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CD74ACT273PWRG4

Texas Instruments

CD74ACT273PWRG4 by Texas Instruments

CD74ACT273PWRG4 by Texas Instruments is an 8-bit latches & flip-flops IC with a propagation delay of 13.5 ns at 5V, suitable for military-grade applications. It features a max frequency of 85 MHz, operates within a temperature range of -55 to 125°C, and has a compact small outline package style for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 16,570 parts In-Stock

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Vyrian

USA . 4,994 parts In-Stock

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Digiode

USA . 1,091 parts In-Stock

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Nova Conductors

Japan . 97 parts In-Stock

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Ampacity Inc.

Singapore . 1,067 parts In-Stock

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$4.000

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1,067

$4.000

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AZTECH Wire

Italy . 387 parts In-Stock

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$7.166

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Corohmni

South Africa . 62 parts In-Stock

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$23.761

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Semicontronic

India . 777 parts In-Stock

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$26.000

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$25.350

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$25.220

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777

$26.000

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$25.220

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Parana Technologies

USA . 2,138 parts In-Stock

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$29.028

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$54.566

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DigiPath Technology Company

USA . 1,607 parts In-Stock

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$31.964

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$31.964

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ChromeModa Solutions

Germany . 3,279 parts In-Stock

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$32.616

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$26.745

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IDEA Electronic Components Group

UK . 1,792 parts In-Stock

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$32.616

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$30.985

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$29.354

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One Stop Electronics

USA . 1,224 parts In-Stock

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$37.000

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iodParts Technologies Inc.

India . 24,000 parts In-Stock

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Continental Prestige Electronics

USA . 5,004 parts In-Stock

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Argo Parts USA

USA . 4,021 parts In-Stock

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Corphita

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Robosynatics

Brazil . 300 parts In-Stock

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Lucentia Tech

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Elevate your projects to the next level with the CD74ACT273PWRG4 by Texas Instruments, a high-quality latch & flip-flop component designed for reliability and performance. With a reputation for excellence in semiconductor manufacturing, Texas Instruments delivers cutting-edge technology that meets the demands of various applications. This versatile product offers customers exceptional value, efficiency, and functionality. Upgrade your designs with the CD74ACT273PWRG4 and experience superior results like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that can withstand various environmental conditions.

Propagation Delay At Nominal Supply: 13.5 ns

Fast response time for efficient operation.

Surface Mount: YES

Easy to install and saves space on PCB.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage for compatibility with many systems.

Maximum Frequency At Nominal Supply: 85000000 Hz

High frequency capability for rapid processing.

Temperature Grade: MILITARY

Suitable for use in rugged military applications.

Technology: CMOS

Low power consumption and high noise immunity.

Terminal Form: GULL WING

Easy to solder and secure connection.

Technical Specifications

Latches & Flip-Flops CD74ACT273PWRG4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

ACT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

85000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

13.5 ns

Propagation Delay (tpd):

13.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

85 MHz

Trade Compliance

CD74ACT273PWRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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