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MM74HC273MTCX

Onsemi

MM74HC273MTCX by Onsemi

MM74HC273MTCX by Onsemi is an 8-bit latch with a propagation delay of 34ns. It operates at a supply voltage range of 2-6V and has a max frequency of 21MHz. Ideal for industrial applications requiring positive edge triggering, it comes in a small outline package suitable for surface mounting.

Median Price

$0.359

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,000 parts In-Stock

1+ parts

$0.630

100+ parts

$0.350

1k+ parts

$0.305

10k+ parts

$0.258

3,000

$0.630

$0.350

$0.305

$0.258

Rochester

USA . 113,898 parts In-Stock

1+ parts

-

100+ parts

$0.338

1k+ parts

$0.280

10k+ parts

$0.250

113,898

-

$0.338

$0.280

$0.250

DigiKey

USA . 113,898 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.420

10k+ parts

-

113,898

-

-

$0.420

-

Verical

USA . 97,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.380

10k+ parts

$0.312

97,500

-

-

$0.380

$0.312

Arrow

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.245

2,500

-

-

-

$0.245

EBV Elektronik

Germany . 2,500 parts In-Stock

1+ parts

-

100+ parts

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2,500

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-

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Chip1Stop

Japan . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.197

2,500

-

-

-

$0.197

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 641 parts In-Stock

1+ parts

$0.262

100+ parts

-

1k+ parts

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641

$0.262

-

-

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Nova Conductors

Japan . 98 parts In-Stock

1+ parts

$0.278

100+ parts

-

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98

$0.278

-

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DigiKey Marketplace

USA . 113,898 parts In-Stock

1+ parts

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113,898

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Vyrian

USA . 29,699 parts In-Stock

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29,699

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Flip Electronics

USA . 22,500 parts In-Stock

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Chip Stock

USA . 14,900 parts In-Stock

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14,900

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ComSIT Distribution GmbH

Germany . 9,839 parts In-Stock

1+ parts

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9,839

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NAC Semi

USA . 2,500 parts In-Stock

1+ parts

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100+ parts

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$0.436

2,500

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$0.436

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 34,128 parts In-Stock

1+ parts

$0.167

100+ parts

$0.163

1k+ parts

$0.162

10k+ parts

-

34,128

$0.167

$0.163

$0.162

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Ampacity Inc.

Singapore . 34,012 parts In-Stock

1+ parts

$0.167

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34,012

$0.167

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Corohmni

South Africa . 117 parts In-Stock

1+ parts

$0.197

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117

$0.197

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Corphita

USA . 3,044 parts In-Stock

1+ parts

$0.248

100+ parts

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3,044

$0.248

-

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Argo Parts USA

USA . 4,058 parts In-Stock

1+ parts

$0.278

100+ parts

-

1k+ parts

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10k+ parts

$0.269

4,058

$0.278

-

-

$0.269

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.278

100+ parts

$0.272

1k+ parts

-

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2,000

$0.278

$0.272

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Aztec Data Supply Inc.

USA . 14,338 parts In-Stock

1+ parts

$26.503

100+ parts

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14,338

$26.503

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GreenTree Electronics

Israel . 77,708 parts In-Stock

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77,708

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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Perfect Parts

USA . 14,472 parts In-Stock

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TANS Electronics

Latvia . 7,989 parts In-Stock

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SupplyDigital Components

Austria . 7,480 parts In-Stock

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7,480

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A-Z Elektronik GmbH

Germany . 7,310 parts In-Stock

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Kulean Microsystems

USA . 5,492 parts In-Stock

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Problanco Electronics

Mexico . 3,992 parts In-Stock

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Continental Prestige Electronics

USA . 2,500 parts In-Stock

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$0.230

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$0.221

2,500

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$0.230

$0.221

Eastek

USA . 2,500 parts In-Stock

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2,500

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Glotronic Ltd.

UK . 1,800 parts In-Stock

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Supply Digital

USA . 1,229 parts In-Stock

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1,229

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UHIMA Technologies

Türkiye . 628 parts In-Stock

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628

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Overview

Unlock endless possibilities with the MM74HC273MTCX by Onsemi! This top-notch latches & flip-flops device boasts superior quality and reliability, thanks to the renowned manufacturer. Perfect for a wide range of applications, this product offers customers unbeatable value and benefits. Experience seamless performance and efficiency with the MM74HC273MTCX - the ultimate choice for your electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components.

Propagation Delay At Nominal Supply: 34 ns

Fast propagation delay ensures quick response time for signal transmission.

Surface Mount: YES

Allows for convenient installation on circuit boards without the need for through-holes.

Package Shape: RECTANGULAR

Compact rectangular design saves space on the PCB.

No. of Bits: 8

Ideal for applications requiring processing and storage of 8-bit data.

Nominal Supply Voltage / Vsup (V): 4.5

Compatible with a wide range of power sources for versatility.

Load Capacitance (CL): 50 pF

Suitable for handling typical capacitive loads in digital circuits.

Power Supplies (V): 2/6

Compatible with both lower and higher voltage power sources.

No. of Terminals: 20

Sufficient terminals for connecting to various components in a circuit.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Streamlined package design for space-saving applications.

Maximum I (ol): 4 Amp

Capable of driving high current loads for robust performance.

Propagation Delay (tpd): 170 ns

Acceptable delay time for reliable signal transmission in a circuit.

Maximum Operating Temperature: 85 °C

Can operate in elevated temperatures without performance degradation.

Trigger Type: POSITIVE EDGE

Ensures accurate triggering of the latch or flip-flop in response to input signals.

Minimum Operating Temperature: -40 °C

Can withstand cold environments without affecting functionality.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and long-term reliability for the terminals.

Terminal Position: DUAL

Allows for flexibility in circuit board layout and component placement.

Maximum Seated Height: 1.2 mm

Low profile design for space-constrained applications.

Width: 4.4 mm

Compact width for fitting into tight spaces on the PCB.

Output Polarity: TRUE

Provides logical output signals that are easy to interpret and use in a circuit.

Minimum Supply Voltage (Vsup): 2 V

Can operate with lower voltage power sources for energy-efficient applications.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time for the soldering process during assembly.

Peak Reflow Temperature °C: 260

Suitable for high-temperature soldering processes without damage.

Length: 6.5 mm

Compact length for space-saving installation on the PCB.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments and temperature fluctuations.

Maximum Frequency At Nominal Supply: 21000000 Hz

Supports high-frequency operations for efficient signal processing.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Facilitates easy soldering and secure mounting on the PCB.

Packing Method: TR

Secure packaging method for safe transportation and storage.

Terminal Pitch: 0.65 mm

Fine pitch terminals for precise connection to the circuit board.

Minimum fmax: 24 MHz

Maximum operating frequency for reliable performance in digital circuits.

Maximum Supply Voltage (Vsup): 6 V

Can handle higher voltage power sources for versatility.

Maximum Power Supply Current (ICC): 0.16 mA

Low power consumption for energy-efficient operation.

Technical Specifications

Latches & Flip-Flops MM74HC273MTCX attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

21000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

34 ns

Propagation Delay (tpd):

170 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

24 MHz

Trade Compliance

MM74HC273MTCX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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