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SN74LVC1G175DCKR

Texas Instruments

SN74LVC1G175DCKR by Texas Instruments

SN74LVC1G175DCKR by Texas Instruments is a latch with 14.9 ns propagation delay, 50 pF load capacitance, and 3.3V power supply. It is used in automotive applications for positive edge triggering at temperatures ranging from -40 to 125°C.

Median Price

$0.068

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Newark

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Arrow

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Farnell

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Chip1Stop

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Verical

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Maritex

Poland . 271 parts In-Stock

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Digiode

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Component Electronics Inc.

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Cyclops Electronics Ltd

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Partservice

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Micros sp.j. W. Kędra i J. Lic

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Benley Electronics

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Australia . 300 parts In-Stock

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Modulus Dynamics

Lithuania . 94 parts In-Stock

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Component Stockers USA

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Advanced Electronics

New Zealand . 50 parts In-Stock

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Corohmni

South Africa . 1,034 parts In-Stock

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DigiPath Technology Company

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IDEA Electronic Components Group

UK . 1,966 parts In-Stock

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ChromeModa Solutions

Germany . 371 parts In-Stock

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Perfect Parts

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Continental Prestige Electronics

USA . 5 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the SN74LVC1G175DCKR latch by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge technology that ensures superior quality and efficiency. Ideal for a wide range of applications in the latches & flip-flops category, this product offers a nominal supply voltage of 1.8V and a maximum frequency of 1MHz, making it perfect for automotive use. With a compact design and advanced features like three-state output characteristics, this latch provides customers with exceptional value and unmatched benefits for their projects. Trust Texas Instruments to elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes this latch durable and resistant to damage.

Propagation Delay At Nominal Supply: 14.9 ns

With a fast propagation delay, this flip-flop ensures quick response times in electronic circuits.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, simplifying installation.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to fit into compact spaces within electronic devices.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low supply voltage of 1.8V helps to reduce power consumption in devices.

Load Capacitance (CL): 50 pF

The low load capacitance ensures efficient performance in high-frequency applications.

Power Supplies (V): 3.3

This latch is compatible with a wide range of power supplies, offering versatility in usage.

No. of Terminals: 6

The 6 terminals provide sufficient connection points for various input and output signals.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style enhances the latch's portability and space-saving design.

Maximum I (ol): 32 Amp

With a high maximum output current, this latch can handle heavy loads effectively.

Propagation Delay (tpd): 15.4 ns

The slightly longer propagation delay ensures stability and reliable operation in complex circuits.

Maximum Operating Temperature: 125 °C

The high operating temperature range allows this latch to function reliably in various environments.

Output Characteristics: 3-STATE

The 3-state output characteristic offers flexibility in controlling signal flow in electronic systems.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures precise timing and synchronization in data processing.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range makes this latch suitable for use in extreme cold conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: DUAL

The dual terminal position allows for easy connection and compatibility with a variety of circuit layouts.

Maximum Seated Height: 1.1 mm

The low seated height makes this latch suitable for compact devices where space is limited.

Width: 1.25 mm

The slim width of the latch enables it to be easily integrated into tight spaces within electronic systems.

Output Polarity: TRUE

The true output polarity ensures accurate signal transmission without signal inversion.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage requirement enhances the latch's energy efficiency.

Peak Reflow Temperature °C: 260

The high peak reflow temperature makes this latch suitable for lead-free soldering processes.

Length: 2 mm

The compact length of the latch allows for efficient use of space on circuit boards.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature rating ensures reliable performance in automotive applications.

Maximum Frequency At Nominal Supply: 1000000 Hz

With a high maximum frequency, this latch is suitable for high-speed data processing.

Technology: CMOS

The CMOS technology used in this latch offers low power consumption and high noise immunity.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and easy soldering onto circuit boards.

Packing Method: TR

The TR packing method ensures safe transportation and storage of the latches.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for dense packing of latches on circuit boards, maximizing space utilization.

Minimum fmax: 175 MHz

With a minimum fmax of 175MHz, this latch is suitable for high-frequency applications.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage tolerance provides flexibility in power supply options.

Maximum Power Supply Current (ICC): 0.01 mA

The low power supply current requirement contributes to the latch's energy efficiency.

Technical Specifications

Latches & Flip-Flops SN74LVC1G175DCKR attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

1000000 Hz

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

14.9 ns

Propagation Delay (tpd):

15.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

1.25 mm

Minimum fmax:

175 MHz

Trade Compliance

SN74LVC1G175DCKR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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