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SN74LVC1G74DCU

Texas Instruments

SN74LVC1G74DCU by Texas Instruments

SN74LVC1G74DCU by Texas Instruments is a latch with 7.9 ns propagation delay, 3.3V nominal voltage, and 24 Amp max I (ol). It is used in automotive applications due to its small outline package and positive edge trigger type for high-speed operations up to 175 MHz.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 6,220 parts In-Stock

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Digiode

USA . 1,521 parts In-Stock

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Next Level Components, LLC

USA . 195 parts In-Stock

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195

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Nova Conductors

Japan . 16 parts In-Stock

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Parana Technologies

USA . 61 parts In-Stock

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$11.554

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$1,072.962

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$10.399

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61

$11.554

$1,072.962

$10.399

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AZTECH Wire

Italy . 366 parts In-Stock

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$12.524

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DigiPath Technology Company

USA . 1,756 parts In-Stock

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$12.722

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ChromeModa Solutions

Germany . 6,110 parts In-Stock

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$12.982

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$10.645

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IDEA Electronic Components Group

UK . 1,300 parts In-Stock

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$12.982

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$12.333

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$11.684

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Ampacity Inc.

Singapore . 1,516 parts In-Stock

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$15.000

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Advanced Electronics

New Zealand . 870 parts In-Stock

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$17.166

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$16.308

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Corohmni

South Africa . 1,096 parts In-Stock

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One Stop Electronics

USA . 325 parts In-Stock

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$42.000

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Semicontronic

India . 1,375 parts In-Stock

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$58.500

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Continental Prestige Electronics

USA . 6,489 parts In-Stock

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Argo Parts USA

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Corphita

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Robosynatics

Brazil . 500 parts In-Stock

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Lucentia Tech

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Bastille Electronics

Australia . 74 parts In-Stock

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Overview

Elevate your electronics projects with the superior quality and reliability of the Texas Instruments SN74LVC1G74DCU latch. Crafted with precision by a trusted manufacturer, this small but mighty device offers lightning-fast propagation delay and a wide operating temperature range, making it ideal for a variety of applications in automotive and industrial settings. With its compact design and high performance capabilities, this latch provides exceptional value and efficiency to customers seeking top-notch components for their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the latch or flip-flop, ensuring longevity and reliability.

Propagation Delay At Nominal Supply: 7.9 ns

Fast propagation delay allows for quick response times, making this latch or flip-flop suitable for high-speed applications.

Surface Mount: YES

Ease of installation and space-saving design for efficient PCB layout.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common supply voltage, making it compatible with a wide range of systems and components.

Maximum I (ol): 24 Amp

High output current capability ensures robust performance, suitable for demanding applications.

Trigger Type: POSITIVE EDGE

Positive edge triggering provides precise control over the latch or flip-flop operation, enhancing overall system performance.

Temperature Grade: AUTOMOTIVE

Designed to withstand automotive temperature ranges, making it suitable for automotive applications where temperature extremes are common.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this latch or flip-flop energy-efficient and reliable.

Technical Specifications

Latches & Flip-Flops SN74LVC1G74DCU attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G8

Length:

2.3 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

175000000 Hz

Maximum I (ol):

24 Amp

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

7.9 ns

Propagation Delay (tpd):

14.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

FF/Latch

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

2 mm

Minimum fmax:

200 MHz

Trade Compliance

SN74LVC1G74DCU Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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