precise timing and accurate signal triggering for reliable operation.
With a minimum operating temperature of -40°C, this product can function effectively in cold environments.
The use of nickel, palladium, and gold terminal finish provides excellent conductivity and corrosion resistance for reliable connections.
Dual terminal positions offer increased flexibility in PCB layout and component placement.
The low maximum seated height of 1.1mm contributes to a compact and space-efficient design.
The slim width of 3mm allows for easy integration into various equipment and systems.
Complementary output polarity ensures compatibility with a wide range of devices and simplifies circuit design.
Operating at a minimum supply voltage of 1.65V enables energy-efficient performance and extends battery life in portable devices.
The maximum time allowed at peak reflow temperature of 30 seconds ensures proper soldering and reliability during assembly.
With a peak reflow temperature of 260°C, this product can withstand standard soldering processes without compromising performance.
The compact length of 3mm contributes to a space-saving design ideal for compact devices and applications.
Designed for automotive applications, this product meets stringent temperature requirements and reliability standards for automotive use.
With a high maximum frequency of 175MHz at nominal supply, this product is suitable for high-speed applications and data processing.
The CMOS technology utilized in this product offers low power consumption, high noise immunity, and reliable performance in various digital applications.
The gull-wing terminal form provides secure solder connections and enables easy PCB mounting for efficient assembly.
The TR packing method ensures safe transportation and storage, protecting the product from damage or contamination.
The small terminal pitch of 0.65mm allows for high-density mounting and compact PCB layout, saving space in circuit designs.
The minimum fmax frequency of 200MHz guarantees reliable high-speed operation and performance in demanding applications.
With a maximum supply voltage of 5.5V, this product offers compatibility with a wide range of systems and power sources.
Latches & Flip-Flops 74LVC1G74DP,125 attributes and parameters. Explore more Latches & Flip-Flops devices from NXP Semiconductors
Family:
JESD-30 Code:
JESD-609 Code:
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74LVC1G74DP,125 Logic ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Assembly/Origin - Mult Dev Wire Chg 28/Jun/2019
PCN Packaging - All Dev Label Chgs 2/Aug/2020 Label Chg 12/Mar/2017
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
BSS138
Siemens
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain-Source On Resistance: 3.5 ohm; Terminal Finish: Tin/Lead (Sn/Pb);
DS18B20Z
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Housing: PLASTIC; Maximum Accuracy (Cel): 0.50;
FDN5618P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Moisture Sensitivity Level (MSL): 1;
1N4148WS
General Instrument
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Grande Electronics
LM317TG
Onsemi
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Minimum Input-Output Voltage Differential: 3 V; Qualification Status: Not Qualified; No. of Functions: 1;
SMBJ18CA
Multicomp Pro
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Diode Element Material: SILICON; Technology: AVALANCHE; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V;
DS18B20Z+T&R
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Body Material: PLASTIC/EPOXY;
ULN2803ADWG4
Texas Instruments
ULN2803ADWG4 by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates at temperatures ranging from -40 to 85°C and has a max supply voltage of 3V. Ideal for applications requiring sink current flow direction in a small outline package style.
43025-0400
Molex
The Molex 43025-0400 is a board connector with 4 contacts, 2 rows, and a mating contact pitch of 0.118". It has a body length of 0.27", insulation resistance of 1Gohm, and operates b/w -40 to 105°C. Ideal for commercial applications requiring a female connector with crimp termination and UL94V-0 flammability rating.
Silicon Standard
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Crystalonics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
ATMEGA328P-AU
Microchip Technology
ATMEGA328P-AU by Microchip: 8-bit RISC CPU, 20 MHz clock, 23 I/O lines. Ideal for industrial applications with SPI, TWI, USART connectivity and low power mode. Features include 2048 RAM bytes, 1024 EEPROM size, and 16384 ROM words.
Dionics-usa
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2803A
STMicroelectronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; No. of Elements: 8; Minimum DC Current Gain (hFE): 1000;
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
Daco Semiconductor
LM555CN
Rochester Electronics
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Shape: RECTANGULAR; Surface Mount: NO; No. of Functions: 1;
74VHC273MTCX
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR;
5962-9321701QRA
Qp Semiconductor
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
74HC74N
Nexperia
D FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;
SN74LS75N
SN74LS75N by Texas Instruments is a TTL latch with 2 bits, 40 ns propagation delay, and 15 pF load capacitance. It operates at a nominal voltage of 5V and has a max power supply current of 53 mA. Ideal for applications requiring high-speed data storage and transfer in commercial temperature environments.
CD4027BE
Intersil
J-K FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
SN74LS377N
Motorola
D FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
74LVC2G74DP
Philips Semiconductors
D FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR;
SN74LS259BN
SN74LS259BN by Texas Instruments is an 8-bit latch with a propagation delay of 30ns at 5V. It operates in commercial temperature range, has a max power supply current of 36mA, and uses TTL technology. Ideal for applications requiring low-level trigger type latches & flip-flops.
74AUP1G80GS,132
NXP Semiconductors
NXP Semiconductors' 74AUP1G80GS,132 is a CMOS latch with 6 terminals and a supply voltage range of 1.2-3.3V. It has a propagation delay of 27.2ns, operates in automotive temperatures (-40 to 125°C), and supports a max frequency of 510MHz. Ideal for applications requiring positive edge triggers in compact designs with low power consumption.
