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SN74HCT273DWR

Texas Instruments

SN74HCT273DWR by Texas Instruments

SN74HCT273DWR by Texas Instruments is an 8-bit latch with a 5V supply voltage, 42ns propagation delay, and 20 terminals. It is used in industrial applications requiring positive edge triggering and operates at frequencies up to 20MHz. The small outline package makes it suitable for compact designs with surface mount capabilities.

Median Price

$0.466

Lifecycle Status

Suppliers In-Stock

37

In-Stock Inventory

1k+

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Farnell

UK . 3,528 parts In-Stock

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$0.362

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Texas Instruments

USA . 158,000 parts In-Stock

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Arrow

USA . 2,000 parts In-Stock

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Mouser Electronics

USA . 3,161 parts In-Stock

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Rochester

USA . 71,799 parts In-Stock

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DigiKey

USA . 71,799 parts In-Stock

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Verical

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Chip1Stop

Japan . 2,423 parts In-Stock

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Digiode

USA . 2,302 parts In-Stock

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Nova Conductors

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TME

Poland . 693 parts In-Stock

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DigiKey Marketplace

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Florida Circuit

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Component Sense

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Connector Distribution Corp

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Ampacity Inc.

Singapore . 46,430 parts In-Stock

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$0.169

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Corphita

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Argo Parts USA

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Netroflash

USA . 2,000 parts In-Stock

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Continental Prestige Electronics

USA . 3,528 parts In-Stock

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Semicontronic

India . 46,498 parts In-Stock

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Parana Technologies

USA . 2,039 parts In-Stock

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DigiPath Technology Company

USA . 6 parts In-Stock

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$12.993

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$11.953

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ChromeModa Solutions

Germany . 3,779 parts In-Stock

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$10.872

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IDEA Electronic Components Group

UK . 61 parts In-Stock

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$12.595

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Corohmni

South Africa . 96 parts In-Stock

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Advanced Electronics

New Zealand . 87 parts In-Stock

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Perfect Parts

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QUARKTWIN TECHNOLOGY LTD

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Infinite Electronics LLP (Excess)

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UK . 3,455 parts In-Stock

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Israel . 322 parts In-Stock

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Legend Electronics Inc. (Excess)

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Overview

Enhance your electronics projects with the SN74HCT273DWR by Texas Instruments, a high-quality latch and flip-flop that offers unmatched reliability and performance. Designed by a trusted manufacturer in the industry, this versatile component is perfect for a wide range of applications. With its advanced technology and efficient design, customers can expect seamless operation and precise functionality. Experience the value and benefits of this product firsthand and take your projects to the next level with the SN74HCT273DWR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protects the internal components of the latch or flip-flop, ensuring long-term reliability.

Surface Mount: YES

The surface mount capability allows for easy and secure installation on circuit boards, saving space and simplifying assembly processes.

Propagation Delay (tpd): 42 ns

With a low propagation delay of 42 ns, this product facilitates fast and efficient signal processing, making it suitable for high-speed applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures that the latch or flip-flop can withstand harsh environmental conditions, enhancing its robustness.

Technology: CMOS

The complementary metal-oxide-semiconductor (CMOS) technology used in this product offers low power consumption and high noise immunity, making it energy-efficient and reliable.

Technical Specifications

Latches & Flip-Flops SN74HCT273DWR attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay (tpd):

42 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Minimum fmax:

23 MHz

Trade Compliance

SN74HCT273DWR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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