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SN74AHC74DR

Texas Instruments

SN74AHC74DR by Texas Instruments

SN74AHC74DR by Texas Instruments is a dual-function latch with 10.5ns propagation delay, ideal for automotive applications. It operates at a supply voltage range of 2-5.5V and has a max frequency of 75MHz. This CMOS technology flip-flop features positive edge triggering and complementary output polarity in a small outline package.

Median Price

$0.235

Lifecycle Status

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1k+

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Texas Instruments

USA . 107,059 parts In-Stock

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DigiKey

USA . 5,458 parts In-Stock

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$0.246

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Mouser Electronics

USA . 2,064 parts In-Stock

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$0.460

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$0.247

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Chip1Stop

Japan . 1 parts In-Stock

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Arrow

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Rochester

USA . 2,486 parts In-Stock

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Verical

USA . 447 parts In-Stock

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Digiode

USA . 2,402 parts In-Stock

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Nova Conductors

Japan . 31 parts In-Stock

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Maritex

Poland . 16 parts In-Stock

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American Microsemiconductor Inc.

USA . 2,473 parts In-Stock

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Vyrian

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Pegasus Components GmbH

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Bristol Electronics

USA . 3,096 parts In-Stock

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$0.273

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Cyclops Electronics Ltd

UK . 3,015 parts In-Stock

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Component Electronics Inc.

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Lighthouse Electronics, Inc.

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ACDS - Activité Composants Distribution Service

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Dan-Mar Components

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Rebound Electronics

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Electronics Depot

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Inland Empire Components Inc.

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Velocity Electronics

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Avant Electronics Limited

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PC Components Company LLC

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Speed Components Ltd

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Component Stockers USA

USA . 11,173 parts In-Stock

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Ampacity Inc.

Singapore . 17,552 parts In-Stock

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Corphita

USA . 2,395 parts In-Stock

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Argo Parts USA

USA . 3,822 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$0.137

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$0.135

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Continental Prestige Electronics

USA . 341 parts In-Stock

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$0.418

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$0.192

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$0.107

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$0.091

341

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$0.091

Parana Technologies

USA . 132 parts In-Stock

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$15.398

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$1,429.928

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$13.858

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132

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DigiPath Technology Company

USA . 210 parts In-Stock

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$16.955

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ChromeModa Solutions

Germany . 5,935 parts In-Stock

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$17.301

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IDEA Electronic Components Group

UK . 993 parts In-Stock

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Perfect Parts

USA . 80,032 parts In-Stock

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GreenTree Electronics

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Metaverse IC Inc.

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Kepictronics

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QUARKTWIN TECHNOLOGY LTD

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A-Z Elektronik GmbH

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Infinite Electronics LLP (Excess)

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Authorized Procurement Solutions

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ChipTracer

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Alle Elektronik GmbH

Germany . 530 parts In-Stock

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Overview

Upgrade your electronic projects with the SN74AHC74DR by Texas Instruments. Manufactured to the highest quality standards, this latch & flip-flop component offers fast propagation delay and low power consumption, making it ideal for a wide range of applications. With a compact design and easy surface mount installation, this versatile product delivers reliable performance at a competitive price point. Trust Texas Instruments for cutting-edge technology and superior innovation in every component. Elevate your designs with the SN74AHC74DR today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 10.5 ns

Offers fast signal processing, ensuring efficient operation in time-critical tasks.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving space and simplifying assembly.

No. of Functions: 2

Provides dual functionality in a single component, offering versatility in circuit design.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with commonly used supply voltages, ensuring seamless integration into existing systems.

Load Capacitance (CL): 50 pF

Suitable for handling moderate capacitive loads, making it suitable for a wide range of applications.

Power Supplies (V): 2/5.5

Supports a wide range of power supply voltages, offering flexibility in system design.

Package Style (Meter): SMALL OUTLINE

Compact size saves space on the circuit board and allows for high-density mounting.

Maximum I (ol): 8 Amp

Capable of handling high output currents, making it suitable for demanding applications.

Propagation Delay (tpd): 17.5 ns

Provides fast signal propagation, ensuring timely response in critical operations.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for use in challenging environments.

Trigger Type: POSITIVE EDGE

Allows for precise control of signal triggering, ensuring accurate operation.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides corrosion resistance and ensures reliable electrical connections for long-term performance.

Terminal Position: DUAL

Offers flexibility in circuit layout and enables efficient signal routing.

Maximum Seated Height: 1.75 mm

Low profile design allows for compact system integration and reduces overall height of the circuit board.

Width: 3.9 mm

Compact width allows for efficient use of space and enables high-density mounting.

Output Polarity: COMPLEMENTARY

Provides both inverted and non-inverted outputs, allowing for flexible signal processing options.

Minimum Supply Voltage (Vsup): 2 V

Can operate at low supply voltages, making it energy-efficient and suitable for battery-powered devices.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during soldering, ensuring reliable solder joints.

Length: 8.65 mm

Compact length saves space on the circuit board and allows for efficient layout design.

Temperature Grade: AUTOMOTIVE

Designed to withstand automotive temperature ranges, making it suitable for automotive applications.

Maximum Frequency At Nominal Supply: 75000000 Hz

Supports high-frequency operation, enabling fast signal processing in high-speed applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, ensuring reliable performance.

Terminal Form: GULL WING

Gull wing terminals provide mechanical stability and facilitate easy soldering during assembly.

Packing Method: TR

Tape and reel packaging simplifies handling and automated pick-and-place assembly processes.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy integration into various circuit designs.

Minimum fmax: 110 MHz

Supports high maximum frequency, enabling fast signal processing and high-speed operation.

Maximum Supply Voltage (Vsup): 5.5 V

Can withstand high supply voltages, offering flexibility in power supply design.

Maximum Power Supply Current (ICC): 0.02 mA

Low power supply current consumption makes it energy-efficient and suitable for battery-powered applications.

Technical Specifications

Latches & Flip-Flops SN74AHC74DR attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

75000000 Hz

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

17.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latch

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

110 MHz

Trade Compliance

SN74AHC74DR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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