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MM74HC273N

Onsemi

MM74HC273N by Onsemi

MM74HC273N by Onsemi is an 8-bit latch with a propagation delay of 34ns at 5V. It operates in industrial temperatures (-40 to 85°C) and has a max frequency of 21MHz. Ideal for applications requiring positive edge triggering and true output polarity in a through-hole package.

Median Price

$0.371

Lifecycle Status

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Forefront Electronics and Design

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South Africa . 300 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Ampacity Inc.

Singapore . 1,406 parts In-Stock

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Aztec Data Supply Inc.

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AZTECH Wire

Italy . 749 parts In-Stock

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Component Stockers USA

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Overview

Upgrade your electronics with the MM74HC273N latch flip-flop from Onsemi. Made with top-notch quality materials and cutting-edge technology, this product offers reliable performance and fast signal propagation for a wide range of applications. Whether you're working on a DIY project or a professional circuit design, this component delivers exceptional value, efficiency, and ease of use. Trust Onsemi's reputation for excellence and get ready to experience the advantages of the MM74HC273N in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the latch or flip-flop component.

Propagation Delay At Nominal Supply: 34 ns

The fast propagation delay allows for quick and efficient operation of the latch or flip-flop.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to integrate the latch or flip-flop into various electronic systems.

No. of Bits: 8

With 8 bits, this latch or flip-flop can handle a wide range of binary data, making it versatile for different applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a 5V supply voltage ensures compatibility with standard electronic systems.

Load Capacitance (CL): 50 pF

The low load capacitance allows for efficient energy consumption and reduces heat generation.

No. of Terminals: 20

With 20 terminals, this latch or flip-flop can easily connect to other components in a circuit.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line package style with shrink pitch design saves space and simplifies circuit board layout.

Maximum I (ol): 4 Amp

With a maximum output current of 4A, this latch or flip-flop can drive high-power loads.

Propagation Delay (tpd): 170 ns

The propagation delay of 170 ns ensures fast and reliable operation of the latch or flip-flop.

Maximum Operating Temperature: 85 °C

Operating up to 85°C makes this latch or flip-flop suitable for industrial environments with higher temperatures.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures precise timing control for data capture in the latch or flip-flop.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this latch or flip-flop can withstand cold environments.

Terminal Position: DUAL

The dual terminal position allows for easy connectivity and flexibility in circuit design.

Maximum Seated Height: 5.08 mm

The low seated height helps in compact and space-saving installation of the latch or flip-flop.

Width: 7.62 mm

The width of 7.62 mm ensures compatibility with standard electronic components and circuit board sizes.

Output Polarity: TRUE

The true output polarity simplifies signal interpretation and integration with other digital components.

Minimum Supply Voltage (Vsup): 2 V

Operating at a minimum supply voltage of 2V makes this latch or flip-flop energy-efficient.

Length: 26.075 mm

The length of 26.075 mm provides a compact form factor for easy integration into circuit designs.

Temperature Grade: INDUSTRIAL

Designed for use in industrial applications, this latch or flip-flop meets higher temperature and performance requirements.

Maximum Frequency At Nominal Supply: 21000000 Hz

With a maximum frequency of 21 MHz, this latch or flip-flop can handle high-speed data processing.

Technology: CMOS

The CMOS technology used in this latch or flip-flop offers low power consumption and high noise immunity.

Terminal Form: THROUGH-HOLE

The through-hole terminal form allows for secure and reliable solder connections in electronic circuits.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54 mm simplifies PCB layout and component placement.

Minimum fmax: 24 MHz

The minimum fmax of 24 MHz ensures stable operation at higher frequencies for data processing.

Maximum Supply Voltage (Vsup): 6 V

With a maximum supply voltage of 6V, this latch or flip-flop has a wide voltage range for flexibility in different applications.

Maximum Power Supply Current (ICC): 0.16 mA

The low power supply current of 0.16 mA helps in energy-efficient operation of the latch or flip-flop.

Technical Specifications

Latches & Flip-Flops MM74HC273N attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDIP-T20

Length:

26.075 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

21000000 Hz

Maximum I (ol):

4 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

34 ns

Propagation Delay (tpd):

170 ns

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

24 MHz

Trade Compliance

MM74HC273N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-229-4857, 5962012294857, 5962-99-372-3832, 5962993723832

NIIN

012294857, 993723832

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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