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MM74HC273WM

Onsemi

MM74HC273WM by Onsemi

MM74HC273WM by Onsemi is an 8-bit latch with a propagation delay of 34ns. It operates at a supply voltage range of 2-6V and has a max frequency of 24MHz. Ideal for industrial applications requiring positive edge triggering, this CMOS technology flip-flop is surface mountable in a small outline package.

Median Price

$0.484

Lifecycle Status

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54

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1k+

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Chip1Stop

Japan . 349 parts In-Stock

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Arrow

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Adafruit Industries

USA . 270 parts In-Stock

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Bürklin Elektronik

Germany . 362 parts In-Stock

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Mouser Electronics

USA . 894 parts In-Stock

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Newark

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Farnell

UK . 11 parts In-Stock

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Element14

Singapore . 11 parts In-Stock

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Rochester

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Verical

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Freelance Electronics

USA . 319 parts In-Stock

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Digiode

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DF Sales Co.

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Nova Conductors

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Poland . 318 parts In-Stock

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American Microsemiconductor Inc.

USA . 59 parts In-Stock

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NAC Semi

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Corohmni

South Africa . 125 parts In-Stock

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Corphita

USA . 1,413 parts In-Stock

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Ampacity Inc.

Singapore . 3,326 parts In-Stock

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Semicontronic

India . 3,142 parts In-Stock

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Component Stockers USA

USA . 7,455 parts In-Stock

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$0.360

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$0.340

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Aranea Global

USA . 2,000 parts In-Stock

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$0.414

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$0.398

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Argo Parts USA

USA . 2,788 parts In-Stock

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$0.423

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$0.410

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Advanced Electronics

New Zealand . 270 parts In-Stock

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$0.431

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Continental Prestige Electronics

USA . 186 parts In-Stock

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$0.487

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$0.374

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$0.292

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$0.289

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Microchip USA

USA . 9,191 parts In-Stock

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$5.785

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Modulus Dynamics

Lithuania . 747 parts In-Stock

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$17.995

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$17.995

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Aztec Data Supply Inc.

USA . 4,873 parts In-Stock

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$30.732

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Overview

Upgrade your electronics projects with the MM74HC273WM by Onsemi. Crafted with precision and quality, this latch & flip-flop device offers reliable performance and versatility. Perfect for a wide range of applications, it's a must-have component for any tech enthusiast or professional. With a nominal supply voltage of 4.5V and a true output polarity, this product provides exceptional value and benefits to customers seeking top-notch functionality and efficiency. Experience seamless integration and superior results with the MM74HC273WM – your go-to solution for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this latch durable and lightweight, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 34 ns

With a fast propagation delay of 34 ns, this flip-flop operates efficiently and quickly for time-sensitive applications.

Surface Mount: YES

The surface mount capability of this latch makes it easy to install and saves space on the PCB.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into existing circuit designs with minimal effort.

No. of Bits: 8

With 8 bits, this flip-flop can handle multiple signals simultaneously, perfect for complex circuitry designs.

Nominal Supply Voltage / Vsup: 4.5V

The 4.5V supply voltage ensures stable and reliable operation for various applications.

Load Capacitance (CL): 50 pF

With a load capacitance of 50 pF, this latch can handle a variety of input signals while maintaining signal integrity.

Power Supplies (V): 2/6

Compatible with power supplies ranging from 2V to 6V, offering flexibility in voltage requirements for different applications.

No. of Terminals: 20

The 20 terminals provide ample connection points for various inputs and outputs, making it versatile for different circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves PCB space and allows for compact design layouts, ideal for space-constrained applications.

Technical Specifications

Latches & Flip-Flops MM74HC273WM attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8015 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

21000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

34 ns

Propagation Delay (tpd):

170 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.642 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Minimum fmax:

24 MHz

Trade Compliance

MM74HC273WM Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-415-3694, 5962014153694

NIIN

014153694

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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