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SN74LS273N3

Texas Instruments

SN74LS273N3 by Texas Instruments

SN74LS273N3 by Texas Instruments is an 8-bit latch with a propagation delay of 27 ns, operating at a supply voltage of 5V. It features positive edge triggering and TTL technology, suitable for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,351 parts In-Stock

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Vyrian

USA . 1,049 parts In-Stock

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Nova Conductors

Japan . 38 parts In-Stock

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AZTECH Wire

Italy . 354 parts In-Stock

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$5.752

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Parana Technologies

USA . 776 parts In-Stock

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$20.743

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$20.882

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776

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DigiPath Technology Company

USA . 2,080 parts In-Stock

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$22.841

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$21.014

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$22.841

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IDEA Electronic Components Group

UK . 2,084 parts In-Stock

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$23.307

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$22.142

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$20.976

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2,084

$23.307

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ChromeModa Solutions

Germany . 1,972 parts In-Stock

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$23.307

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$19.112

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One Stop Electronics

USA . 1,624 parts In-Stock

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$51.000

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Corphita

USA . 4,343 parts In-Stock

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Argo Parts USA

USA . 4,289 parts In-Stock

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Continental Prestige Electronics

USA . 2,674 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Overview

Enhance your electronic projects with the SN74LS273N3 from Texas Instruments, a reliable and high-quality manufacturer. This versatile latch & flip-flop component offers seamless integration into a wide range of applications, providing ease of use and efficiency. With its durable plastic/epoxy package body and efficient design, this product ensures optimal performance at a nominal supply voltage of 5V. Trust in Texas Instruments for superior quality and experience the value and benefits that the SN74LS273N3 brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

No. of Bits: 8

With 8 bits, this latch and flip-flop can handle a reasonable amount of data, making it versatile for different functions.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes it compatible with a wide range of systems and power sources.

Propagation Delay (tpd): 27 ns

The low propagation delay ensures fast response times, making it suitable for applications where speed is critical.

Trigger Type: POSITIVE EDGE

The positive edge trigger type helps in precise and accurate triggering of the latch or flip-flop, ensuring reliable performance.

Technology: TTL

Using TTL technology ensures compatibility with other TTL devices and systems, enhancing overall system integration.

Technical Specifications

Latches & Flip-Flops SN74LS273N3 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-PDIP-T20

Length:

24.325 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

27 mA

Propagation Delay (tpd):

27 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

30 MHz

Trade Compliance

SN74LS273N3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-102-0627, 5962011020627

NIIN

011020627

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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