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SN74HC377DWRG4

Texas Instruments

SN74HC377DWRG4 by Texas Instruments

SN74HC377DWRG4 by Texas Instruments is an 8-bit latch with a supply voltage of 5V, operating temperature range of -40 to 85°C, and propagation delay of 200ns. It is used in industrial applications requiring positive edge triggering, with a max frequency of 20MHz and Gull Wing terminal form for surface mounting.

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Vyrian

USA . 4,702 parts In-Stock

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Digiode

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Rebound Electronics

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Ashlea Components Ltd

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PC Components Company LLC

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Bristol Electronics

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Nova Conductors

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Corohmni

South Africa . 85 parts In-Stock

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One Stop Electronics

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AZTECH Wire

Italy . 420 parts In-Stock

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Parana Technologies

USA . 1,353 parts In-Stock

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DigiPath Technology Company

USA . 582 parts In-Stock

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ChromeModa Solutions

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IDEA Electronic Components Group

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Ampacity Inc.

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Overview

Unleash the power of innovation with the SN74HC377DWRG4 by Texas Instruments. Crafted with precision and expertise, this latches & flip-flops device offers unparalleled performance and reliability. Ideal for a wide range of applications, it seamlessly integrates into your projects to deliver seamless functionality. With a focus on quality and excellence, Texas Instruments ensures that every product meets the highest standards, providing customers with exceptional value and benefits. Elevate your designs with the SN74HC377DWRG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability, making it a suitable choice for various applications.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

The rectangular shape fits well on PCBs, maximizing space efficiency and overall design flexibility.

No. of Bits: 8

With 8 bits, this latch offers versatility and capability to handle a wide range of data processing tasks.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures compatibility with standard power sources in many electronic systems.

Load Capacitance (CL): 50 pF

With a load capacitance of 50 pF, this latch can effectively drive external loads without sacrificing performance.

Power Supplies (V): 2/6

Supports a voltage range of 2V to 6V, providing flexibility for different power supply configurations.

No. of Terminals: 20

The 20 terminals allow for versatile connectivity options and integration with other components in the circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, enabling compact designs in electronic systems.

Maximum I (ol): 4 Amp

With a maximum output current of 4 Amp, this latch can drive larger loads with ease and reliability.

Propagation Delay (tpd): 200 ns

The low propagation delay of 200 ns ensures fast and efficient data processing in time-critical applications.

Maximum Operating Temperature: 85 °C

Operates reliably at temperatures up to 85°C, making it suitable for a wide range of industrial environments.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures accurate data capture and processing, enhancing system performance.

Minimum Operating Temperature: -40 °C

Functions effectively even in extreme cold temperatures, making it suitable for harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: DUAL

The dual terminal position offers flexibility in PCB layout and easy integration with other components.

Maximum Seated Height: 2.65 mm

The low seated height allows for compact and space-saving designs in electronic systems.

Width: 7.5 mm

The narrow width of 7.5 mm enables placement in tight spaces and compact PCB layouts.

Output Polarity: TRUE

The true output polarity ensures accurate data representation and compatibility with other components.

Minimum Supply Voltage (Vsup): 2 V

Can operate efficiently with a minimum supply voltage of 2V, allowing for flexibility in power source.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, it is easy to integrate during the soldering process with precise control.

Peak Reflow Temperature °C: 260

Can withstand peak reflow temperatures of 260°C, ensuring robust construction and reliability during manufacturing processes.

Length: 12.8 mm

The length of 12.8 mm allows for flexible placement on the PCB and compact integration into electronic systems.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, offering reliability and durability in harsh operating conditions.

Maximum Frequency At Nominal Supply: 20000000 Hz

Supports high-frequency operation up to 20MHz at nominal supply voltage, suitable for high-speed applications.

Technology: CMOS

Based on CMOS technology, offering low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

The gull-wing terminal form provides secure mounting and reliable connectivity during PCB assembly.

Packing Method: TR

Packed in tape and reel for easy handling and automated assembly, reducing installation time and costs.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm allows for precise and secure mounting on the PCB.

Minimum fmax: 23 MHz

With a minimum frequency of 23 MHz, it is capable of high-speed data processing in various applications.

Maximum Supply Voltage (Vsup): 6 V

Supports supply voltage up to 6V, providing flexibility and compatibility with different power sources.

Technical Specifications

Latches & Flip-Flops SN74HC377DWRG4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Additional Features:

WITH HOLD MODE

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

200 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Minimum fmax:

23 MHz

Trade Compliance

SN74HC377DWRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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