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MC100EP131MNG

Onsemi

MC100EP131MNG by Onsemi

MC100EP131MNG by Onsemi is a 4-bit latch with 0.6 ns propagation delay, operating at -40 to 85 °C. It has a max frequency of 3 GHz and uses ECL technology. Ideal for industrial applications requiring fast positive edge triggering in a compact square package.

Median Price

$12.110

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 22,785 parts In-Stock

1+ parts

-

100+ parts

$11.220

1k+ parts

$10.040

10k+ parts

$9.450

22,785

-

$11.220

$10.040

$9.450

DigiKey

USA . 22,785 parts In-Stock

1+ parts

-

100+ parts

$13.000

1k+ parts

$13.000

10k+ parts

$13.000

22,785

-

$13.000

$13.000

$13.000

Verical

USA . 5,254 parts In-Stock

1+ parts

-

100+ parts

$14.025

1k+ parts

$12.550

10k+ parts

-

5,254

-

$14.025

$12.550

-

Farnell

UK . 28 parts In-Stock

1+ parts

-

100+ parts

$10.610

1k+ parts

-

10k+ parts

-

28

-

$10.610

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$11.515

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$11.515

-

-

-

Digiode

USA . 633 parts In-Stock

1+ parts

$11.875

100+ parts

-

1k+ parts

-

10k+ parts

-

633

$11.875

-

-

-

Vyrian

USA . 14,989 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

14,989

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 15,116 parts In-Stock

1+ parts

$9.020

100+ parts

-

1k+ parts

-

10k+ parts

-

15,116

$9.020

-

-

-

Corohmni

South Africa . 250 parts In-Stock

1+ parts

$10.610

100+ parts

-

1k+ parts

-

10k+ parts

-

250

$10.610

-

-

-

Corphita

USA . 717 parts In-Stock

1+ parts

$11.250

100+ parts

-

1k+ parts

-

10k+ parts

-

717

$11.250

-

-

-

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$11.285

100+ parts

-

1k+ parts

$10.833

10k+ parts

-

1,000

$11.285

-

$10.833

-

Continental Prestige Electronics

USA . 5,995 parts In-Stock

1+ parts

$11.515

100+ parts

-

1k+ parts

-

10k+ parts

$11.285

5,995

$11.515

-

-

$11.285

Microchip USA

USA . 138 parts In-Stock

1+ parts

$33.600

100+ parts

-

1k+ parts

-

10k+ parts

-

138

$33.600

-

-

-

SupplyDigital Components

Austria . 6,712 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,712

-

-

-

-

TANS Electronics

Latvia . 3,744 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,744

-

-

-

-

Problanco Electronics

Mexico . 2,618 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,618

-

-

-

-

Argo Parts USA

USA . 1,393 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,393

-

-

-

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Kulean Microsystems

USA . 1,334 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,334

-

-

-

-

Perfect Parts

USA . 413 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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413

-

-

-

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UHIMA Technologies

Türkiye . 84 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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84

-

-

-

-

Overview

Discover the seamless performance and reliability of the MC100EP131MNG by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and innovation with this latches & flip-flops category product. Ideal for a wide range of applications, this chip carrier with a very thin profile offers customers unparalleled value with its fast propagation delay, high operating temperature range, and advanced technology. Experience the benefits of precision and efficiency with the MC100EP131MNG from Onsemi.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy installation on PCBs, saving space and reducing assembly time.

Package Shape: SQUARE

Provides a compact form factor, making it suitable for applications with limited space.

No. of Bits: 4

Offers versatility in digital signal processing and data storage applications.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with common supply voltages, ensuring widespread usability.

Power Supplies (V): -4.5

Supports dual power supply configurations, enabling flexibility in system design.

No. of Terminals: 32

Provides ample connections for interfacing with other components in a circuit.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers efficient heat dissipation and space-saving features for compact designs.

Propagation Delay (tpd): 0.6 ns

Ensures high-speed operation, ideal for applications requiring quick response times.

Maximum Operating Temperature: 85 °C

Allows for reliable operation in varying environmental conditions.

Trigger Type: POSITIVE EDGE

Enables precise control of signal transitions, suitable for synchronous applications.

Minimum Operating Temperature: -40 °C

Ensures functionality in extreme cold environments.

Terminal Finish: TIN

Provides a corrosion-resistant coating for long-term reliability.

Terminal Position: QUAD

Facilitates easy mounting and secure connections within a circuit.

Maximum Seated Height: 1 mm

Low profile design is suitable for compact devices and space-constrained applications.

Width: 5 mm

Contributes to the overall compact size of the component, making it versatile for various applications.

Output Polarity: COMPLEMENTARY

Supports complementary logic operations, enhancing signal integrity and data processing capabilities.

Minimum Supply Voltage (Vsup): 3 V

Supports a wide voltage range, making it compatible with various power sources.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and assembly during manufacturing processes.

Peak Reflow Temperature °C: 260

Suitable for lead-free soldering processes, meeting environmental regulations.

Length: 5 mm

Contributes to the compact form factor of the component, suitable for space-constrained designs.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with varying temperature conditions.

Maximum Frequency At Nominal Supply: 3000000000 Hz

Supports high-speed data processing and digital signal operations.

Technology: ECL

Offers high-speed performance and low power consumption, suitable for advanced digital applications.

Terminal Form: NO LEAD

Facilitates easy PCB mounting and soldering without the use of traditional lead-based materials.

Packing Method: TRAY

Provides convenient storage and handling during manufacturing and distribution processes.

Terminal Pitch: 0.5 mm

Offers fine pitch spacing, suitable for high-density PCB designs and miniaturized circuits.

Maximum Supply Voltage (Vsup): 5.5 V

Compatible with a wide range of supply voltages, ensuring flexibility in system design.

Maximum Power Supply Current (ICC): 130 mA

Supports high-current operation, suitable for driving multiple components and peripherals.

Technical Specifications

Latches & Flip-Flops MC100EP131MNG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

100E

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

3000000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

130 mA

Propagation Delay (tpd):

.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

5 mm

Trade Compliance

MC100EP131MNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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