CD4043BEX
R-S LATCH; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
SN74ALS273N
SN74ALS273N by Texas Instruments is an 8-bit latch with a propagation delay of 15 ns at 5V. It operates on TTL technology, has a max frequency of 35 MHz, and is commonly used in commercial applications requiring positive edge triggering.
SN74HC259DT
SN74HC259DT by Texas Instruments is an 8-bit latches & flip-flops IC with a propagation delay of 28ns at 5V. It operates within a temperature range of -40 to 85°C, suitable for industrial applications. With a small outline package style and surface mount capability, it offers true output polarity and low-level trigger type for efficient performance.
74AUP1G74DC,125
D FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: VSSOP; Package Shape: RECTANGULAR;
QS74FCT2823CTQ
Integrated Device Technology
QS74FCT2823CTQ by Integrated Device Technology is a CMOS latch with 9 functions, 6ns propagation delay at 5V. It operates in commercial temperature range of 0-70°C, has a max frequency of 83.3MHz, and features a small outline package for surface mount applications.
CD74HC377PWR
CD74HC377PWR by Texas Instruments is a CMOS latch with 8 bits and a propagation delay of 53 ns. It operates at a nominal voltage of 5V and has a max frequency of 20 MHz. This latch is commonly used in military-grade applications due to its temperature grade and moisture sensitivity level.
SN74HC74PWLE
SN74HC74PWLE by Texas Instruments is a dual latches & flip-flops IC with 2 functions, operating at 5V. It features a propagation delay of 220ns, max frequency of 25MHz, and can handle load capacitance of 50pF. Ideal for industrial applications requiring positive edge triggering in a compact SOT package.
SN74LVC1G79DBVRG4
SN74LVC1G79DBVRG4 by Texas Instruments is a latch with 5ns propagation delay, 20.5ns tpd, and 24A max Iol. It operates at a voltage range of 1.65V to 5.5V, making it ideal for industrial applications requiring fast signal processing in compact designs. This small-outline flip-flop is surface-mountable and features positive edge triggering for efficient digital circuitry.
74HC74PW,112
D FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: TSSOP; Package Shape: RECTANGULAR;
CD4043BE
R-S LATCH; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
SN74HC74DTG4
SN74HC74DTG4 by Texas Instruments is a dual-function latch with 2 functions, operating at 5V. It has a propagation delay of 220ns and can handle load capacitance up to 50pF. Ideal for industrial applications requiring positive edge triggering, this CMOS technology flip-flop comes in a small outline package with surface mount capability.
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74LVC1G74DC,125
NXP Semiconductors' 74LVC1G74DC,125 is a latch with 5.9ns propagation delay at 1.8V, suitable for automotive applications. It operates b/w -40 to 125°C, has a max frequency of 175MHz, and supports surface mount with a small outline package style.
74LVC1G74DP,125
D FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;
74LVC1G74DC-Q100,125
NXP Semiconductors' 74LVC1G74DC-Q100,125 is a CMOS latch with 13.4 ns propagation delay and operates b/w -40 to 125 °C. It features positive edge trigger, complementary output polarity, and AEC-Q100 screening level for automotive applications.
74LVC1G175GW,125
D FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
NXP Semiconductors' 74LVC1G175GW,125 is a CMOS latch with 7.5ns propagation delay and 175MHz max frequency. Ideal for automotive applications, it operates at -40 to 125°C with a supply voltage range of 1.65-5.5V, featuring a small outline package and dual terminals for compact designs.
74LVC1G175GV,125
NXP Semiconductors' 74LVC1G175GV,125 is a CMOS latch with 7.5ns propagation delay and 175MHz max frequency. Operating at -40 to 125°C, it's ideal for automotive applications requiring positive edge triggering in a compact SOT package.
74LVC1G74GT,115
D FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR;
NXP Semiconductors' 74LVC1G74GT,115 is a CMOS latch with 5.9 ns propagation delay at 1.8V, suitable for automotive applications. It has a max frequency of 175 MHz and operates b/w -40 to 125°C, making it ideal for high-speed and temperature-sensitive circuits in compact designs.
74LVC1G74DP-Q100,125
NXP Semiconductors' 74LVC1G74DP-Q100,125 is a CMOS latch with 13.4 ns propagation delay and operates b/w -40 to 125 °C. Ideal for automotive applications, it features a positive edge trigger, dual terminal position, and compl output polarity.
74LVC1G175GW-Q100,125
NXP Semiconductors' 74LVC1G175GW-Q100,125 is a CMOS latch with positive edge trigger. It operates at temperatures from -40 to 125°C and has a propagation delay of 17ns. This small outline flip-flop is ideal for automotive applications due to its AEC-Q100 screening level.
74LVC1G175GW-Q100H
74LVC1G175GW-Q100H by NXP Semiconductors is a D flip-flop logic IC with a propagation delay of 17 ns. It operates at a nominal voltage of 3.3V and has a temperature grade suitable for automotive applications. This small outline, thin profile package with gull wing terminals is ideal for space-constrained designs requiring high-speed operation.
74LVC1G74DP-Q100H
NXP Semiconductors' 74LVC1G74DP-Q100H is a CMOS latch with 5.9 ns propagation delay, suitable for automotive applications. It operates at 1.8V nominal voltage and has a max frequency of 175MHz, making it ideal for high-speed triggering in automotive electronics. The small outline package with thin profile and shrink pitch design offers space-saving benefits for compact circuit layouts.
74LVC1G74DC-Q100H
74LVC1G79GW,125
D FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 5; Package Code: TSSOP; Package Shape: RECTANGULAR;
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