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MC100EP52DG

Onsemi

MC100EP52DG by Onsemi

MC100EP52DG by Onsemi is a small outline ECL latch with 8 terminals, operating at -40 to 85°C. It has a propagation delay of 0.38 ns and can handle up to 4 GHz frequency. Ideal for industrial applications requiring fast positive edge triggering in compact designs.

Median Price

$7.688

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 19 parts In-Stock

1+ parts

$9.140

100+ parts

$6.047

1k+ parts

$5.581

10k+ parts

$5.470

19

$9.140

$6.047

$5.581

$5.470

Chip1Stop

Japan . 161 parts In-Stock

1+ parts

$17.600

100+ parts

$10.500

1k+ parts

-

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161

$17.600

$10.500

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Rochester

USA . 21,700 parts In-Stock

1+ parts

-

100+ parts

$4.990

1k+ parts

$4.460

10k+ parts

$4.200

21,700

-

$4.990

$4.460

$4.200

Verical

USA . 13,481 parts In-Stock

1+ parts

-

100+ parts

$6.237

1k+ parts

$5.575

10k+ parts

$5.250

13,481

-

$6.237

$5.575

$5.250

Avnet

USA . 98 parts In-Stock

1+ parts

-

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98

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Distributors (In-Stock)

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Digiode

USA . 967 parts In-Stock

1+ parts

$5.263

100+ parts

-

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967

$5.263

-

-

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Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$5.509

100+ parts

-

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450

$5.509

-

-

-

TME

Poland . 81 parts In-Stock

1+ parts

$8.540

100+ parts

-

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-

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81

$8.540

-

-

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Flip Electronics

USA . 6,272 parts In-Stock

1+ parts

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6,272

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Vyrian

USA . 5,888 parts In-Stock

1+ parts

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5,888

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Chip Stock

USA . 229 parts In-Stock

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229

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NAC Semi

USA . 196 parts In-Stock

1+ parts

-

100+ parts

$11.660

1k+ parts

$10.490

10k+ parts

-

196

-

$11.660

$10.490

-

ComSIT Distribution GmbH

Germany . 66 parts In-Stock

1+ parts

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100+ parts

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66

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Semi Source

USA . 60 parts In-Stock

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60

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Electronics Depot

USA . 30 parts In-Stock

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30

-

-

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Bristol Electronics

USA . 27 parts In-Stock

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27

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Flex Direct, LLC

USA . 27 parts In-Stock

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27

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Cyclops Electronics Ltd

UK . 2 parts In-Stock

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-

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 6,014 parts In-Stock

1+ parts

$4.710

100+ parts

-

1k+ parts

-

10k+ parts

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6,014

$4.710

-

-

-

Corphita

USA . 1,074 parts In-Stock

1+ parts

$4.986

100+ parts

-

1k+ parts

-

10k+ parts

-

1,074

$4.986

-

-

-

Continental Prestige Electronics

USA . 775 parts In-Stock

1+ parts

$5.509

100+ parts

-

1k+ parts

-

10k+ parts

$5.398

775

$5.509

-

-

$5.398

Netroflash

USA . 50 parts In-Stock

1+ parts

$5.509

100+ parts

-

1k+ parts

$5.233

10k+ parts

$5.123

50

$5.509

-

$5.233

$5.123

Corohmni

South Africa . 311 parts In-Stock

1+ parts

$5.820

100+ parts

-

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311

$5.820

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Aztec Data Supply Inc.

USA . 2,793 parts In-Stock

1+ parts

$25.460

100+ parts

-

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2,793

$25.460

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Lixinc

USA . 15,383 parts In-Stock

1+ parts

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15,383

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Kulean Microsystems

USA . 7,770 parts In-Stock

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7,770

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SupplyDigital Components

Austria . 5,786 parts In-Stock

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5,786

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Problanco Electronics

Mexico . 2,625 parts In-Stock

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2,625

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Argo Parts USA

USA . 2,614 parts In-Stock

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2,614

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Perfect Parts

USA . 2,157 parts In-Stock

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2,157

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TANS Electronics

Latvia . 1,469 parts In-Stock

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1,469

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UHIMA Technologies

Türkiye . 546 parts In-Stock

1+ parts

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546

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Authorized Procurement Solutions

USA . 176 parts In-Stock

1+ parts

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176

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GreenTree Electronics

Israel . 176 parts In-Stock

1+ parts

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176

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-

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Eastek

USA . 98 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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98

-

-

-

-

Overview

Unlock seamless performance with the MC100EP52DG by Onsemi. Crafted with precision, this latch & flip-flop device offers unparalleled reliability and efficiency for a wide range of applications. From industrial automation to telecommunications, this product boasts superior quality and versatility, providing customers with a competitive edge in today's fast-paced market. Experience the value of cutting-edge technology and elevate your projects with the MC100EP52DG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the internal components of the latch or flip-flop.

Surface Mount: YES

Surface mount capability makes it easy to integrate this latch or flip-flop into a PCB design, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V makes this latch or flip-flop efficient in terms of power consumption.

Trigger Type: POSITIVE EDGE

Positive edge triggering ensures reliable operation and precise timing control for the latch or flip-flop.

Maximum Frequency At Nominal Supply: 4000000000 Hz

High maximum frequency allows for fast data processing and signal handling in high-speed applications.

Technical Specifications

Latches & Flip-Flops MC100EP52DG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

100E

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

4000000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

47 mA

Propagation Delay (tpd):

.38 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Trade Compliance

MC100EP52DG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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