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74LVC1G175GW-Q100,125

NXP Semiconductors

74LVC1G175GW-Q100,125 by NXP Semiconductors

NXP Semiconductors' 74LVC1G175GW-Q100,125 is a CMOS latch with positive edge trigger. It operates at temperatures from -40 to 125°C and has a propagation delay of 17ns. This small outline flip-flop is ideal for automotive applications due to its AEC-Q100 screening level.

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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Chip Stock

USA . 115,000 parts In-Stock

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Vyrian

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Digiode

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Anansix

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Nova Conductors

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AZTECH Wire

Italy . 890 parts In-Stock

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Microchip USA

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Semicontronic

India . 148 parts In-Stock

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Corohmni

South Africa . 800 parts In-Stock

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Ampacity Inc.

Singapore . 590 parts In-Stock

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One Stop Electronics

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Continental Prestige Electronics

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Corphita

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Argo Parts USA

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Overview

Discover the exceptional quality and reliability of the 74LVC1G175GW-Q100,125 by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-notch latches & flip-flops that are perfect for automotive applications. With a fast propagation delay of 17 ns and a wide operating temperature range, this product offers unmatched performance and durability. Trust NXP to provide innovative solutions that meet your needs and exceed your expectations. Choose the 74LVC1G175GW-Q100,125 for superior results in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and good insulation, making the product suitable for various environmental conditions.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, saving space and simplifying assembly.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and quality, ensuring dependable performance in automotive applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a commonly used voltage level, compatible with many other components in electronic systems.

Propagation Delay (tpd): 17 ns

Provides fast response times for signal processing, enhancing the overall efficiency of the product.

Trigger Type: POSITIVE EDGE

Allows for precise timing control and synchronization of signals, essential for proper signal processing and communication.

Temperature Grade: AUTOMOTIVE

Suitable for use in automotive applications, designed to withstand temperature variations and harsh operating conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption, extending battery life and reducing heat generation.

Technical Specifications

Latches & Flip-Flops 74LVC1G175GW-Q100,125 attributes and parameters. Explore more Latches & Flip-Flops devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

Length:

2 mm

Logic IC Type:

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Propagation Delay (tpd):

17 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

1.25 mm

Minimum fmax:

200 MHz

Trade Compliance

74LVC1G175GW-Q100,125 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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