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74LVC1G175GV-Q100,125

NXP Semiconductors

74LVC1G175GV-Q100,125 by NXP Semiconductors

74LVC1G175GV-Q100,125 by NXP Semiconductors is a CMOS latch with positive edge trigger. It has a propagation delay of 17 ns and operates at temperatures up to 125°C. This small outline, thin profile package is commonly used in automotive applications.

Median Price

$0.061

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,000 parts In-Stock

1+ parts

$0.061

100+ parts

$0.057

1k+ parts

$0.052

10k+ parts

$0.052

3,000

$0.061

$0.057

$0.052

$0.052

Distributors (In-Stock)

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Nova Conductors

Japan . 200 parts In-Stock

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$0.056

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200

$0.056

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Digiode

USA . 4,497 parts In-Stock

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$0.058

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4,497

$0.058

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VNN

France . 27,045 parts In-Stock

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Vyrian

USA . 5,113 parts In-Stock

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Anansix

USA . 981 parts In-Stock

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981

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,837 parts In-Stock

1+ parts

$0.052

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2,837

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Corphita

USA . 2,657 parts In-Stock

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$0.055

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Argo Parts USA

USA . 1,878 parts In-Stock

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$0.056

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$0.054

1,878

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Netroflash

USA . 500 parts In-Stock

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$0.056

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$0.055

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Continental Prestige Electronics

USA . 267 parts In-Stock

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267

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$0.055

AZTECH Wire

Italy . 8,057 parts In-Stock

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$0.060

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$0.060

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Semicontronic

India . 2,675 parts In-Stock

1+ parts

$0.113

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$0.110

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$0.110

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Microchip USA

USA . 4,263 parts In-Stock

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$0.390

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$0.390

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UNI Independent Distributors

Spain . 1,584 parts In-Stock

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Supply Digital

USA . 293 parts In-Stock

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Overview

Discover the unbeatable quality and reliability of NXP Semiconductors with the 74LVC1G175GV-Q100,125 latch flip-flop. This cutting-edge component is perfect for a wide range of applications, offering exceptional performance and value. With its small outline and thin profile design, it's easy to integrate into any project. Benefit from its true output polarity and positive edge trigger type for seamless operation. Whether you're working in automotive or other industries, this CMOS technology marvel is ready to exceed your expectations. Unlock limitless possibilities with the NXP 74LVC1G175GV-Q100,125.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to physical damage, making this product suitable for various environments.

Surface Mount: YES

The surface mount feature enables easy installation and integration onto circuit boards, facilitating efficient manufacturing processes.

No. of Functions: 1

With a single function, this latch or flip-flop simplifies circuit design, reducing complexity and enhancing overall system reliability.

Screening Level: AEC-Q100

Being AEC-Q100 compliant guarantees that this product meets automotive industry standards for performance and reliability, making it ideal for automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space, making it suitable for compact designs and enabling greater flexibility in product layouts.

No. of Bits: 1

This latch or flip-flop operates on a single bit, making it well-suited for applications that require basic storage and switching functionality.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V offers compatibility with a wide range of electronic systems, ensuring seamless integration and compatibility.

No. of Terminals: 6

With 6 terminals, this latch or flip-flop provides sufficient connectivity options, allowing for easy interfacing with other components and peripherals.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small outline and thin profile of this package style enables space-saving installation, providing versatility in compact electronic systems.

Propagation Delay (tpd): 17 ns

This fast propagation delay of 17 ns ensures quick response times in high-speed applications, enhancing overall system performance.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C enhances the versatility of this product, allowing it to perform reliably in demanding environments.

Trigger Type: POSITIVE EDGE

The positive edge trigger type enables precise control and synchronization of the latch or flip-flop's output, ensuring accurate timing in digital circuits.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product can withstand extreme cold conditions, making it suitable for a wide range of environments.

Terminal Position: DUAL

The dual terminal position enables flexible and convenient PCB layout options, accommodating different design requirements and enhancing ease of use.

Maximum Seated Height: 1.1 mm

With a maximum seated height of 1.1 mm, this product is compact and low-profile, enabling its usage in space-constrained applications.

Width: 1.5 mm

The narrow width of 1.5 mm allows for efficient utilization of board space, especially in designs with tight dimensional constraints.

Output Polarity: TRUE

With a true output polarity, this latch or flip-flop provides a logical high or true output state when activated, facilitating easy interfacing with other digital components.

Minimum Supply Voltage (Vsup): 1.65 V

The minimum supply voltage of 1.65V allows for compatibility with low-power applications, maximizing energy efficiency and extending battery life.

Length: 2.9 mm

With a length of 2.9 mm, this product maintains a compact form factor, enabling seamless integration into various electronic systems and minimizing space requirements.

Temperature Grade: AUTOMOTIVE

Having an automotive temperature grade ensures that this product can operate reliably under the temperature fluctuations experienced in automotive environments.

Technology: CMOS

The use of CMOS technology in this latch or flip-flop ensures low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Terminal Form: GULL WING

The gull wing terminal form simplifies the soldering and mounting process, enhancing ease of use during assembly and ensuring secure connections.

Terminal Pitch: 0.95 mm

With a terminal pitch of 0.95 mm, this product offers compatibility with standard PCB layouts, enabling easy integration with existing electronic designs.

Minimum fmax: 200 MHz

The minimum fmax of 200 MHz ensures that this latch or flip-flop can handle high-frequency signals, making it suitable for applications requiring fast data processing.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, this latch or flip-flop can tolerate higher voltage levels, providing flexibility in system design and compatibility with different power sources.

Technical Specifications

Latches & Flip-Flops 74LVC1G175GV-Q100,125 attributes and parameters. Explore more Latches & Flip-Flops devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

Length:

2.9 mm

Logic IC Type:

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Propagation Delay (tpd):

17 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

1.5 mm

Minimum fmax:

200 MHz

Trade Compliance

74LVC1G175GV-Q100,125 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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