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MC100E143FNR2

Onsemi

MC100E143FNR2 by Onsemi

MC100E143FNR2 by Onsemi is a D flip-flop logic IC with 9 bits and a min operating voltage of 4.2V. It has a propagation delay of 1ns and operates at temperatures up to 85°C. This chip is commonly used in applications that require fast data storage and retrieval, such as high-speed data communication systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 1,167 parts In-Stock

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Digiode

USA . 698 parts In-Stock

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Nova Conductors

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Ampacity Inc.

Singapore . 139 parts In-Stock

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$5.000

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Aztec Data Supply Inc.

USA . 2,005 parts In-Stock

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$9.124

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AZTECH Wire

Italy . 567 parts In-Stock

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Semicontronic

India . 1,144 parts In-Stock

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$55.575

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$55.290

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Component Stockers USA

USA . 748 parts In-Stock

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$99.990

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SupplyDigital Components

Austria . 7,050 parts In-Stock

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Continental Prestige Electronics

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Kulean Microsystems

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Microchip USA

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Problanco Electronics

Mexico . 3,889 parts In-Stock

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Argo Parts USA

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Corphita

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UHIMA Technologies

Türkiye . 718 parts In-Stock

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Corohmni

South Africa . 420 parts In-Stock

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TANS Electronics

Latvia . 220 parts In-Stock

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Bastille Electronics

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Overview

Enhance your electronic designs with the MC100E143FNR2 by Onsemi. As a leader in the industry, Onsemi is renowned for its superior quality and reliable products. The MC100E143FNR2 belongs to the latches & flip-flops category, offering flexibility and versatility to various applications. With its true output polarity and positive edge trigger type, this chip carrier delivers exceptional performance. Its nominal supply voltage of 5V ensures efficient power consumption while its fast propagation delay of 1ns guarantees smooth operation. Experience the value, benefits, and advantages that the MC100E143FNR2 brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making the product long-lasting.

Surface Mount: YES

Being surface mountable makes installation easy and saves space on the circuit board.

No. of Bits: 9

With a high number of bits, this product allows for complex operations and processing of data.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V is common and compatible with many systems, ensuring ease of integration.

Propagation Delay (tpd): 1 ns

The low propagation delay of 1ns ensures rapid signal processing, making the product ideal for high-speed applications.

Output Characteristics: OPEN-EMITTER

The open-emitter output allows for flexibility in connecting to other components, enabling versatile usage.

Minimum Operating Temperature: 0 °C

The wide temperature range of 0 °C to 85°C ensures reliable operation in various environments.

Technology: ECL

The ECL technology offers high speed and low power consumption, making the product efficient and suitable for demanding applications.

Technical Specifications

Latches & Flip-Flops MC100E143FNR2 attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

100E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

9

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Propagation Delay (tpd):

1 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trigger Type:

POSITIVE EDGE

Width:

11.505 mm

Minimum fmax:

700 MHz

Trade Compliance

MC100E143FNR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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