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74LVC1G175GW,125

NXP Semiconductors

74LVC1G175GW,125 by NXP Semiconductors

NXP Semiconductors' 74LVC1G175GW,125 is a CMOS latch with 7.5ns propagation delay and 175MHz max frequency. Ideal for automotive applications, it operates at -40 to 125°C with a supply voltage range of 1.65-5.5V, featuring a small outline package and dual terminals for compact designs.

Median Price

$0.055

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Newark

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Chip1Stop

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Future Electronics

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Arrow

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Verical

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Rochester

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Digiode

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TME

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Nova Conductors

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Chip Stock

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IBS Electronics

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NAC Semi

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Semicontronic

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Corphita

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Component Stockers USA

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Ampacity Inc.

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Argo Parts USA

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Aranea Global

USA . 50 parts In-Stock

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Corohmni

South Africa . 483 parts In-Stock

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Aztec Data Supply Inc.

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Advanced Electronics

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Brazil . 461 parts In-Stock

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Lucentia Tech

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Overview

Upgrade your electronics with the NXP Semiconductors 74LVC1G175GW,125 latch flip-flop. Designed with precision and reliability in mind, this small outline component offers rapid signal processing with a propagation delay of just 7.5 ns. Perfect for automotive applications, this versatile product provides true output polarity and a wide operating temperature range from -40°C to 125°C. With NXP Semiconductors' reputation for cutting-edge technology and innovation, you can trust that this latch flip-flop will enhance the performance of your devices while offering exceptional value and efficiency. Elevate your projects with the 74LVC1G175GW,125 today.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and reliability for long-term use.

Propagation Delay At Nominal Supply:

7.5 ns - Low propagation delay ensures fast response times for efficient operation.

Surface Mount:

YES - Allows for easy and convenient installation on circuit boards.

Package Shape:

RECTANGULAR - Helps in efficient space utilization on the circuit board.

Nominal Supply Voltage / Vsup (V):

1.8 - Operates at a low supply voltage for energy efficiency.

Load Capacitance (CL):

50 pF - Ideal for applications requiring a specific load capacitance.

Power Supplies (V):

3.3 - Compatible with standard power supplies for easy integration.

No. of Terminals:

6 - Provides multiple connection points for versatile applications.

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - Compact design for space-constrained applications.

Maximum I (ol):

24 Amp - Can handle high output currents for robust performance.

Propagation Delay (tpd):

17 ns - Low propagation delay ensures fast signal processing.

Maximum Operating Temperature:

125 °C - Can withstand high temperatures for reliable operation in harsh environments.

Trigger Type:

POSITIVE EDGE - Suitable for applications requiring a positive-edge trigger.

Minimum Operating Temperature:

40 °C - Can operate in extreme cold conditions without any issues.

Terminal Finish:

Tin (Sn) - Provides reliable electrical connections with good conductivity.

Terminal Position:

DUAL - Offers flexibility in mounting orientation for ease of installation.

Maximum Seated Height:

1.1 mm - Low profile design for compact applications.

Width:

1.25 mm - Slim width for efficient space utilization on the circuit board.

Output Polarity:

TRUE - Ensures correct output polarity for compatibility with other components.

Minimum Supply Voltage (Vsup):

1.65 V - Can operate at low supply voltages for energy efficiency.

Maximum Time At Peak Reflow Temperature (s):

30 - Can withstand peak reflow temperatures for soldering without damage.

Peak Reflow Temperature °C:

260 - Suitable for high-temperature soldering processes.

Length:

2 mm - Compact length for space-saving installation.

Temperature Grade:

AUTOMOTIVE - Meets automotive industry standards for reliable performance in vehicles.

Maximum Frequency At Nominal Supply:

175000000 Hz - Supports high-frequency operations for fast signal processing.

Technology:

CMOS - Utilizes CMOS technology for efficient power consumption and high performance.

Terminal Form:

GULL WING - Terminal form that facilitates easy soldering and assembly.

Packing Method:

TR - Packaged in Tape and Reel format for efficient storage and handling.

Terminal Pitch:

0.65 mm - Terminal pitch for compatible connections with standard PCB layouts.

Minimum fmax:

200 MHz - Minimum maximum frequency for high-speed applications.

Maximum Supply Voltage (Vsup):

5.5 V - Can operate at high supply voltages for flexibility in power requirements.

Technical Specifications

Latches & Flip-Flops 74LVC1G175GW,125 attributes and parameters. Explore more Latches & Flip-Flops devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

175000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

7.5 ns

Propagation Delay (tpd):

17 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

1.25 mm

Minimum fmax:

200 MHz

Trade Compliance

74LVC1G175GW,125 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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