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SN74LV273ADBRE4

Texas Instruments

SN74LV273ADBRE4 by Texas Instruments

SN74LV273ADBRE4 by Texas Instruments is an 8-bit latch with a propagation delay of 21 ns at 3.3V, suitable for automotive applications. It operates on a supply voltage range of 2-5.5V, has a max frequency of 45 MHz, and features positive edge triggering for efficient data storage in electronic systems.

Median Price

$1.070

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,938 parts In-Stock

1+ parts

$1.070

100+ parts

$0.413

1k+ parts

$0.282

10k+ parts

$0.246

1,938

$1.070

$0.413

$0.282

$0.246

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,748 parts In-Stock

1+ parts

$0.418

100+ parts

-

1k+ parts

-

10k+ parts

-

3,748

$0.418

-

-

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Vyrian

USA . 1,610 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,610

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-

-

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Nova Conductors

Japan . 870 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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870

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,693 parts In-Stock

1+ parts

$0.396

100+ parts

-

1k+ parts

-

10k+ parts

-

4,693

$0.396

-

-

-

Corohmni

South Africa . 305 parts In-Stock

1+ parts

$0.418

100+ parts

-

1k+ parts

-

10k+ parts

-

305

$0.418

-

-

-

Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$0.431

100+ parts

$0.409

1k+ parts

$0.409

10k+ parts

-

600

$0.431

$0.409

$0.409

-

Ampacity Inc.

Singapore . 1,772 parts In-Stock

1+ parts

$0.670

100+ parts

-

1k+ parts

-

10k+ parts

-

1,772

$0.670

-

-

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Semicontronic

India . 1,479 parts In-Stock

1+ parts

$0.670

100+ parts

$0.653

1k+ parts

$0.650

10k+ parts

-

1,479

$0.670

$0.653

$0.650

-

Parana Technologies

USA . 175 parts In-Stock

1+ parts

$15.490

100+ parts

-

1k+ parts

$15.866

10k+ parts

-

175

$15.490

-

$15.866

-

ChromeModa Solutions

Germany . 2,972 parts In-Stock

1+ parts

$17.404

100+ parts

$14.271

1k+ parts

-

10k+ parts

-

2,972

$17.404

$14.271

-

-

IDEA Electronic Components Group

UK . 1,403 parts In-Stock

1+ parts

$17.404

100+ parts

$16.534

1k+ parts

$15.664

10k+ parts

-

1,403

$17.404

$16.534

$15.664

-

Microchip USA

USA . 2,929 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,929

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Argo Parts USA

USA . 2,803 parts In-Stock

1+ parts

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100+ parts

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2,803

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Continental Prestige Electronics

USA . 1,876 parts In-Stock

1+ parts

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1,876

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DigiPath Technology Company

USA . 433 parts In-Stock

1+ parts

-

100+ parts

$15.691

1k+ parts

-

10k+ parts

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433

-

$15.691

-

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Bastille Electronics

Australia . 50 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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50

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Overview

Discover the SN74LV273ADBRE4 by Texas Instruments, a top-of-the-line latch and flip-flop component that guarantees superior quality and reliability. With a focus on automotive applications, this product offers unmatched performance and precision, making it the ideal choice for your next project. Benefit from Texas Instruments' renowned expertise in semiconductor manufacturing and trust in the value and innovation this product brings to the table. Elevate your designs with the SN74LV273ADBRE4 and experience excellence like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the latch & flip-flop product lightweight and durable.

Propagation Delay At Nominal Supply: 21 ns

The low propagation delay of 21 ns ensures fast operation and efficient performance of the latch & flip-flop.

Surface Mount: YES

Being surface mountable makes the product easy to integrate onto PCBs, saving space and facilitating automated assembly processes.

Package Shape: RECTANGULAR

The rectangular package shape offers a compact design, making it suitable for applications where space is limited.

No. of Bits: 8

With 8 bits, this latch & flip-flop product can handle and store a sufficient amount of data, suitable for various digital logic applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V makes the product energy-efficient and compatible with many standard electronic systems.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF ensures stable and reliable operation of the latch & flip-flop in different circuit configurations.

Power Supplies (V): 3.3

Consistent power supply at 3.3V ensures reliable performance and compatibility with a wide range of electronic devices.

No. of Terminals: 20

With 20 terminals, this latch & flip-flop product offers versatile connectivity options for interfacing with other components in a circuit.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style saves valuable board space and allows for high-density mounting of components.

Maximum I (ol): 12 Amp

The high maximum output current of 12A ensures that the latch & flip-flop can drive strong loads without overheating or malfunctioning.

Propagation Delay (tpd): 27 ns

Although slightly higher than the nominal delay, the propagation delay of 27 ns still offers fast signal processing for efficient operation.

Maximum Operating Temperature: 125 °C

The wide operating temperature range of up to 125°C makes this latch & flip-flop suitable for demanding industrial and automotive applications.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures precise and reliable data capture, making it suitable for applications requiring synchronized circuit operation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the latch & flip-flop to function reliably in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent corrosion resistance and ensures reliable connectivity for long-term use.

Terminal Position: DUAL

The dual terminal position provides flexibility in PCB layout and allows for easier integration into different circuit configurations.

Maximum Seated Height: 2 mm

With a low maximum seated height of 2mm, this latch & flip-flop product saves vertical space on the PCB, ideal for compact designs.

Width: 5.3 mm

The narrow width of 5.3mm enables the latch & flip-flop to be used in applications where space constraints are a critical factor.

Output Polarity: TRUE

The true output polarity simplifies circuit design and ensures compatibility with other components in digital systems.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage requirement of 2V allows the latch & flip-flop to operate efficiently even in low-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reliable connection during assembly processes.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the latch & flip-flop can withstand high-temperature soldering processes without damage.

Length: 7.2 mm

The compact length of 7.2mm allows for efficient use of board space and easy integration into various electronic systems.

Temperature Grade: AUTOMOTIVE

Designed for automotive-grade applications, the latch & flip-flop product meets stringent reliability standards and can operate in harsh environments.

Maximum Frequency At Nominal Supply: 45000000 Hz

With a high maximum frequency of 45 MHz, this latch & flip-flop product can handle fast data processing and high-speed applications.

Technology: CMOS

Utilizing CMOS technology, the latch & flip-flop product offers low power consumption, high noise immunity, and fast switching speeds.

Terminal Form: GULL WING

The gull wing terminal form provides reliable solder joints and easy surface mountability for efficient assembly and robust connections.

Terminal Pitch: 0.65 mm

With a tight terminal pitch of 0.65mm, the latch & flip-flop product allows for high-density mounting and precise PCB layout.

Minimum fmax: 100 MHz

The minimum fmax specification of 100 MHz indicates high-speed operation and compatibility with modern digital systems and communication protocols.

Maximum Supply Voltage (Vsup): 5.5 V

The latch & flip-flop product can safely operate at a maximum supply voltage of 5.5V, providing flexibility in power supply configurations.

Maximum Power Supply Current (ICC): 0.02 mA

With a low maximum power supply current requirement of 0.02 mA, this latch & flip-flop product is energy-efficient and suitable for battery-powered devices.

Technical Specifications

Latches & Flip-Flops SN74LV273ADBRE4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

45000000 Hz

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

21 ns

Propagation Delay (tpd):

27 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

5.3 mm

Minimum fmax:

100 MHz

Trade Compliance

SN74LV273ADBRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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