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74LVC2G74GN

NXP Semiconductors

74LVC2G74GN by NXP Semiconductors

NXP Semiconductors' 74LVC2G74GN is a CMOS latch with positive edge trigger. It operates b/w -40 to 125 °C, with Vsup ranging from 1.65V to 5.5V. With a propagation delay of 13.4ns and max fmax of 200MHz, it's ideal for automotive applications requiring fast signal processing in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,697 parts In-Stock

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Digiode

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Anansix

USA . 1,893 parts In-Stock

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VNN

France . 58 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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AZTECH Wire

Italy . 12,175 parts In-Stock

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$15.983

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Ampacity Inc.

Singapore . 630 parts In-Stock

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One Stop Electronics

USA . 550 parts In-Stock

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$39.000

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Continental Prestige Electronics

USA . 6,254 parts In-Stock

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UNI Independent Distributors

Spain . 4,668 parts In-Stock

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Argo Parts USA

USA . 4,072 parts In-Stock

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Supply Digital

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Corphita

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Perfect Parts

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Bastille Electronics

Australia . 74 parts In-Stock

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Overview

Unlock the potential of your electronic projects with the high-quality 74LVC2G74GN by NXP Semiconductors. This versatile latch & flip-flop component offers reliable performance and efficiency, making it a top choice for a wide range of applications. With a compact design and superior technology, this product ensures seamless integration into your projects while delivering exceptional value and benefits. Trust NXP Semiconductors to provide you with innovative solutions that meet your needs and exceed your expectations. Elevate your designs with the 74LVC2G74GN and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the latch or flip-flop.

Surface Mount: YES

Being surface mountable makes it easier to integrate this latch or flip-flop into electronic circuits, saving space and simplifying manufacturing processes.

Nominal Supply Voltage / Vsup (V): 1.8

The low nominal supply voltage of 1.8V makes this latch or flip-flop energy efficient and suitable for low power applications.

Propagation Delay (tpd): 13.4 ns

The fast propagation delay of 13.4 ns ensures quick response times for signal transitions, making this latch or flip-flop ideal for applications requiring high-speed operation.

Trigger Type: POSITIVE EDGE

The positive edge trigger type allows for precise control over when the latch or flip-flop changes state, ensuring accurate data capture and synchronization.

Technology: CMOS

The CMOS technology used in this latch or flip-flop offers low power consumption, high noise immunity, and wide operating voltage range, making it versatile and reliable for various applications.

Technical Specifications

Latches & Flip-Flops 74LVC2G74GN attributes and parameters. Explore more Latches & Flip-Flops devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Length:

1.2 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Propagation Delay (tpd):

13.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

.35 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.3 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

1 mm

Minimum fmax:

200 MHz

Trade Compliance

74LVC2G74GN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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