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SN74HC273DWE4

Texas Instruments

SN74HC273DWE4 by Texas Instruments

SN74HC273DWE4 by Texas Instruments is an 8-bit latch with a positive edge trigger. It operates at a nominal voltage of 5V and has a max frequency of 21MHz. This small outline package is commonly used in industrial applications requiring reliable data storage and retrieval.

Median Price

$18.000

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Mobius Materials

USA . 129 parts In-Stock

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$18.000

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$14.420

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Vyrian

USA . 6,598 parts In-Stock

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Digiode

USA . 1,074 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Parana Technologies

USA . 1,798 parts In-Stock

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$12.295

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$12.726

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$12.295

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$12.726

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Semicontronic

India . 750 parts In-Stock

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$13.000

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$12.675

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$12.610

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750

$13.000

$12.675

$12.610

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DigiPath Technology Company

USA . 1,097 parts In-Stock

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$13.539

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$13.539

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ChromeModa Solutions

Germany . 2,250 parts In-Stock

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$13.815

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$11.328

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$13.815

$11.328

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IDEA Electronic Components Group

UK . 369 parts In-Stock

1+ parts

$13.815

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$13.124

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$12.434

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369

$13.815

$13.124

$12.434

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Corohmni

South Africa . 26 parts In-Stock

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$14.054

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AZTECH Wire

Italy . 831 parts In-Stock

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$14.398

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Ampacity Inc.

Singapore . 876 parts In-Stock

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$20.000

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One Stop Electronics

USA . 1,509 parts In-Stock

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$52.000

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Corphita

USA . 4,005 parts In-Stock

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Argo Parts USA

USA . 3,306 parts In-Stock

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Continental Prestige Electronics

USA . 1,273 parts In-Stock

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Advanced Electronics

New Zealand . 227 parts In-Stock

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Bastille Electronics

Australia . 32 parts In-Stock

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Overview

Discover the SN74HC273DWE4 by Texas Instruments, a high-quality latch and flip-flop device that offers incredible value to customers. Manufactured by Texas Instruments, a renowned industry leader, this product ensures reliability and performance. The SN74HC273DWE4 is perfect for various applications and is designed to meet industrial standards. With its compact size and durable construction, it provides convenience without compromising on functionality. Experience the benefits of this advanced technology and unlock endless possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's package body material is made of plastic/epoxy, making it lightweight and durable, ideal for various applications.

Surface Mount: YES

This latch/flip-flop is designed for surface mount installation, allowing for convenient and efficient integration into circuit boards.

No. of Functions: 1

This product has one function, simplifying circuit design and reducing complexity.

Package Shape: RECTANGULAR

The rectangular package shape of this latch/flip-flop is space-efficient and compatible with standard PCB designs.

No. of Bits: 8

With eight bits, this latch/flip-flop provides a wide range of data storage capabilities, suitable for applications requiring larger data processing.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures compatibility with common power sources, making this product versatile in various systems.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF allows for efficient signal transmission and faster data processing.

Power Supplies (V): 2/6

This product supports a wide range of power supply voltages, from 2V to 6V, providing flexibility in different applications.

No. of Terminals: 20

With 20 terminals, this latch/flip-flop offers multiple input/output options for connecting to other components.

Package Style (Meter): SMALL OUTLINE

The small outline package style of this latch/flip-flop saves space on the circuit board and enables compact designs.

Maximum I (ol): 4 Amp

The maximum output sink current of 4 Amp ensures the capability to handle high current loads, making this product suitable for power-driven applications.

Propagation Delay (tpd): 200 ns

With a propagation delay of 200 ns, this latch/flip-flop provides fast data processing, contributing to efficient system performance.

Maximum Operating Temperature: 85 °C

This product can operate at a maximum temperature of 85°C, making it suitable for industrial environments with higher temperature ranges.

Trigger Type: POSITIVE EDGE

The positive edge trigger type of this latch/flip-flop ensures reliable data capture and synchronization, enhancing system stability and accuracy.

Minimum Operating Temperature: -40 °C

This product can operate at a minimum temperature of -40°C, enabling reliable performance in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel palladium gold provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections over time.

Terminal Position: DUAL

This latch/flip-flop has a dual terminal position, allowing for flexible installation orientations and accommodating different PCB layouts.

Maximum Seated Height: 2.65 mm

With a maximum seated height of 2.65 mm, this product has a compact profile, suitable for applications with height restrictions.

Width: 7.5 mm

The width dimension of 7.5 mm provides a compact footprint, enabling space-saving designs.

Output Polarity: TRUE

This latch/flip-flop has a true output polarity, ensuring accurate signal representation and compatibility with various circuit configurations.

Minimum Supply Voltage (Vsup): 2 V

With a minimum supply voltage of 2V, this product can operate at lower power levels, conserving energy and enhancing efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

This latch/flip-flop can withstand a maximum time of 30 seconds at peak reflow temperature, facilitating reliable and consistent soldering during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and adherence during the manufacturing process, resulting in reliable and robust connections.

Length: 12.8 mm

This latch/flip-flop has a length dimension of 12.8 mm, providing a compact size for space-constrained applications.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this product can withstand harsh environmental conditions and operate reliably in demanding settings.

Maximum Frequency At Nominal Supply: 21000000 Hz

With a maximum frequency of 21,000,000 Hz, this latch/flip-flop offers high-speed data processing capabilities, suitable for demanding applications.

Technology: CMOS

Based on CMOS technology, this latch/flip-flop provides low power consumption, high noise immunity, and enhanced reliability.

Terminal Form: GULL WING

The gull wing terminal form of this latch/flip-flop allows for easy soldering during assembly, ensuring secure connections and reducing the risk of contact damage.

Packing Method: TUBE

This latch/flip-flop is provided in a tube packaging method, offering convenient storage and safe transportation.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this product is compatible with standard spacing on circuit boards, facilitating easy integration.

Minimum fmax: 25 MHz

The minimum fmax value of 25 MHz indicates the maximum frequency at which this latch/flip-flop can operate, ensuring reliable performance in various applications.

Moisture Sensitivity Level (MSL): 1

This product has a moisture sensitivity level of 1, indicating that it is suitable for standard moisture resistance requirements during storage and handling.

Maximum Supply Voltage (Vsup): 6 V

With a maximum supply voltage of 6V, this product can handle higher power levels, providing compatibility with a wide range of systems.

Technical Specifications

Latches & Flip-Flops SN74HC273DWE4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Additional Features:

DUMMY VAL

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

21000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

200 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Minimum fmax:

25 MHz

Trade Compliance

SN74HC273DWE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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