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MC100EP131FA

Onsemi

MC100EP131FA by Onsemi

MC100EP131FA by Onsemi is a 4-bit latch with 0.6 ns propagation delay, operating at -40 to 85 °C. It has a supply voltage of 3.3V and can handle up to 5.5V. Ideal for high-speed applications in industrial settings due to its ECL technology and max frequency of 3GHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Vyrian

USA . 4,740 parts In-Stock

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Digiode

USA . 1,363 parts In-Stock

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Nova Conductors

Japan . 46 parts In-Stock

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Mentor Electronics Marketing, LLC

USA . 11 parts In-Stock

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Inland Empire Components Inc.

USA . 10 parts In-Stock

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Connector Distribution Corp

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Right Parts Inc.

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Prism Electronics

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Benley Electronics

USA . 22 parts In-Stock

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$0.250

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AZTECH Wire

Italy . 244 parts In-Stock

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$11.988

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Ampacity Inc.

Singapore . 428 parts In-Stock

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$36.000

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QUARKTWIN TECHNOLOGY LTD

USA . 6,212 parts In-Stock

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SupplyDigital Components

Austria . 5,686 parts In-Stock

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Continental Prestige Electronics

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Kulean Microsystems

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Argo Parts USA

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TANS Electronics

Latvia . 1,851 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Problanco Electronics

Mexico . 927 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 724 parts In-Stock

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Metaverse IC Inc.

Canada . 323 parts In-Stock

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Corohmni

South Africa . 205 parts In-Stock

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Microchip USA

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Bastille Electronics

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Overview

Unleash the power of precision with the MC100EP131FA by Onsemi. Crafted with excellence and expertise, this latches & flip-flops device offers unparalleled performance in a variety of applications. Designed for reliability and efficiency, this product delivers seamless operation and high-speed functionality, making it the perfect choice for those seeking top-notch quality. Elevate your projects with the MC100EP131FA and experience the advantage of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the latch & flip-flop lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

With surface mount capability, the latch & flip-flop can be easily mounted onto circuit boards, saving space and simplifying installation.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V ensures compatibility with a wide range of systems and power sources, making it versatile in various applications.

Propagation Delay (tpd): 0.6 ns

The low propagation delay of 0.6 ns means that the latch & flip-flop can operate quickly and efficiently, ensuring fast response times in data processing.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this latch & flip-flop can withstand high temperature environments, making it suitable for industrial use.

Maximum Frequency At Nominal Supply: 3000000000 Hz

The high maximum frequency at the nominal supply voltage allows for rapid data processing speed, making this latch & flip-flop suitable for high-performance applications.

Technical Specifications

Latches & Flip-Flops MC100EP131FA attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

100E

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e0

Length:

7 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

3000000000 Hz

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Packing Method:

TRAY

Peak Reflow Temperature (C):

235

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

130 mA

Propagation Delay (tpd):

.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Trigger Type:

POSITIVE EDGE

Width:

7 mm

Trade Compliance

MC100EP131FA Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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