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74LVC1G80GW-Q100,125

NXP Semiconductors

74LVC1G80GW-Q100,125 by NXP Semiconductors

NXP Semiconductors' 74LVC1G80GW-Q100,125 is a CMOS latch with 13ns propagation delay and 200MHz fmax. AEC-Q100 screening makes it ideal for automotive applications. Operating temperature range from -40 to 125°C suits various automotive environments.

Median Price

$0.090

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 285,000 parts In-Stock

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Digiode

USA . 253 parts In-Stock

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Vyrian

USA . 284,946 parts In-Stock

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VNN

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Anansix

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Nova Conductors

Japan . 600 parts In-Stock

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Corphita

USA . 1,482 parts In-Stock

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Ampacity Inc.

Singapore . 284,587 parts In-Stock

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Corohmni

South Africa . 100 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,674 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Microchip USA

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Argo Parts USA

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Continental Prestige Electronics

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Overview

Unlock the potential of your automotive electronics with the 74LVC1G80GW-Q100,125 by NXP Semiconductors. This latches & flip-flops device offers high-quality performance and reliability, meeting AEC-Q100 standards for automotive applications. With a small outline, thin profile package and positive edge trigger type, this product is designed to provide fast propagation delay and inverted output polarity. Trust NXP Semiconductors to deliver cutting-edge technology that enhances the efficiency and functionality of your electronic systems. Elevate your automotive designs with the value and benefits of the 74LVC1G80GW-Q100,125 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for automotive applications where robustness is required.

Surface Mount: YES

The surface mount capability allows for easy and efficient integration onto PCBs, saving space and facilitating automated assembly.

Screening Level: AEC-Q100

This screening level ensures high reliability and quality standards, making the product suitable for automotive use where reliability is critical.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V offers compatibility with a wide range of systems and applications.

Propagation Delay (tpd): 13 ns

The low propagation delay of 13 ns ensures fast and efficient operation of the latch or flip-flop.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product can withstand harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Latches & Flip-Flops 74LVC1G80GW-Q100,125 attributes and parameters. Explore more Latches & Flip-Flops devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

Length:

2.05 mm

Logic IC Type:

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Propagation Delay (tpd):

13 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

1.25 mm

Minimum fmax:

200 MHz

Trade Compliance

74LVC1G80GW-Q100,125 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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