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CD4013BCN

Texas Instruments

CD4013BCN by Texas Instruments

CD4013BCN by Texas Instruments is a CMOS latches & flip-flops IC with 2 functions, Vsup range of 3-15V, and tpd of 350ns. Widely used in industrial applications for positive edge triggering due to its compact IN-LINE package style and dual terminal position.

Median Price

$1.050

Lifecycle Status

Suppliers In-Stock

60

In-Stock Inventory

1k+

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Nova Conductors

Japan . 41 parts In-Stock

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$0.144

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TEDSS.com

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$0.600

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DF Sales Co.

USA . 25 parts In-Stock

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Forefront Electronics and Design

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Component Electronics Inc.

Canada . 58 parts In-Stock

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American Microsemiconductor Inc.

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Inland Empire Components Inc.

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LIBRA Elektronik GmbH

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Continental Prestige Electronics

USA . 1,060 parts In-Stock

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$0.144

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$0.141

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Argo Parts USA

USA . 433 parts In-Stock

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$0.140

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Netroflash

USA . 50 parts In-Stock

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$0.141

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AZTECH Wire

Italy . 747 parts In-Stock

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Semicontronic

India . 1,554 parts In-Stock

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$26.000

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$25.350

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$25.220

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Ampacity Inc.

Singapore . 544 parts In-Stock

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$26.000

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Parana Technologies

USA . 1,506 parts In-Stock

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$27.815

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$40.321

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Aztec Data Supply Inc.

USA . 1,140 parts In-Stock

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$29.065

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DigiPath Technology Company

USA . 2,066 parts In-Stock

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$30.628

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ChromeModa Solutions

Germany . 5,930 parts In-Stock

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$31.253

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$25.627

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IDEA Electronic Components Group

UK . 1,171 parts In-Stock

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$31.253

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$29.690

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$28.128

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One Stop Electronics

USA . 405 parts In-Stock

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$41.000

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Component Stockers USA

USA . 736 parts In-Stock

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$99.990

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Lixinc

USA . 13,621 parts In-Stock

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Microchip USA

USA . 7,928 parts In-Stock

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Authorized Procurement Solutions

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Glotronic Ltd.

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QUARKTWIN TECHNOLOGY LTD

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Montclair Electronics, Inc.

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Overview

Upgrade your electronic projects with the CD4013BCN by Texas Instruments. With a focus on quality and reliability, Texas Instruments is a trusted manufacturer in the industry. This latch & flip-flop device offers dual functions in a convenient rectangular package. Ideal for industrial applications, this product boasts a nominal supply voltage of 5V and a propagation delay of 350 ns, ensuring efficient performance. Ensure your projects run smoothly with the CD4013BCN from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability for long-term use.

No. of Functions: 2

With 2 functions in one device, it provides versatility and efficiency in circuit design.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into various electronic systems.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes this latch compatible with many existing systems.

No. of Terminals: 14

The ample number of terminals allows for multiple connections and flexible wiring options.

Package Style (Meter): IN-LINE

The in-line package style saves space and simplifies PCB layout.

Propagation Delay (tpd): 350 ns

With a low propagation delay, this latch ensures fast response times in signal processing.

Maximum Operating Temperature: 85 °C

Able to withstand high temperatures, making it suitable for industrial applications.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures precise control and reliable operation.

Minimum Operating Temperature: -40 °C

Can operate in low temperatures, making it suitable for a wide range of environments.

Terminal Position: DUAL

Dual terminal positions provide flexibility in installation and connection options.

Maximum Seated Height: 5.08 mm

The compact size allows for easy integration in space-constrained designs.

Width: 7.62 mm

The narrow width enables easy placement on a PCB without taking up too much space.

Output Polarity: COMPLEMENTARY

The complementary output polarity simplifies signal processing in circuits.

Minimum Supply Voltage (Vsup): 3 V

Operating at low supply voltage levels makes this latch energy-efficient.

Length: 19.18 mm

The moderate length provides a good balance between compactness and functionality.

Temperature Grade: INDUSTRIAL

Designed for industrial use, ensuring reliability even in harsh environments.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer secure connections and ease of soldering.

Terminal Pitch: 2.54 mm

The standard terminal pitch allows for compatibility with common connectors.

Minimum fmax: 7.6 MHz

With a high minimum fmax, this latch is suitable for high-speed applications.

Maximum Supply Voltage (Vsup): 15 V

Able to handle higher supply voltages, increasing its versatility in different systems.

Technical Specifications

Latches & Flip-Flops CD4013BCN attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T14

Length:

19.18 mm

Logic IC Type:

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

350 ns

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

7.6 MHz

Trade Compliance

CD4013BCN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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