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MC100EP52DTG

Onsemi

MC100EP52DTG by Onsemi

MC100EP52DTG by Onsemi is a latches & flip-flops IC with 3.3V nominal voltage, 0.38ns propagation delay, and 4000000000Hz max frequency. It is used in applications requiring positive edge trigger type, such as industrial temperature grade environments.

Median Price

$7.496

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 500 parts In-Stock

1+ parts

$7.496

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$5.981

1k+ parts

$5.235

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-

500

$7.496

$5.981

$5.235

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Arrow

USA . 3 parts In-Stock

1+ parts

$9.024

100+ parts

$5.926

1k+ parts

$4.803

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3

$9.024

$5.926

$4.803

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Verical

USA . 3 parts In-Stock

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-

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$5.926

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$4.803

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3

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$5.926

$4.803

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Distributors (In-Stock)

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Nova Conductors

Japan . 550 parts In-Stock

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$5.712

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$5.712

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Digiode

USA . 1,646 parts In-Stock

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$7.121

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$7.121

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TME

Poland . 36 parts In-Stock

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$8.560

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Vyrian

USA . 3,201 parts In-Stock

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Flip Electronics

USA . 2,500 parts In-Stock

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Prism Electronics

USA . 308 parts In-Stock

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ComSIT Distribution GmbH

Germany . 88 parts In-Stock

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Zilex Electronics Inc.

Canada . 24 parts In-Stock

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Inventory MP

USA . 12 parts In-Stock

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Bristol Electronics

USA . 12 parts In-Stock

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Semtec, LLC

USA . 3 parts In-Stock

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Distributors (Availability)

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Benley Electronics

USA . 4 parts In-Stock

1+ parts

$1.750

100+ parts

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4

$1.750

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Ampacity Inc.

Singapore . 3,329 parts In-Stock

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$4.270

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3,329

$4.270

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Corohmni

South Africa . 197 parts In-Stock

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$5.212

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197

$5.212

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Aranea Global

USA . 2,000 parts In-Stock

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$5.598

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$5.374

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$5.598

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$5.374

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Continental Prestige Electronics

USA . 6,632 parts In-Stock

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$5.712

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$5.598

6,632

$5.712

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$5.598

Corphita

USA . 1,410 parts In-Stock

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$6.746

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1,410

$6.746

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Microchip USA

USA . 2,843 parts In-Stock

1+ parts

$28.200

100+ parts

$27.790

1k+ parts

$27.590

10k+ parts

$27.390

2,843

$28.200

$27.790

$27.590

$27.390

iodParts Technologies Inc.

India . 14,400 parts In-Stock

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Problanco Electronics

Mexico . 8,370 parts In-Stock

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SupplyDigital Components

Austria . 7,414 parts In-Stock

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Lixinc

USA . 7,030 parts In-Stock

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Kulean Microsystems

USA . 6,997 parts In-Stock

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Argo Parts USA

USA . 4,790 parts In-Stock

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4,790

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TANS Electronics

Latvia . 3,378 parts In-Stock

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UHIMA Technologies

Türkiye . 931 parts In-Stock

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931

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Perfect Parts

USA . 108 parts In-Stock

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GreenTree Electronics

Israel . 100 parts In-Stock

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100

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Overview

Experience seamless and reliable performance with the MC100EP52DTG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality latches & flip-flops that cater to a wide range of applications. With a nominal supply voltage of 3.3V and a maximum frequency of 4GHz, this product offers unparalleled value and benefits to customers looking for fast and efficient operations. Say goodbye to delays and errors with this industrial-grade technology that guarantees precision and accuracy in every use. Trust Onsemi to provide you with the best solutions for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body material makes the latch & flip-flop lightweight and durable.

Surface Mount: YES

Being surface mountable makes installation easy and hassle-free.

Package Shape: SQUARE

The square shape of the package offers a compact design, saving space in circuit boards.

Nominal Supply Voltage / Vsup (V): 3.3

With a nominal supply voltage of 3.3V, this latch & flip-flop is suitable for low power applications.

Power Supplies (V): -4.5

The power supplies of -4.5V allow for negative voltage operation, expanding the range of applications.

No. of Terminals: 8

The latch & flip-flop has 8 terminals, providing flexibility in circuit connections.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design with shrink pitch enhance overall compactness and efficiency.

Propagation Delay (tpd): 0.38 ns

The low propagation delay of 0.38ns ensures fast and efficient data processing.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the latch & flip-flop can withstand high temperature environments.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures accurate and reliable data capturing.

Minimum Operating Temperature: -40 °C

Able to operate at temperatures as low as -40°C, making it suitable for a wide range of environments.

Technical Specifications

Latches & Flip-Flops MC100EP52DTG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

100E

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

4000000000 Hz

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

47 mA

Propagation Delay (tpd):

.38 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3 mm

Trade Compliance

MC100EP52DTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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